Download or read book 2023 24th International Conference on Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE written by and published by . This book was released on 2023 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Reliability of Organic Compounds in Microelectronics and Optoelectronics written by Willem Dirk van Driel and published by Springer Nature. This book was released on 2022-01-31 with total page 552 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book aims to provide a comprehensive reference into the critical subject of failure and degradation in organic materials, used in optoelectronics and microelectronics systems and devices. Readers in different industrial sectors, including microelectronics, automotive, lighting, oil/gas, and petrochemical will benefit from this book. Several case studies and examples are discussed, which readers will find useful to assess and mitigate similar failure cases. More importantly, this book presents methodologies and useful approaches in analyzing a failure and in relating a failure to the reliability of materials and systems.
Download or read book Thermal and Electro thermal System Simulation 2020 written by Márta Rencz and published by MDPI. This book was released on 2021-01-12 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.
Download or read book Molecular Modeling and Multiscaling Issues for Electronic Material Applications written by Artur Wymyslowski and published by Springer. This book was released on 2014-11-20 with total page 203 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book offers readers a snapshot of the progression of molecular modeling in the electronics industry and how molecular modeling is currently being used to understand materials to solve relevant issues in this field. The reader is introduced to the evolving role of molecular modeling, especially seen from the perspective of the IEEE community and modeling in electronics. This book also covers the aspects of molecular modeling needed to understand the relationship between structures and mechanical performance of materials. The authors also discuss the transitional topic of multiscale modeling and recent developments on the atomistic scale and current attempts to reach the submicron scale, as well as the role that quantum mechanics can play in performance prediction.
Download or read book Advanced Computational Methods and Experiments in Heat Transfer X written by Bengt Sundén and published by WIT Press. This book was released on 2008-06-19 with total page 241 pages. Available in PDF, EPUB and Kindle. Book excerpt: In engineering design and development, reliable and accurate computational methods are requested to replace or complement expensive and time consuming experimental trial and error work. Tremendous advancements have been achieved during recent years due to improved numerical solutions of non-linear partial differential equations and computer developments to achieve efficient and rapid calculations. Nevertheless, to further progress in computational methods will require developments in theoretical and predictive procedures – both basic and innovative – and in applied research. Accurate experimental investigations are needed to validate the numerical calculations. This book contains the edited versions of the papers presented at the Tenth International Conference on Advanced Computational Methods and Experimental Measurements in Heat Transfer and Mass Transfer held in Maribor, Slovenia in July 2008. The objective of this conference series is to provide a forum for presentation and discussion of advanced topics, new approaches and application of advanced computational methods and experimental measurements to heat and mass transfer problems. The contributed papers are grouped in the following appropriate sections to provide better access for readers: Natural and forced convection; Heat exchangers; Advances in computational methods; Heat recovery; Heat transfer; Modelling and experiments.
Download or read book 2020 21st International Conference on Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE written by and published by . This book was released on 2020 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Experimental and Applied Mechanics Volume 6 written by Tom Proulx and published by Springer Science & Business Media. This book was released on 2011-06-01 with total page 859 pages. Available in PDF, EPUB and Kindle. Book excerpt: This the sixth volume of six from the Annual Conference of the Society for Experimental Mechanics, 2010, brings together 128 chapters on Experimental and Applied Mechanics. It presents early findings from experimental and computational investigations including High Accuracy Optical Measurements of Surface Topography, Elastic Properties of Living Cells, Standards for Validating Stress Analyses by Integrating Simulation and Experimentation, Efficiency Enhancement of Dye-sensitized Solar Cell, and Blast Performance of Sandwich Composites With Functionally Graded Core.
Download or read book Mechanics of Microsystems written by Alberto Corigliano and published by John Wiley & Sons. This book was released on 2018-04-02 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt: Mechanics of Microsystems Alberto Corigliano, Raffaele Ardito, Claudia Comi, Attilio Frangi, Aldo Ghisi and Stefano Mariani, Politecnico di Milano, Italy A mechanical approach to microsystems, covering fundamental concepts including MEMS design, modelling and reliability Mechanics of Microsystems takes a mechanical approach to microsystems and covers fundamental concepts including MEMS design, modelling and reliability. The book examines the mechanical behaviour of microsystems from a ‘design for reliability’ point of view and includes examples of applications in industry. Mechanics of Microsystems is divided into two main parts. The first part recalls basic knowledge related to the microsystems behaviour and offers an overview on microsystems and fundamental design and modelling tools from a mechanical point of view, together with many practical examples of real microsystems. The second part covers the mechanical characterization of materials at the micro-scale and considers the most important reliability issues (fracture, fatigue, stiction, damping phenomena, etc) which are fundamental to fabricate a real working device. Key features: Provides an overview of MEMS, with special focus on mechanical-based Microsystems and reliability issues. Includes examples of applications in industry. Accompanied by a website hosting supplementary material. The book provides essential reading for researchers and practitioners working with MEMS, as well as graduate students in mechanical, materials and electrical engineering.
Download or read book Physical Assurance written by Navid Asadizanjani and published by Springer Nature. This book was released on 2021-02-15 with total page 193 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides readers with a comprehensive introduction to physical inspection-based approaches for electronics security. The authors explain the principles of physical inspection techniques including invasive, non-invasive and semi-invasive approaches and how they can be used for hardware assurance, from IC to PCB level. Coverage includes a wide variety of topics, from failure analysis and imaging, to testing, machine learning and automation, reverse engineering and attacks, and countermeasures.
Download or read book Fast Simulation of Electro Thermal MEMS written by Tamara Bechtold and published by Springer Science & Business Media. This book was released on 2006-11-01 with total page 185 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides the reader with a complete methodology and software environment for creating efficient dynamic compact models for electro-thermal MEMS devices. It supplies the basic knowledge and understanding for using model order reduction at the engineering level. This tutorial is written for MEMS engineers and is enriched with many case studies which equip readers with the know-how to facilitate the simulation of a specific problem.
Download or read book Advanced RF MEMS written by Stepan Lucyszyn and published by Cambridge University Press. This book was released on 2010-08-19 with total page 441 pages. Available in PDF, EPUB and Kindle. Book excerpt: An up-to-date guide to the theory and applications of RF MEMS. With detailed information about RF MEMS technology as well as its reliability and applications, this is a comprehensive resource for professionals, researchers, and students alike. • Reviews RF MEMS technologies • Illustrates new techniques that solve long-standing problems associated with reliability and packaging • Provides the information needed to incorporate RF MEMS into commercial products • Describes current and future trends in RF MEMS, providing perspective on industry growth • Ideal for those studying or working in RF and microwave circuits, systems, microfabrication and manufacturing, production management and metrology, and performance evaluation
Download or read book Prognostics and Health Management of Electronics written by Michael G. Pecht and published by John Wiley & Sons. This book was released on 2018-08-15 with total page 809 pages. Available in PDF, EPUB and Kindle. Book excerpt: An indispensable guide for engineers and data scientists in design, testing, operation, manufacturing, and maintenance A road map to the current challenges and available opportunities for the research and development of Prognostics and Health Management (PHM), this important work covers all areas of electronics and explains how to: assess methods for damage estimation of components and systems due to field loading conditions assess the cost and benefits of prognostic implementations develop novel methods for in situ monitoring of products and systems in actual life-cycle conditions enable condition-based (predictive) maintenance increase system availability through an extension of maintenance cycles and/or timely repair actions; obtain knowledge of load history for future design, qualification, and root cause analysis reduce the occurrence of no fault found (NFF) subtract life-cycle costs of equipment from reduction in inspection costs, downtime, and inventory Prognostics and Health Management of Electronics also explains how to understand statistical techniques and machine learning methods used for diagnostics and prognostics. Using this valuable resource, electrical engineers, data scientists, and design engineers will be able to fully grasp the synergy between IoT, machine learning, and risk assessment.
Download or read book Silicon Sensors and Actuators written by Benedetto Vigna and published by Springer Nature. This book was released on 2022-04-12 with total page 988 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book thoroughly reviews the present knowledge on silicon micromechanical transducers and addresses emerging and future technology challenges. Readers will acquire a solid theoretical and practical background that will allow them to analyze the key performance aspects of devices, critically judge a fabrication process, and then conceive and design new ones for future applications. Envisioning a future complex versatile microsystem, the authors take inspiration from Richard Feynman’s visionary talk “There is Plenty of Room at the Bottom” to propose that the time has come to see silicon sensors as part of a “Feynman Roadmap” instead of the “More-than-Moore” technology roadmap. The sharing of the author’s industrially proven track record of development, design, and manufacturing, along with their visionary approach to the technology, will allow readers to jump ahead in their understanding of the core of the topic in a very effective way. Students, researchers, engineers, and technologists involved in silicon-based sensor and actuator research and development will find a wealth of useful and groundbreaking information in this book.
Download or read book Finite Element Analysis written by Farzad Ebrahimi and published by BoD – Books on Demand. This book was released on 2012-10-10 with total page 414 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the past few decades, the Finite Element Method (FEM) has been developed into a key indispensable technology in the modeling and simulation of various engineering systems. The present book reports on the state of the art research and development findings on this very broad matter through original and innovative research studies exhibiting various investigation directions of FEM in electrical, civil, materials and biomedical engineering. This book is a result of contributions of experts from international scientific community working in different aspects of FEM. The text is addressed not only to researchers, but also to professional engineers, students and other experts in a variety of disciplines, both academic and industrial seeking to gain a better understanding of what has been done in the field recently, and what kind of open problems are in this area.
Download or read book VLSI SoC Design and Engineering of Electronics Systems Based on New Computing Paradigms written by Nicola Bombieri and published by Springer. This book was released on 2019-06-25 with total page 281 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains extended and revised versions of the best papers presented at the 26th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2018, held in Verona, Italy, in October 2018. The 13 full papers included in this volume were carefully reviewed and selected from the 27 papers (out of 106 submissions) presented at the conference. The papers discuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies. In particular they address cutting-edge research fields like heterogeneous, neuromorphic and brain-inspired, biologically-inspired, approximate computing systems.
Download or read book Recent Advances in Microelectronics Reliability written by Willem Dirk van Driel and published by Springer Nature. This book was released on with total page 405 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electrically Conductive Adhesives written by Rajesh Gomatam and published by CRC Press. This book was released on 2008-12-23 with total page 436 pages. Available in PDF, EPUB and Kindle. Book excerpt: With all the environmental concerns and constraints today and stricter future regulations, there is a patent need to replace materials noxious to the environment by environmentally-friendly alternatives. Electrically conductive adhesives (ECAs) are one such example. ECAs offer an excellent alternative to lead-solder interconnects for microelectroni
