Download or read book Surface Engineering for MEMS Reliability written by William Robert Ashurst and published by . This book was released on 2003 with total page 462 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book MEMS Reliability written by Allyson L. Hartzell and published by Springer Science & Business Media. This book was released on 2010-11-02 with total page 300 pages. Available in PDF, EPUB and Kindle. Book excerpt: The successful launch of viable MEMs product hinges on MEMS reliability, the reliability and qualification for MEMs based products is not widely understood. Companies that have a deep understanding of MEMs reliability view the information as a competitive advantage and are reluctant to share it. MEMs Reliability, focuses on the reliability and manufacturability of MEMS at a fundamental level by addressing process development and characterization, material property characterization, failure mechanisms and physics of failure (POF), design strategies for improving yield, design for reliability (DFR), packaging and testing.
Download or read book MEMS Reliability for Critical and Space Applications written by Russell A. Lawton and published by SPIE-International Society for Optical Engineering. This book was released on 1999 with total page 190 pages. Available in PDF, EPUB and Kindle. Book excerpt: A selection of scientific papers on the reliability of microelectromechanical systems (MEMS) for critical and space applications.
Download or read book Nano tribology and Materials in MEMS written by Sujeet K. Sinha and published by Springer Science & Business Media. This book was released on 2013-08-27 with total page 276 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book brings together recent developments in the areas of MEMS tribology, novel lubricants and coatings for nanotechnological applications, biomimetics in tribology and fundamentals of micro/nano-tribology. Tribology plays important roles in the functioning and durability of machines at small length scales because of the problems associated with strong surface adhesion, friction, wear etc. Recently, a number of studies have been conducted to understand tribological phenomena at nano/micro scales and many new tribological solutions for MEMS have been proposed.
Download or read book Surfactants in Tribology 2 Volume Set written by Girma Biresaw and published by CRC Press. This book was released on 2011-06-17 with total page 1118 pages. Available in PDF, EPUB and Kindle. Book excerpt: Surfactants play a critical role in tribology as they control friction, wear, and lubricant properties such as emulsification, demulsification, bioresistance, oxidation resistance, rust prevention, and corrosion resistance. The use of surfactants in tribology is a critical topic for scientists and engineers who are developing new materials and devi
Download or read book Surfactants in Tribology Volume 1 written by Girma Biresaw and published by CRC Press. This book was released on 2008-06-04 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt: Surfactants play a variety of critical roles in tribology. In addition to controlling friction and wear, they also allow for control of a wide range of properties of lubricants, such as emulsification/demulsification, bioresistance, oxidation resistance, and rust/corrosion prevention. This book explains recent advances in the role of surfactants wi
Download or read book Reliability of MEMS written by Osamu Tabata and published by John Wiley & Sons. This book was released on 2008-02-04 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt: This first book to cover exclusively and in detail the principles, tools and methods for determining the reliability of microelectromechanical materials, components and devices covers both component materials as well as entire MEMS devices. Divided into two major parts, following a general introductory chapter to reliability issues, the first part looks at the mechanical properties of the materials used in MEMS, explaining in detail the necessary measuring technologies -- nanoindenters, bulge methods, bending tests, tensile tests, and others. Part Two treats the actual devices, organized by important device categories such as pressure sensors, inertial sensors, RF MEMS, and optical MEMS.
Download or read book An Introduction to Microelectromechanical Systems Engineering written by Nadim Maluf and published by Artech House. This book was released on 2004 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Bringing you up-to-date with the latest developments in MEMS technology, this major revision of the best-selling An Introduction to Microelectromechanical Systems Engineering offers you a current understanding of this cutting-edge technology. You gain practical knowledge of MEMS materials, design, and manufacturing, and learn how it is being applied in industrial, optical, medical and electronic markets. The second edition features brand new sections on RF MEMS, photo MEMS, micromachining on materials other than silicon, reliability analysis, plus an expanded reference list. With an emphasis on commercialized products, this unique resource helps you determine whether your application can benefit from a MEMS solution, understand how other applications and companies have benefited from MEMS, and select and define a manufacturable MEMS process for your application. You discover how to use MEMS technology to enable new functionality, improve performance, and reduce size and cost. The book teaches you the capabilities and limitations of MEMS devices and processes, and helps you communicate the relative merits of MEMS to your company's management. From critical discussions on design operation and process fabrication of devices and systems, to a thorough explanation of MEMS packaging, this easy-to-understand book clearly explains the basics of MEMS engineering, making it an invaluable reference for your work in the field.
Download or read book Reliability Modeling of Microelectromechanical Systems Using Neural Networks written by J. Sebastian Perera and published by . This book was released on 2000 with total page 82 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 3D and Circuit Integration of MEMS written by Masayoshi Esashi and published by John Wiley & Sons. This book was released on 2021-03-16 with total page 528 pages. Available in PDF, EPUB and Kindle. Book excerpt: Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.
Download or read book Sensor Technologies for Civil Infrastructures Volume 1 written by Jerome P. Lynch and published by Elsevier. This book was released on 2014-04-26 with total page 599 pages. Available in PDF, EPUB and Kindle. Book excerpt: Sensors are used for civil infrastructure performance assessment and health monitoring, and have evolved significantly through developments in materials and methodologies. Sensor Technologies for Civil Infrastructure Volume I provides an overview of sensor hardware and its use in data collection. The first chapters provide an introduction to sensing for structural performance assessment and health monitoring, and an overview of commonly used sensors and their data acquisition systems. Further chapters address different types of sensor including piezoelectric transducers, fiber optic sensors, acoustic emission sensors, and electromagnetic sensors, and the use of these sensors for assessing and monitoring civil infrastructures. Developments in technologies applied to civil infrastructure performance assessment are also discussed, including radar technology, micro-electro-mechanical systems (MEMS) and nanotechnology. Sensor Technologies for Civil Infrastructure provides a standard reference for structural and civil engineers, electronics engineers, and academics with an interest in the field. - Describes sensing hardware and data collection, covering a variety of sensors - Examines fiber optic systems, acoustic emission, piezoelectric sensors, electromagnetic sensors, ultrasonic methods, and radar and millimeter wave technology - Covers strain gauges, micro-electro-mechanical systems (MEMS), multifunctional materials and nanotechnology for sensing, and vision-based sensing and lasers
Download or read book Adhesion Aspects in MEMS NEMS written by Seong H. Kim and published by CRC Press. This book was released on 2011-02-18 with total page 424 pages. Available in PDF, EPUB and Kindle. Book excerpt: Phenomena associated with the adhesion interaction of surfaces have been a critical aspect of micro- and nanosystem development and performance since the first MicroElectroMechanicalSystems(MEMS) were fabricated. These phenomena are ubiquitous in nature and are present in all systems, however MEMS devices are particularly sensitive to their effects
Download or read book MEMS Reliability for Critical Applications written by Russell A. Lawton and published by SPIE-International Society for Optical Engineering. This book was released on 2000 with total page 162 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Chemical Vapor Deposition written by Jong-Hee Park and published by ASM International. This book was released on 2001 with total page 477 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advanced Structural Materials written by Winston O. Soboyejo and published by CRC Press. This book was released on 2006-12-21 with total page 526 pages. Available in PDF, EPUB and Kindle. Book excerpt: A snapshot of the central ideas used to control fracture properties of engineered structural metallic materials, Advanced Structural Materials: Properties, Design Optimization, and Applications illustrates the critical role that advanced structural metallic materials play in aerospace, biomedical, automotive, sporting goods, and other indust
Download or read book Encyclopedia of Chemical Processing written by Sunggyu Lee and published by Taylor & Francis US. This book was released on 2006 with total page 768 pages. Available in PDF, EPUB and Kindle. Book excerpt: Supplying nearly 350 expertly-written articles on technologies that can maximize and enhance the research and production phases of current and emerging chemical manufacturing practices and techniques, this second edition provides gold standard articles on the methods, practices, products, and standards recently influencing the chemical industries. New material includes: design of key unit operations involved with chemical processes; design, unit operation, and integration of reactors and separation systems; process system peripherals such as pumps, valves, and controllers; analytical techniques and equipment; current industry practices; and pilot plant design and scale-up criteria.
Download or read book Mems Packaging written by Yung-cheng Lee and published by World Scientific. This book was released on 2018-01-03 with total page 363 pages. Available in PDF, EPUB and Kindle. Book excerpt: MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices.This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability.
