Download or read book Surface Mount Power Semiconductors written by and published by . This book was released on 1997 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Surface Mount Power Semiconductors for Portable Electronics written by International Rectifier (Firm) and published by . This book was released on 1995 with total page 371 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Power Semiconductor Drives written by S. Sivanagaraju and published by PHI Learning Pvt. Ltd.. This book was released on 2009-12 with total page 373 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book is primarily intended for B.E./B.Tech. students of Electrical Engineering/Electrical and Electronics Engineering having courses in Electric Drives/Power Semiconductor Drives. It will also be highly useful for M.E./M.Tech. students of these disciplines specializing in Power Electronics/Industrial Drives/Electric Drives. The text is divided into eight chapters. The first two chapters cover the control of dc motors by using various kinds of converters. The third chapter focuses on dual converters and various braking techniques. Chopper control fed dc motors are discussed in the fourth chapter. The next three chapters are devoted to control methods for induction motors. The eighth chapter deals with the control of synchronous motor drives fed from VSI converters and cycloconverters.

Download or read book Wafer Level Chip Scale Packaging written by Shichun Qu and published by Springer. This book was released on 2014-09-10 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt: Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.

Download or read book Power Semiconductors written by M. Kubat and published by Springer Science & Business Media. This book was released on 2013-04-17 with total page 532 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book contains a summary of our knowledge of power semiconductor structures. It presents first a short historic introduction (Chap. I) as well as a brief selection of facts from solid state physics, in particular those related to power semiconductors (Chap. 2). The book deals with diode structures in Chap. 3. In addition to fundamental facts in pn-junction theory, the book covers mainly the important processes of power structures. It describes the emitter efficiency and function of microleaks (shunts). the p +p and n + n junctions, and in particular the recent theory of the pin, pvn and p1tn junctions, whose role appears to be decisive for the forward mode not only of diode structures but also of more complex ones. For power diode structures the reverse mode is the decisive factor in pn-junction breakdown theory. The presentation given here uses engineering features (the multiplication factor M and the experimentally detected laws for the volume and surface of crystals), which condenses the presentation and makes the mathematical apparatus simpler. The discussion of diode structures is complemented by data on the tunnel phenomenon as well as on the properties of the semiconductor metal contact which forms the outer layers of the diode or more complex structure. A separate chapter (Chap. 4) is devoted to the two-transistor equivalent of the four layer structure and the solution of the four-layer structure in various modes. This presentation is also directed mainly towards the power aspect and the new components.

Download or read book A Beginners Guide to Surface Mount Technology written by RATAN SENGUPTA and published by Blue Rose Publishers. This book was released on 2022-12-30 with total page 103 pages. Available in PDF, EPUB and Kindle. Book excerpt: Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In the industry it has largely replaced the through hole technology (THT). SMT comes into existence because our earlier version of Through Hole Manufacturing Technology (THT)were having following limitations: 1.Large in Size 2.Only one side of PCB can be used 3.Lesser functions 4.Automation of PCB Assembly restricted 5.Cross Talk becomes predominating factor at Higher Frequency, restricting evolution of Mobile Technology.

Download or read book Entrepreneurship in Power Semiconductor Devices Power Electronics and Electric Machines and Drive Systems written by Krishnan Ramu and published by CRC Press. This book was released on 2020-12-07 with total page 451 pages. Available in PDF, EPUB and Kindle. Book excerpt: Entrepreneurship in Power Semiconductor Devices, Power Electronics, and Electric Machines and Drive Systems introduces the basics of entrepreneurship and a methodology for the study of entrepreneurship in electrical engineering and other engineering fields. Entrepreneurship is considered here in three fields of electrical engineering, viz. power semiconductor devices, power electronics and electric machines and drive systems, and their current practice. It prepares the reader by providing a review of the subject matter in the three fields, their current status in research and development with analysis aspect as needed, thus allowing readers to gain self-sufficiency while reading the book. Each field’s emerging applications, current market and future market forecasts are introduced to understand the basis and need for emerging startups. Practical learning is introduced in: (i) power semiconductor devices entrepreneurship through the prism of 20 startups in detail, (ii) power electronics entrepreneurship through 28 startup companies arranged under various application fields and (iii) electric machines and drive systems entrepreneurship through 15 startups in electromagnetic and 1 in electrostatic machines and drive systems. The book: (i) demystifies entrepreneurship in a practical way to equip engineers and students with entrepreneurship as an option for their professional growth, pursuit and success; (ii) provides engineering managers and corporate-level executives a detailed view of entrepreneurship activities in the considered three fields that may potentially impact their businesses, (iii) provides entrepreneurship education in an electrical engineering environment and with direct connection and correlation to their fields of study and (iv) endows a methodology that can be effectively employed not only in the three illustrated fields of electrical engineering but in other fields as well. This book is for electrical engineering students and professionals. For use in undergraduate and graduate courses in electrical engineering, the book contains discussion questions, exercise problems, team and class projects, all from a practical point of view, to train students and assist professionals for future entrepreneurship endeavors.

Download or read book The Packaging of Power Semiconductor Devices written by Constantine A. Neugebauer and published by CRC Press. This book was released on 1986 with total page 98 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Power Semiconductor Materials and Devices Volume 483 written by S. J. Pearton and published by Mrs Proceedings. This book was released on 1997 with total page 478 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Download or read book Wide Bandgap Power Semiconductor Packaging written by Katsuaki Suganuma and published by Woodhead Publishing. This book was released on 2018-05-28 with total page 242 pages. Available in PDF, EPUB and Kindle. Book excerpt: Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic. - Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance - Provides the latest research on potential solutions, with an eye towards the end goal of system integration - Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates

Download or read book Index of Specifications and Standards written by and published by . This book was released on 2005 with total page 782 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Department Of Defense Index of Specifications and Standards Alphabetical Listing Part I July 2005 written by and published by DIANE Publishing. This book was released on with total page 779 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Voltage Regulator Circuit Manual written by Bozzano G Luisa and published by Elsevier. This book was released on 2012-12-02 with total page 163 pages. Available in PDF, EPUB and Kindle. Book excerpt: Voltage Regulator Circuit Manual highlights the techniques in DC regulator design. This book contains seven chapters that cover different circuit types, from the simple incorporation of silicon chips to the complex IC manufacturing. After providing an overview of the changes in power supply design, this book goes on discussing the various circuit configurations applicable to linear IC voltage regulators and switching regulator designs. The following chapters contain schematic diagrams of a general assortment of regulators. In these chapters, the circuits are based on three-terminal, linear regulator ICs that offer simplicity of design, low cost, minimal circuit complexity, and relatively fast construction times. A chapter focuses on a wide assortment of regulators that fall into the general category of "switchers, which is a very broad class of circuit that encompasses several highly different configurations. The discussion then shifts to the switching power-supply circuits that fall into the category of flyback regulators, also known as ringing choke regulators. The last chapters deal with DC regulators that perform true value voltage conversions and their distinct characteristics. These chapters also include circuits that did not exactly fit the other circuit categories, such as battery chargers and motor controllers. Technicians and electronic engineers and designers who are interested in electronic design will find this book beneficial.

Download or read book NASA Tech Briefs written by and published by . This book was released on 1991 with total page 810 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Power Semiconductor SMD Package Embedded in Multilayered Ceramic for Low Switching Loss written by and published by . This book was released on 2017 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Power Electronics Device Applications of Diamond Semiconductors written by Satoshi Koizumi and published by Woodhead Publishing. This book was released on 2018-06-29 with total page 468 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power Electronics Device Applications of Diamond Semiconductors presents state-of-the-art research on diamond growth, doping, device processing, theoretical modeling and device performance. The book begins with a comprehensive and close examination of diamond crystal growth from the vapor phase for epitaxial diamond and wafer preparation. It looks at single crystal vapor deposition (CVD) growth sectors and defect control, ultra high purity SC-CVD, SC diamond wafer CVD, heteroepitaxy on Ir/MqO and needle-induced large area growth, also discussing the latest doping and semiconductor characterization methods, fundamental material properties and device physics. The book concludes with a discussion of circuits and applications, featuring the switching behavior of diamond devices and applications, high frequency and high temperature operation, and potential applications of diamond semiconductors for high voltage devices. - Includes contributions from today's most respected researchers who present the latest results for diamond growth, doping, device fabrication, theoretical modeling and device performance - Examines why diamond semiconductors could lead to superior power electronics - Discusses the main challenges to device realization and the best opportunities for the next generation of power electronics

Download or read book Electronics Power Electronics Optoelectronics Microwaves Electromagnetics and Radar written by Richard C. Dorf and published by CRC Press. This book was released on 2018-10-03 with total page 888 pages. Available in PDF, EPUB and Kindle. Book excerpt: In two editions spanning more than a decade, The Electrical Engineering Handbook stands as the definitive reference to the multidisciplinary field of electrical engineering. Our knowledge continues to grow, and so does the Handbook. For the third edition, it has expanded into a set of six books carefully focused on a specialized area or field of study. Electronics, Power Electronics, Optoelectronics, Microwaves, Electromagnetics, and Radar represents a concise yet definitive collection of key concepts, models, and equations in these areas, thoughtfully gathered for convenient access. Electronics, Power Electronics, Optoelectronics, Microwaves, Electromagnetics, and Radar delves into the fields of electronics, integrated circuits, power electronics, optoelectronics, electromagnetics, light waves, and radar, supplying all of the basic information required for a deep understanding of each area. It also devotes a section to electrical effects and devices and explores the emerging fields of microlithography and power electronics. Articles include defining terms, references, and sources of further information. Encompassing the work of the world’s foremost experts in their respective specialties, Electronics, Power Electronics, Optoelectronics, Microwaves, Electromagnetics, and Radar features the latest developments, the broadest scope of coverage, and new material in emerging areas.