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EBookClubs

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Book Silicides for VLSI Applications

Download or read book Silicides for VLSI Applications written by Shyam P. Murarka and published by Academic Press. This book was released on 2012-12-02 with total page 213 pages. Available in PDF, EPUB and Kindle. Book excerpt: Most of the subject matter of this book has previously been available only in the form of research papers and review articles. I have not attempted to refer to all the published papers. The reader may find it advantageous to refer to the references listed.

Book Silicides for VLSI Applications

Download or read book Silicides for VLSI Applications written by S. P. Murarka and published by . This book was released on 1983 with total page 200 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Proceedings of the Workshop on Silicides and Metals for VLSI Applications V

Download or read book Proceedings of the Workshop on Silicides and Metals for VLSI Applications V written by Workshop on Silicides and Metals for VLSI Applications (5, 1987, San Juan Bautista, Calif.) and published by . This book was released on 1987 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Proceedings of the Workshop on Silicides and Metals for VLSI Applications

Download or read book Proceedings of the Workshop on Silicides and Metals for VLSI Applications written by Michael D. Strathman and published by . This book was released on 1987 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Fundamental Aspects and Some Applications of Metals and Metal Silicides in VLSI Technology

Download or read book Fundamental Aspects and Some Applications of Metals and Metal Silicides in VLSI Technology written by Shi-Li Zhang and published by . This book was released on 1990 with total page 190 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Silicides  Fundamentals   Applications

Download or read book Silicides Fundamentals Applications written by Francois D'heurle and published by World Scientific. This book was released on 2000-12-18 with total page 390 pages. Available in PDF, EPUB and Kindle. Book excerpt: Silicides were introduced into the technology of electronic devices some thirty years ago; since then, they have been continuously used to form both ohmic and rectifying contacts to silicon. Silicides are also important for other applications (thermoelectric devices and structural applications, such as jet engines), but it is not easy to find an updated reference containing both their basic properties, either chemical or physical, and the latest applications.The 16th Course of the International School of Solid State Physics, held in Erice (Italy) in the late spring of 1999, was intended to break artificial barriers between disciplines, and to gather people concerned with the properties and applications of silicides, regardless of the formal fields to which they belong, or of the practical goals they pursue. This book is therefore concerned with theory as well as applications, metallurgy as well as physics, and materials science as well as microelectronics.

Book Proceedings of the Workshop on Silicides and Metals for VLSI Applications V  11 14 May 1987  San Juan Bautista  California

Download or read book Proceedings of the Workshop on Silicides and Metals for VLSI Applications V 11 14 May 1987 San Juan Bautista California written by Michael D. Strathman and published by . This book was released on 1987 with total page 1759 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Chemical Vapor Deposition of Tungsten and Tungsten Silicides for VLSI  ULSI Applications

Download or read book Chemical Vapor Deposition of Tungsten and Tungsten Silicides for VLSI ULSI Applications written by John E.J. Schmitz and published by William Andrew. This book was released on 1992-12-31 with total page 264 pages. Available in PDF, EPUB and Kindle. Book excerpt: Publisher description.

Book Handbook of Semiconductor Manufacturing Technology

Download or read book Handbook of Semiconductor Manufacturing Technology written by Yoshio Nishi and published by CRC Press. This book was released on 2000-08-09 with total page 1186 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Handbook of Semiconductor Manufacturing Technology describes the individual processes and manufacturing control, support, and infrastructure technologies of silicon-based integrated-circuit manufacturing, many of which are also applicable for building devices on other semiconductor substrates. Discussing ion implantation, rapid thermal processing, photomask fabrication, chip testing, and plasma etching, the editors explore current and anticipated equipment, devices, materials, and practices of silicon-based manufacturing. The book includes a foreword by Jack S. Kilby, cowinner of the Nobel Prize in Physics 2000 "for his part in the invention of the integrated circuit."

Book Mechanical Properties of Silicon Based Compounds  Silicides

Download or read book Mechanical Properties of Silicon Based Compounds Silicides written by Joshua Pelleg and published by . This book was released on 2019 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the mechanical properties of silicides for very large scale integration (VLSI) applications. It presents the fabrication process for bulk silicides and thin films, and list complete testing deformation for a variety of silicon based compounds. The author also presents dislocation in silicides, fatigue and fracture aspects. A special chapter is given on deformation in silicides in the nano scale. Composites and alloys are also considered.

Book Semiconducting Silicides

Download or read book Semiconducting Silicides written by Victor E. Borisenko and published by Springer Science & Business Media. This book was released on 2013-03-07 with total page 362 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive presentation and analysis of properties and methods of formation of semiconducting silicides. Fundamental electronic, optical and transport properties of the silicides collected from recent publications will help readers choose their application in new generations of solid-state devices. A comprehensive presentation of thermodynamic and kinetic data is given in combination with their technical application, as is information on corresponding thin-film or bulk crystal formation techniques.

Book Sputtering Materials for VLSI and Thin Film Devices

Download or read book Sputtering Materials for VLSI and Thin Film Devices written by Jaydeep Sarkar and published by William Andrew. This book was released on 2010-12-13 with total page 614 pages. Available in PDF, EPUB and Kindle. Book excerpt: An important resource for students, engineers and researchers working in the area of thin film deposition using physical vapor deposition (e.g. sputtering) for semiconductor, liquid crystal displays, high density recording media and photovoltaic device (e.g. thin film solar cell) manufacturing. This book also reviews microelectronics industry topics such as history of inventions and technology trends, recent developments in sputtering technologies, manufacturing steps that require sputtering of thin films, the properties of thin films and the role of sputtering target performance on overall productivity of various processes. Two unique chapters of this book deal with productivity and troubleshooting issues. The content of the book has been divided into two sections: (a) the first section (Chapter 1 to Chapter 3) has been prepared for the readers from a range of disciplines (e.g. electrical, chemical, chemistry, physics) trying to get an insight into use of sputtered films in various devices (e.g. semiconductor, display, photovoltaic, data storage), basic of sputtering and performance of sputtering target in relation to productivity, and (b) the second section (Chapter 4 to Chapter 8) has been prepared for readers who already have background knowledge of sputter deposition of thin films, materials science principles and interested in the details of sputtering target manufacturing methods, sputtering behavior and thin film properties specific to semiconductor, liquid crystal display, photovoltaic and magnetic data storage applications. In Chapters 5 to 8, a general structure has been used, i.e. a description of the applications of sputtered thin films, sputtering target manufacturing methods (including flow charts), sputtering behavior of targets (e.g. current - voltage relationship, deposition rate) and thin film properties (e.g. microstructure, stresses, electrical properties, in-film particles). While discussing these topics, attempts have been made to include examples from the actual commercial processes to highlight the increased complexity of the commercial processes with the growth of advanced technologies. In addition to personnel working in industry setting, university researchers with advanced knowledge of sputtering would also find discussion of such topics (e.g. attributes of target design, chamber design, target microstructure, sputter surface characteristics, various troubleshooting issues) useful. . Unique coverage of sputtering target manufacturing methods in the light of semiconductor, displays, data storage and photovoltaic industry requirements Practical information on technology trends, role of sputtering and major OEMs Discussion on properties of a wide variety of thin films which include silicides, conductors, diffusion barriers, transparent conducting oxides, magnetic films etc. Practical case-studies on target performance and troubleshooting Essential technological information for students, engineers and scientists working in the semiconductor, display, data storage and photovoltaic industry

Book VLSI Metallization

Download or read book VLSI Metallization written by Norman G. Einspruch and published by Academic Press. This book was released on 2014-12-01 with total page 491 pages. Available in PDF, EPUB and Kindle. Book excerpt: VLSI Electronics Microstructure Science, Volume 15: VLSI Metallization discusses the various issues and problems related to VLSI metallization. It details the available solutions and presents emerging trends. This volume is comprised of 10 chapters. The two introductory chapters, Chapter 1 and 2 serve as general references for the electrical and metallurgical properties of thin conducting films. Subsequent chapters review the various aspects of VLSI metallization. The order of presentation has been chosen to follow the common processing sequence. In Chapter 3, some relevant metal deposition techniques are discussed. Chapter 4 presents the methods of VLSI lithography and etching. Conducting films are first deposited at the gate definition step; therefore, the issues related to gate metallization are discussed next in Chapter 5.In Chapter 6, contact metallization is elaborated, and Chapter 7 is devoted to multilevel metallization schemes. Long-time reliability is the subject of Chapter 8, which discusses the issues of contact and interconnect electromigration. GaAs metallization is tackled in Chapter 9. The volume concludes with a general discussion of the functions of interconnect systems in VLSI. Materials scientists, processing and design engineers, and device physicists will find the book very useful.