Download or read book Wafer Bonding written by Marin Alexe and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 510 pages. Available in PDF, EPUB and Kindle. Book excerpt: The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Download or read book Handbook of Wafer Bonding written by Peter Ramm and published by John Wiley & Sons. This book was released on 2012-02-13 with total page 435 pages. Available in PDF, EPUB and Kindle. Book excerpt: The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Download or read book Semiconductor Wafer Bonding Science Technology and Applications V written by Charles E. Hunt and published by The Electrochemical Society. This book was released on 2001 with total page 496 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Semiconductor Wafer Bonding Science Technology and Applications V written by Charles E. Hunt and published by The Electrochemical Society. This book was released on 2001 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Silicon Wafer Bonding Technology written by Subramanian S. Iyer and published by Univ. Press of Mississippi. This book was released on 2002 with total page 180 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes the essentials of silicon wafer bonding from an engineering perspective. A beginning chapter deals with basic processes of wafer bonding in detail, and subsequent chapters cover bonding by mechanical removal, the Smart Cut method of hydrogen exfoliation, the ELTRAN thinning technique and hydrogen annealing, engineering methods of wafer characterization, and quality assurance for bonded wafers. A chapter on advanced applications looks at applications in optoelectronics, very large scale integration (VLSI), microelectromechanical systems (MEMS), and photonics. A glossary is included, plus a table comparing various bonding methods. The editors work in the private sector. Annotation copyrighted by Book News, Inc., Portland, OR
Download or read book Semiconductor Wafer Bonding 10 Science Technology and Applications written by and published by The Electrochemical Society. This book was released on 2008-10 with total page 588 pages. Available in PDF, EPUB and Kindle. Book excerpt: This issue of ECS Transactions on Semiconductor Wafer Bonding will cover the state-of-the-art R&D results of the last 2 years in the field of semiconductor wafer bonding technology. Wafer Bonding is an Enabling Technology that can be used to create novel composite materials systems and devices that would otherwise be unattainable. Wafer Bonding today is rapidly expanding into new applications in such diverse fields as photonics, sensors, MEMS. X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI) and Nanotechnologies.
Download or read book Semiconductor Wafer Bonding 9 Science Technology and Applications written by Helmut Baumgart and published by The Electrochemical Society. This book was released on 2006 with total page 398 pages. Available in PDF, EPUB and Kindle. Book excerpt: This issue of ECS Transactions covers state-of-the-art R&D results of the last 1.5 years in the field of semiconductor wafer bonding technology. Wafer Bonding Technology can be used to create novel composite materials systems and devices what would otherwise be unattainable. Wafer bonding today is rapidly expanding applications in such diverse fields as photonics, sensors, MEMS, X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI), and Nanotechnologies.
Download or read book Proceedings of the International Symposium on Semiconductor Wafer Bonding written by and published by . This book was released on 1991 with total page 524 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Semiconductor Wafer Bonding written by H. Baumgart and published by The Electrochemical Society. This book was released on 2002 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding written by U. Gösele and published by The Electrochemical Society. This book was released on 1998 with total page 636 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 3D and Circuit Integration of MEMS written by Masayoshi Esashi and published by John Wiley & Sons. This book was released on 2021-03-16 with total page 528 pages. Available in PDF, EPUB and Kindle. Book excerpt: Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.
Download or read book Semiconductor Wafer Bonding 11 Science Technology and Applications In Honor of Ulrich G sele written by C. Colinge and published by The Electrochemical Society. This book was released on 2010-10 with total page 656 pages. Available in PDF, EPUB and Kindle. Book excerpt: Semiconductor wafer bonding continues to evolve as a crucial technology extending new integration schemes and disseminating new product architectures in such diverse areas as high quality silicon-on-insulator (SOI) materials for electronic applications, Si-Ge strained layers, Germanium-on-Insulator (GeOI), 3D device integration, Si on quartz or glass for thin film displays, compound semiconductor-on-Si heterostructures and Micro-Electro-Mechanical Systems.
Download or read book Semiconductor Wafer Bonding VIII Science Technology and Applications written by and published by The Electrochemical Society. This book was released on 2005 with total page 476 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Wafer Level 3 D ICs Process Technology written by Chuan Seng Tan and published by Springer Science & Business Media. This book was released on 2009-06-29 with total page 365 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
Download or read book Semiconductor Wafer Bonding Science Technology and Applications 15 written by C. S. Tan and published by The Electrochemical Society. This book was released on 2018-09-21 with total page 258 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Introduction to Microfabrication written by Sami Franssila and published by John Wiley & Sons. This book was released on 2005-01-28 with total page 424 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microfabrication is the key technology behind integrated circuits,microsensors, photonic crystals, ink jet printers, solar cells andflat panel displays. Microsystems can be complex, but the basicmicrostructures and processes of microfabrication are fairlysimple. Introduction to Microfabrication shows how the commonmicrofabrication concepts can be applied over and over again tocreate devices with a wide variety of structures andfunctions. Featuring: * A comprehensive presentation of basic fabrication processes * An emphasis on materials and microstructures, rather than devicephysics * In-depth discussion on process integration showing how processes,materials and devices interact * A wealth of examples of both conceptual and real devices Introduction to Microfabrication includes 250 homework problems forstudents to familiarise themselves with micro-scale materials,dimensions, measurements, costs and scaling trends. Both researchand manufacturing topics are covered, with an emphasis on silicon,which is the workhorse of microfabrication. This book will serve as an excellent first text for electricalengineers, chemists, physicists and materials scientists who wishto learn about microstructures and microfabrication techniques,whether in MEMS, microelectronics or emerging applications.
Download or read book Integrated Lasers on Silicon written by Charles Cornet and published by Elsevier. This book was released on 2016-07-14 with total page 180 pages. Available in PDF, EPUB and Kindle. Book excerpt: Integrated Lasers on Silicon provides a comprehensive overview of the state-of-the-art use of lasers on silicon for photonic integration. The authors demonstrate the need for efficient laser sources on silicon, motivated by the development of on-board/on-chip optical interconnects and the different integration schemes available. The authors include detailed descriptions of Group IV-based lasers, followed by a presentation of the results obtained through the bonding approach (hybrid III-V lasers). The monolithic integration of III-V semiconductor lasers are explored, concluding with a discussion of the different kinds of cavity geometries benchmarked with respect to their potential integration on silicon in an industrial environment. Features a clear description of the advantages, drawbacks, and challenges of laser integration on silicon Serves as a staple reference in the general field of silicon photonics Focuses on the promising developments of hybrid and monolithic III-V lasers on silicon, previously unreviewed Discusses the different kinds of cavity geometries benchmarked with respect to their potential integration on silicon in an industrial environment
