Download or read book Si RF Technology written by Ayan Karmakar and published by Springer. This book was released on 2019-05-10 with total page 144 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses the recent research developments of various passive microwave circuits on silicon substrate and demonstrated operations catering for multiple frequency bands. It covers the design, modelling, process fabrication and characterization aspects with practical examples. The book will be of use to researchers and engineers working in the field of RF or microwave engineering, who can use the techniques and approaches effectively without having to refer to multiple sources.
Download or read book TSV 3D RF Integration written by Shenglin Ma and published by Elsevier. This book was released on 2022-04-27 with total page 294 pages. Available in PDF, EPUB and Kindle. Book excerpt: TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters. A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology. Provides a detailed demonstration of the design and process development of HR-Si (High-Resistivity Silicon) interposer technology Presents a series of implementation case studies that detail modeling and simulation, integration, qualification and testing methods Offers a systematic and comparative literature review of HR-Si interposer technology by topic Offers solutions to problems with TSV (through silicon via) interposer technology, including high frequency loss and cooling problems Gives a systematic and accessible accounting on this leading technology
Download or read book RF Technologies for Low Power Wireless Communications written by Tatsuo Itoh and published by John Wiley & Sons. This book was released on 2004-04-07 with total page 482 pages. Available in PDF, EPUB and Kindle. Book excerpt: A survey of microwave technology tailored for professionals in wireless communications RF Technologies for Low Power Wireless Communications updates recent developments in wireless communications from a hardware design standpoint and offers specialized coverage of microwave technology with a focus on the low power wireless units required in modern wireless systems. It explores results of recent research that focused on a holistic, integrated approach to the topics of materials, devices, circuits, modulation, and architectures rather than the more traditional approach of research into isolated topical areas. Twelve chapters deal with various fundamental research aspects of low power wireless electronics written by world-class experts in each field. The first chapter offers an overview of wireless architecture and performance, followed by detailed coverage of: Advanced GaAs-based HBT designs InP-based devices and circuits Si/SiGe HBT technology Noise in GaN devices Power amplifier architectures and nonlinearities Planar-oriented components MEMS and micromachined components Resonators, filters, and low-noise oscillators Antennas Transceiver front-end architectures With a clear focus and expert contributors, RF Technologies for Low Power Wireless Communications will be of interest to a wide range of electrical engineering disciplines working in wireless technologies.
Download or read book mm Wave Silicon Technology written by Ali M. Niknejad and published by Springer Science & Business Media. This book was released on 2008-01-03 with total page 313 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book compiles and presents the research results from the past five years in mm-wave Silicon circuits. This area has received a great deal of interest from the research community including several university and research groups. The book covers device modeling, circuit building blocks, phased array systems, and antennas and packaging. It focuses on the techniques that uniquely take advantage of the scale and integration offered by silicon based technologies.
Download or read book Lumped Elements for RF and Microwave Circuits Second Edition written by Inder J. Bahl and published by Artech House. This book was released on 2022-12-31 with total page 593 pages. Available in PDF, EPUB and Kindle. Book excerpt: Fully updated and including entirely new chapters, this Second Edition provides in-depth coverage of the different types of RF and microwave circuit elements, including inductors, capacitors, resistors, transformers, via holes, airbridges, and crossovers. Featuring extensive formulas for lumped elements, design trade-offs, and an updated and current list of references, the book helps you understand the value and usefulness of lumped elements in the design of RF, microwave and millimeter wave components and circuits. You’ll find a balanced treatment between standalone lumped elements and their circuits using MICs, MMICs and RFICs technologies. You’ll also find detailed information on a broader range RFICs that was not available when the popular first edition was published. The book captures – in one consolidated volume -- the fundamentals, equations, modeling, examples, references and overall procedures to design, test and produce microwave components that are indispensable in industry and academia today. With its superb organization and expanded coverage of the subject, this is a must-have, go-to resource for practicing engineers and researchers in industry, government and university and microwave engineers working in the antenna area. Students will also find it a useful reference with its clear explanations, many examples and practical modeling guidelines.
Download or read book The ESD Handbook written by Steven H. Voldman and published by John Wiley & Sons. This book was released on 2021-03-25 with total page 1172 pages. Available in PDF, EPUB and Kindle. Book excerpt: A practical and comprehensive reference that explores Electrostatic Discharge (ESD) in semiconductor components and electronic systems The ESD Handbook offers a comprehensive reference that explores topics relevant to ESD design in semiconductor components and explores ESD in various systems. Electrostatic discharge is a common problem in the semiconductor environment and this reference fills a gap in the literature by discussing ESD protection. Written by a noted expert on the topic, the text offers a topic-by-topic reference that includes illustrative figures, discussions, and drawings. The handbook covers a wide-range of topics including ESD in manufacturing (garments, wrist straps, and shoes); ESD Testing; ESD device physics; ESD semiconductor process effects; ESD failure mechanisms; ESD circuits in different technologies (CMOS, Bipolar, etc.); ESD circuit types (Pin, Power, Pin-to-Pin, etc.); and much more. In addition, the text includes a glossary, index, tables, illustrations, and a variety of case studies. Contains a well-organized reference that provides a quick review on a range of ESD topics Fills the gap in the current literature by providing information from purely scientific and physical aspects to practical applications Offers information in clear and accessible terms Written by the accomplished author of the popular ESD book series Written for technicians, operators, engineers, circuit designers, and failure analysis engineers, The ESD Handbook contains an accessible reference to ESD design and ESD systems.
Download or read book Computer Science Engineering and Emerging Technologies written by Rajeev Sobti and published by CRC Press. This book was released on 2024-06-07 with total page 744 pages. Available in PDF, EPUB and Kindle. Book excerpt: The year 2022 marks the 100th birth anniversary of Kathleen Hylda Valerie Booth, who wrote the first assembly language and designed the assembler and auto code for the first computer systems at Birkbeck College, University of London. She helped design three different machines including the ARC (Automatic Relay Calculator), SEC (Simple Electronic Computer), and APE(X). School of Computer Science and Engineering, under the aegis of Lovely Professional University, pays homage to this great programmer of all times by hosting “BOOTH100”—6th International Conference on Computing Sciences.
Download or read book Transfer Printing Technologies and Applications written by Changhong Cao and published by Elsevier. This book was released on 2024-01-26 with total page 539 pages. Available in PDF, EPUB and Kindle. Book excerpt: Transfer printing (TP) is a class of techniques for the deterministic assembly of disparate micro/nanomaterials into functional devices, and has become an emerging suite of technologies for micro/nanofabrication. Systems enabled by transfer printing range from complex molecular-scale materials, to high-performance hard materials, to fully integrated devices. A variety of sub-techniques for different purposes have grown significantly in the past decade, leading to non-conventional electronics, optoelectronics, photovoltaics, and photonics, and enabling the development of non-planar and flexible electronics.Highlights breakthrough results and systems enabled by novel TP techniques.Highlights breakthrough results and systems enabled by novel TP techniques.Transfer Printing Technologies and Applications is a complete guide to transfer printing techniques and their cutting-edge applications. The first section of the book provides a solid grounding in transfer printing methods and the fundamentals behind these technologies. The second part of the book focuses on state-of-the-art applications enabled by transfer printing techniques, including areas such as flexible sensors, flexible transistors, wearable devices, thin film-based energy systems, flexible displays, microLED-based displays, metal films, and more. A concluding chapter addresses current challenges and future opportunities in this innovative field.Highlights breakthrough results and systems enabled by novel TP techniques.Highlights breakthrough results and systems enabled by novel TP techniques.This book is of interest to researchers and advanced students across nanotechnology, materials science, electrical engineering, mechanical engineering, chemistry, and biomedicine, as well as scientists, engineers, and R&D professionals involved with nanomaterials, micro- or nano-fabrication, microelectromechanical systems (MEMS), display technology, biotechnology, and devices. Highlights breakthrough results and systems enabled by novel TP techniques. Highlights breakthrough results and systems enabled by novel TP techniques.Highlights breakthrough results and systems enabled by novel TP techniques.Highlights breakthrough results and systems enabled by novel TP techniques. Highlights breakthrough results and systems enabled by novel TP techniques. Examines a range of transfer printing technologies and their specific features for different applications Highlights breakthrough results and systems enabled by novel TP techniques Offers an insightful outlook into trends and future directions in each sub-area of transfer printing
Download or read book Design Simulation and Applications of Inductors and Transformers for Si RF ICs written by Ali M. Niknejad and published by Springer Science & Business Media. This book was released on 2005-12-15 with total page 193 pages. Available in PDF, EPUB and Kindle. Book excerpt: The modern wireless communication industry has put great demands on circuit designers for smaller, cheaper transceivers in the gigahertz frequency range. One tool which has assisted designers in satisfying these requirements is the use of on-chip inductiveelements (inductors and transformers) in silicon (Si) radio-frequency (RF) integrated circuits (ICs). These elements allow greatly improved levels of performance in Si monolithic low-noise amplifiers, power amplifiers, up-conversion and down-conversion mixers and local oscillators. Inductors can be used to improve the intermodulation distortion performance and noise figure of small-signal amplifiers and mixers. In addition, the gain of amplifier stages can be enhanced and the realization of low-cost on-chip local oscillators with good phase noise characteristics is made feasible. In order to reap these benefits, it is essential that the IC designer be able to predict and optimize the characteristics of on-chip inductiveelements. Accurate knowledge of inductance values, quality factor (Q) and the influence of ad- cent elements (on-chip proximity effects) and substrate losses is essential. In this book the analysis, modeling and application of on-chip inductive elements is considered. Using analyses based on Maxwells equations, an accurate and efficient technique is developed to model these elements over a wide frequency range. Energy loss to the conductive substrate is modeled through several mechanisms, including electrically induced displacement and conductive c- rents and by magnetically induced eddy currents. These techniques have been compiled in a user-friendly software tool ASITIC (Analysis and Simulation of Inductors and Transformers for Integrated Circuits).
Download or read book Strained Si Technology for Radio Frequency Power LDMOSFET written by Niamh Waldron and published by . This book was released on 2002 with total page 101 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Silicon germanium Heterojunction Bipolar Transistors written by John D. Cressler and published by Artech House. This book was released on 2003 with total page 592 pages. Available in PDF, EPUB and Kindle. Book excerpt: This informative, new resource presents the first comprehensive treatment of silicon-germanium heterojunction bipolar transistors (SiGe HBTs). It offers you a complete, from-the-ground-up understanding of SiGe HBT devices and technology, from a very broad perspective. The book covers motivation, history, materials, fabrication, device physics, operational principles, and circuit-level properties associated with this new cutting-edge semiconductor device technology. Including over 400 equations and more than 300 illustrations, this hands-on reference shows you in clear and concise language how to design, simulate, fabricate, and measure a SiGe HBT.
Download or read book Silicon Germanium written by Raminderpal Singh and published by John Wiley & Sons. This book was released on 2004-03-15 with total page 368 pages. Available in PDF, EPUB and Kindle. Book excerpt: "An excellent introduction to the SiGe BiCMOS technology, from the underlying device physics to current applications." -Ron Wilson, EETimes "SiGe technology has demonstrated the ability to provide excellent high-performance characteristics with very low noise, at high power gain, and with excellent linearity. This book is a comprehensive review of the technology and of the design methods that go with it." -Alberto Sangiovanni-Vincentelli Professor, University of California, Berkeley Cofounder, Chief Technology Officer, Member of Board Cadence Design Systems Inc. Filled with in-depth insights and expert advice, Silicon Germanium covers all the key aspects of this technology and its applications. Beginning with a brief introduction to and historical perspective of IBM's SiGe technology, this comprehensive guide quickly moves on to: * Detail many of IBM's SiGe technology development programs * Explore IBM's approach to device modeling and characterization-including predictive TCAD modeling * Discuss IBM's design automation and signal integrity knowledge and implementation methodologies * Illustrate design applications in a variety of IBM's SiGe technologies * Highlight details of highly integrated SiGe BiCMOS system-on-chip (SOC) design Written for RF/analog and mixed-signal designers, CAD designers, semiconductor students, and foundry process engineers worldwide, Silicon Germanium provides detailed insight into the modeling and design automation requirements for leading-edge RF/analog and mixed-signal products, and illustrates in-depth applications that can be implemented using IBM's advanced SiGe process technologies and design kits. "This volume provides an excellent introduction to the SiGe BiCMOS technology, from the underlying device physics to current applications. But just as important is the window the text provides into the infrastructure-the process development, device modeling, and tool development." -Ron Wilson Silicon Engineering Editor, EETimes "This book chronicles the development of SiGe in detail, provides an in-depth look at the modeling and design automation requirements for making advanced applications using SiGe possible, and illustrates such applications as implemented using IBM's process technologies and design methods." -John Kelly Senior Vice President and Group Executive, Technology Group, IBM
Download or read book High Speed Integrated Circuit Technology Towards 100 Ghz Logic written by Mark Rodwell and published by World Scientific. This book was released on 2001-04-24 with total page 372 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book reviews the state of the art of very high speed digital integrated circuits. Commercial applications are in fiber optic transmission systems operating at 10, 40, and 100 Gb/s, while the military application is ADCs and DACs for microwave radar. The book contains detailed descriptions of the design, fabrication, and performance of wideband Si/SiGe-, GaAs-, and InP-based bipolar transistors. The analysis, design, and performance of high speed CMOS, silicon bipolar, and III-V digital ICs are presented in detail, with emphasis on application in optical fiber transmission and mixed signal ICs. The underlying physics and circuit design of rapid single flux quantum (RSFQ) superconducting logic circuits are reviewed, and there is extensive coverage of recent integrated circuit results in this technology.
Download or read book GPS Declassified written by Richard D. Easton and published by Potomac Books, Inc.. This book was released on 2013 with total page 345 pages. Available in PDF, EPUB and Kindle. Book excerpt: GPS Declassified examines the development of GPS from its secret, Cold War military roots to its emergence as a worldwide consumer industry. Drawing on previously unexplored documents, the authors examine how military rivalries influenced the creation of GPS and shaped public perceptions about its origin. Since the United States' first program to launch a satellite in the late 1950s, the nation has pursued dual paths into space-one military and secret, the other scientific and public. Among the many commercial spinoffs this approach has produced, GPS arguably boasts the greatest impact on our.
Download or read book New Materials and Devices Enabling 5G Applications and Beyond written by Nadine Collaert and published by Elsevier. This book was released on 2024-01-24 with total page 369 pages. Available in PDF, EPUB and Kindle. Book excerpt: New Materials and Devices for 5G Applications and Beyond focuses on the materials, device architectures and enabling integration schemes for 5G applications and emerging technologies. It gives a comprehensive overview of the trade-offs, challenges and unique properties of novel upcoming technologies. Starting from the application side and its requirements, the book examines different technologies under consideration for the different functions, both more conventional to exploratory, and within this context the book provides guidance to the reader on how to possibly optimize the system for a particular application. This book aims at guiding the reader through the technologies required to enable 5G applications, with the main focus on mm-wave frequencies, up to THz. New Materials and Devises for 5G Applications and Beyond is suitable for industrial researchers and development engineers, and researchers in materials science, device engineering and circuit design. Reviews challenges and emerging opportunities for materials, devices, and integration to enable 5G technologies Includes discussion of technologies such as RF-MEMs, RF FINFETs, and transistors based on current and emerging materials (InP, GaN, etc.) Focuses on mm-wave frequencies up to the terahertz regime
Download or read book Reconfigurable Circuits and Technologies for Smart Millimeter Wave Systems written by Philippe Ferrari and published by . This book was released on 2022-05-25 with total page 458 pages. Available in PDF, EPUB and Kindle. Book excerpt: Describes the theory, modeling, and design of tunable mm-wave circuits and systems using CMOS, RF MEMS, and microwave liquid crystals.
Download or read book RF MEMS written by Gabriel M. Rebeiz and published by John Wiley & Sons. This book was released on 2004-02-06 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt: Ultrasmall Radio Frequency and Micro-wave Microelectromechanical systems (RF MEMs), such as switches, varactors, and phase shifters, exhibit nearly zero power consumption or loss. For this reason, they are being developed intensively by corporations worldwide for use in telecommunications equipment. This book acquaints readers with the basics of RF MEMs and describes how to design practical circuits and devices with them. The author, an acknowledged expert in the field, presents a range of real-world applications and shares many valuable tricks of the trade.
