Download or read book Ultra Thin Sensors and Data Conversion Techniques for Hybrid System in Foil written by Mourad Elsobky and published by Springer Nature. This book was released on 2022-03-18 with total page 153 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book reports on the design, fabrication and characterization of a set of flexible electronic components, including on-foil sensors, organic thin-film transistors and ultra-thin chips. The core of the work is on showing how to combine high-performance integrated circuits with large-area electronic components on a single polymeric foil, to realize smart electronic systems for different applications, such as temperature, humidity and mechanical stress sensors. The book offers an extensive introduction to Hybrid System-in-Foil technology (HySiF), and related on-chip/on-foil passive and active components. It presents six case studies designed to highlight key HySiF challenges, together with the methodology to address those challenges. Last but not least, it describes the development of a reconfigurable, energy-efficient Analog-to-Digital Converter for HySiF. All in all, this book provides readers with extensive information on the state of the art in the design and characterization of integrated circuits and hybrid electronic systems on flexible polymeric substrates. By describing significant advances in organic thin-film transistor technology, this work is expected to pave the way to future developments in the area of energy-efficient smart sensors and integrated circuits.
Download or read book Ultra Thin Chip Embedding and Interconnect Technology for System in Foil Applications written by Mahadi-Ul Hassan and published by . This book was released on 2017 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Ultra thin Chip Technology and Applications written by Joachim Burghartz and published by Springer Science & Business Media. This book was released on 2010-11-18 with total page 471 pages. Available in PDF, EPUB and Kindle. Book excerpt: Ultra-thin chips are the "smart skin" of a conventional silicon chip. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, Microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, characterization and the applications of ultra-thin chips.
Download or read book Hybrid Systems in Foil written by Mourad Elsobky and published by Cambridge University Press. This book was released on 2021-10-14 with total page 92 pages. Available in PDF, EPUB and Kindle. Book excerpt: Hybrid Systems-in-Foil (HySiF) is a concept that extends the potential of conventional More-than-More Systems-in/on-Package (SiPs and SoPs) to the flexible electronics world. In HySiF, an economical implementation of flexible electronic systems is possible by integrating a minimum number of embedded silicon chips and a maximum number of on-foil components. Here, the complementary characteristics of CMOS SoCs and larger area organic and printed electronics are combined in a HySiF-compatible polymeric substrate. Within the HySiF scope, the fabrication process steps and the integration design rules with all the accompanying boundary conditions concerning material compatibility, surface properties, and thermal budget, are defined. This Element serves as an introduction to the HySiF concept. A summary of recent ultra-thin chip fabrication and flexible packaging techniques is provided. Several bendable electronic components are presented demonstrating the benefits of HySiF. Finally, prototypes of flexible wireless sensor systems that adopt the HySiF concept are demonstrated.
Download or read book Heterogeneous Integrations written by John H. Lau and published by Springer. This book was released on 2019-04-03 with total page 381 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
Download or read book Electronic Enclosures Housings and Packages written by Frank Suli and published by Woodhead Publishing. This book was released on 2018-11-01 with total page 490 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions.
Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Download or read book Handbook of Neuroengineering written by Nitish V. Thakor and published by Springer Nature. This book was released on 2023-02-02 with total page 3686 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Handbook serves as an authoritative reference book in the field of Neuroengineering. Neuroengineering is a very exciting field that is rapidly getting established as core subject matter for research and education. The Neuroengineering field has also produced an impressive array of industry products and clinical applications. It also serves as a reference book for graduate students, research scholars and teachers. Selected sections or a compendium of chapters may be used as “reference book” for a one or two semester graduate course in Biomedical Engineering. Some academicians will construct a “textbook” out of selected sections or chapters. The Handbook is also meant as a state-of-the-art volume for researchers. Due to its comprehensive coverage, researchers in one field covered by a certain section of the Handbook would find other sections valuable sources of cross-reference for information and fertilization of interdisciplinary ideas. Industry researchers as well as clinicians using neurotechnologies will find the Handbook a single source for foundation and state-of-the-art applications in the field of Neuroengineering. Regulatory agencies, entrepreneurs, investors and legal experts can use the Handbook as a reference for their professional work as well.
Download or read book Semiconductor Packaging written by Andrea Chen and published by CRC Press. This book was released on 2016-04-19 with total page 208 pages. Available in PDF, EPUB and Kindle. Book excerpt: In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
Download or read book Semiconductor Gas Sensors written by Raivo Jaaniso and published by Woodhead Publishing. This book was released on 2019-09-24 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt: Semiconductor Gas Sensors, Second Edition, summarizes recent research on basic principles, new materials and emerging technologies in this essential field. Chapters cover the foundation of the underlying principles and sensing mechanisms of gas sensors, include expanded content on gas sensing characteristics, such as response, sensitivity and cross-sensitivity, present an overview of the nanomaterials utilized for gas sensing, and review the latest applications for semiconductor gas sensors, including environmental monitoring, indoor monitoring, medical applications, CMOS integration and chemical warfare agents. This second edition has been completely updated, thus ensuring it reflects current literature and the latest materials systems and applications. - Includes an overview of key applications, with new chapters on indoor monitoring and medical applications - Reviews developments in gas sensors and sensing methods, including an expanded section on gas sensor theory - Discusses the use of nanomaterials in gas sensing, with new chapters on single-layer graphene sensors, graphene oxide sensors, printed sensors, and much more
Download or read book Embedded Systems Architecture written by Tammy Noergaard and published by Newnes. This book was released on 2012-12-31 with total page 670 pages. Available in PDF, EPUB and Kindle. Book excerpt: Embedded Systems Architecture is a practical and technical guide to understanding the components that make up an embedded system's architecture. This book is perfect for those starting out as technical professionals such as engineers, programmers and designers of embedded systems; and also for students of computer science, computer engineering and electrical engineering. It gives a much-needed 'big picture' for recently graduated engineers grappling with understanding the design of real-world systems for the first time, and provides professionals with a systems-level picture of the key elements that can go into an embedded design, providing a firm foundation on which to build their skills. - Real-world approach to the fundamentals, as well as the design and architecture process, makes this book a popular reference for the daunted or the inexperienced: if in doubt, the answer is in here! - Fully updated with new coverage of FPGAs, testing, middleware and the latest programming techniques in C, plus complete source code and sample code, reference designs and tools online make this the complete package - Visit the companion web site at http://booksite.elsevier.com/9780123821966/ for source code, design examples, data sheets and more - A true introductory book, provides a comprehensive get up and running reference for those new to the field, and updating skills: assumes no prior knowledge beyond undergrad level electrical engineering - Addresses the needs of practicing engineers, enabling it to get to the point more directly, and cover more ground. Covers hardware, software and middleware in a single volume - Includes a library of design examples and design tools, plus a complete set of source code and embedded systems design tutorial materials from companion website
Download or read book Digital Electronics written by Anil K. Maini and published by John Wiley & Sons. This book was released on 2007-09-27 with total page 752 pages. Available in PDF, EPUB and Kindle. Book excerpt: The fundamentals and implementation of digital electronics are essential to understanding the design and working of consumer/industrial electronics, communications, embedded systems, computers, security and military equipment. Devices used in applications such as these are constantly decreasing in size and employing more complex technology. It is therefore essential for engineers and students to understand the fundamentals, implementation and application principles of digital electronics, devices and integrated circuits. This is so that they can use the most appropriate and effective technique to suit their technical need. This book provides practical and comprehensive coverage of digital electronics, bringing together information on fundamental theory, operational aspects and potential applications. With worked problems, examples, and review questions for each chapter, Digital Electronics includes: information on number systems, binary codes, digital arithmetic, logic gates and families, and Boolean algebra; an in-depth look at multiplexers, de-multiplexers, devices for arithmetic operations, flip-flops and related devices, counters and registers, and data conversion circuits; up-to-date coverage of recent application fields, such as programmable logic devices, microprocessors, microcontrollers, digital troubleshooting and digital instrumentation. A comprehensive, must-read book on digital electronics for senior undergraduate and graduate students of electrical, electronics and computer engineering, and a valuable reference book for professionals and researchers.
Download or read book Semiconductor Memories written by Ashok K. Sharma and published by Wiley-IEEE Press. This book was released on 2002-09-10 with total page 480 pages. Available in PDF, EPUB and Kindle. Book excerpt: Semiconductor Memories provides in-depth coverage in the areas of design for testing, fault tolerance, failure modes and mechanisms, and screening and qualification methods including. * Memory cell structures and fabrication technologies. * Application-specific memories and architectures. * Memory design, fault modeling and test algorithms, limitations, and trade-offs. * Space environment, radiation hardening process and design techniques, and radiation testing. * Memory stacks and multichip modules for gigabyte storage.
Download or read book Stretchable Systems written by Yogeenth Kumaresan and published by Cambridge University Press. This book was released on 2022-01-27 with total page 124 pages. Available in PDF, EPUB and Kindle. Book excerpt: Stretchable electronics is one of the transformative pillars of future flexible electronics. As a result, the research on new passive and active materials, novel designs, and engineering approaches has attracted significant interest. Recent studies have highlighted the importance of new approaches that enable the integration of high-performance materials, including, organic and inorganic compounds, carbon-based and layered materials, and composites to serve as conductors, semiconductors or insulators, with the ability to accommodate electronics on stretchable substrates. This Element presents a discussion about the strategies that have been developed for obtaining stretchable systems, with a focus on various stretchable geometries to achieve strain invariant electrical response, and summarises the recent advances in terms of material research, various integration techniques of high-performance electronics. In addition, some of the applications, challenges and opportunities associated with the development of stretchable electronics are discussed.
Download or read book Springer Handbook of Experimental Solid Mechanics written by William N. Sharpe, Jr. and published by Springer Science & Business Media. This book was released on 2008-12-04 with total page 1100 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Springer Handbook of Experimental Solid Mechanics documents both the traditional techniques as well as the new methods for experimental studies of materials, components, and structures. The emergence of new materials and new disciplines, together with the escalating use of on- and off-line computers for rapid data processing and the combined use of experimental and numerical techniques have greatly expanded the capabilities of experimental mechanics. New exciting topics are included on biological materials, MEMS and NEMS, nanoindentation, digital photomechanics, photoacoustic characterization, and atomic force microscopy in experimental solid mechanics. Presenting complete instructions to various areas of experimental solid mechanics, guidance to detailed expositions in important references, and a description of state-of-the-art applications in important technical areas, this thoroughly revised and updated edition is an excellent reference to a widespread academic, industrial, and professional engineering audience.
Download or read book Industrial System Engineering for Drones written by Neeraj Kumar Singh and published by Apress. This book was released on 2019-07-15 with total page 268 pages. Available in PDF, EPUB and Kindle. Book excerpt: Explore a complex mechanical system where electronics and mechanical engineers work together as a cross-functional team. Using a working example, this book is a practical “how to” guide to designing a drone system. As system design becomes more and more complicated, systematic, and organized, there is an increasingly large gap in how system design happens in the industry versus what is taught in academia. While the system design basics and fundamentals mostly remain the same, the process, flow, considerations, and tools applied in industry are far different than that in academia. Designing Drone Systems takes you through the entire flow from system conception to design to production, bridging the knowledge gap between academia and the industry as you build your own drone systems. What You’ll LearnGain a high level understanding of drone systems Design a drone systems and elaborating the various aspects and considerations of design Review the principles of the industrial system design process/flow, and the guidelines for drone systems Look at the challenges, limitations, best practices, and patterns of system design Who This Book Is For Primarily for beginning or aspiring system design experts, recent graduates, and system design engineers. Teachers, trainers, and system design mentors can also benefit from this content.
Download or read book Advances in Embedded and Fan Out Wafer Level Packaging Technologies written by Beth Keser and published by John Wiley & Sons. This book was released on 2019-02-12 with total page 576 pages. Available in PDF, EPUB and Kindle. Book excerpt: Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.
