Download or read book Reliability Stress and Failure Rate Data for Electronic Equipment written by United States. Department of Defense and published by . This book was released on 1962 with total page 344 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electronic Reliability Design Handbook written by and published by . This book was released on 1988 with total page 1098 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Reliability and Failure of Electronic Materials and Devices written by Milton Ohring and published by Academic Press. This book was released on 2014-10-14 with total page 759 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
Download or read book Reliability Stress Analysis for Electronic Equipment TR1100 written by Radio Corporation of America. Defense Electronic Products and published by . This book was released on 1958 with total page 196 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Reliability Abstracts and Technical Reviews written by and published by . This book was released on 1966 with total page 556 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Reliability Growth written by Panel on Reliability Growth Methods for Defense Systems and published by National Academy Press. This book was released on 2015-03-01 with total page 235 pages. Available in PDF, EPUB and Kindle. Book excerpt: A high percentage of defense systems fail to meet their reliability requirements. This is a serious problem for the U.S. Department of Defense (DOD), as well as the nation. Those systems are not only less likely to successfully carry out their intended missions, but they also could endanger the lives of the operators. Furthermore, reliability failures discovered after deployment can result in costly and strategic delays and the need for expensive redesign, which often limits the tactical situations in which the system can be used. Finally, systems that fail to meet their reliability requirements are much more likely to need additional scheduled and unscheduled maintenance and to need more spare parts and possibly replacement systems, all of which can substantially increase the life-cycle costs of a system. Beginning in 2008, DOD undertook a concerted effort to raise the priority of reliability through greater use of design for reliability techniques, reliability growth testing, and formal reliability growth modeling, by both the contractors and DOD units. To this end, handbooks, guidances, and formal memoranda were revised or newly issued to reduce the frequency of reliability deficiencies for defense systems in operational testing and the effects of those deficiencies. "Reliability Growth" evaluates these recent changes and, more generally, assesses how current DOD principles and practices could be modified to increase the likelihood that defense systems will satisfy their reliability requirements. This report examines changes to the reliability requirements for proposed systems; defines modern design and testing for reliability; discusses the contractor's role in reliability testing; and summarizes the current state of formal reliability growth modeling. The recommendations of "Reliability Growth" will improve the reliability of defense systems and protect the health of the valuable personnel who operate them.
Download or read book Failure Analysis and Prevention written by Aidy Ali and published by BoD – Books on Demand. This book was released on 2017-12-20 with total page 218 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers recent advancement methods used in analysing the root cause of engineering failures and the proactive suggestion for future failure prevention. The techniques used especially non-destructive testing such X-ray are well described. The failure analysis covers materials for metal and composites for various applications in mechanical, civil and electrical applications. The modes of failures that are well explained include fracture, fatigue, corrosion and high-temperature failure mechanisms. The administrative part of failures is also presented in the chapter of failure rate analysis. The book will bring you on a tour on how to apply mechanical, electrical and civil engineering fundamental concepts and to understand the prediction of root cause of failures. The topics explained comprehensively the reliable test that one should perform in order to investigate the cause of machines, component or material failures at the macroscopic and microscopic level. I hope the material is not too theoretical and you find the case study, the analysis will assist you in tackling your own failure investigation case.
Download or read book Reliability Prediction from Burn In Data Fit to Reliability Models written by Joseph Bernstein and published by Academic Press. This book was released on 2014-03-06 with total page 108 pages. Available in PDF, EPUB and Kindle. Book excerpt: This work will educate chip and system designers on a method for accurately predicting circuit and system reliability in order to estimate failures that will occur in the field as a function of operating conditions at the chip level. This book will combine the knowledge taught in many reliability publications and illustrate how to use the knowledge presented by the semiconductor manufacturing companies in combination with the HTOL end-of-life testing that is currently performed by the chip suppliers as part of their standard qualification procedure and make accurate reliability predictions. This book will allow chip designers to predict FIT and DPPM values as a function of operating conditions and chip temperature so that users ultimately will have control of reliability in their design so the reliability and performance will be considered concurrently with their design. - The ability to include reliability calculations and test results in their product design - The ability to use reliability data provided to them by their suppliers to make meaningful reliability predictions - Have accurate failure rate calculations for calculating warrantee period replacement costs
Download or read book Reliability Design Handbook written by United States. Naval Ship Systems Command and published by . This book was released on 1963 with total page 810 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book High Temperature Electronics written by F. Patrick McCluskey and published by CRC Press. This book was released on 1996-12-13 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
Download or read book Guidelines for Process Equipment Reliability Data with Data Tables written by CCPS (Center for Chemical Process Safety) and published by John Wiley & Sons. This book was released on 2010-09-16 with total page 326 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book supplements Guidelines for Chemical Process Quantitative Risk Analysis by providing the failure rate data needed to perform a chemical process quantitative risk analysis.
Download or read book Probability Distributions Used in Reliability Engineering written by Andrew N O'Connor and published by RIAC. This book was released on 2011 with total page 220 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book provides details on 22 probability distributions. Each distribution section provides a graphical visualization and formulas for distribution parameters, along with distribution formulas. Common statistics such as moments and percentile formulas are followed by likelihood functions and in many cases the derivation of maximum likelihood estimates. Bayesian non-informative and conjugate priors are provided followed by a discussion on the distribution characteristics and applications in reliability engineering.
Download or read book Logistics written by United States. Department of the Army and published by . This book was released on 1965 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings written by and published by . This book was released on 1967 with total page 242 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Reliability Design of Mechanical Systems written by Seongwoo Woo and published by Springer. This book was released on 2019-07-03 with total page 476 pages. Available in PDF, EPUB and Kindle. Book excerpt: The revised edition of this book offers an expanded overview of the reliability design of mechanical systems and describes the reliability methodology, including a parametric accelerated life test (ALT) plan, a load analysis, a tailored series of parametric ALTs with action plans, and an evaluation of the final designs to ensure the design requirements are satisfied. It covers both the quantitative and qualitative approaches of the reliability design forming in the development process of mechanical products, with a focus on parametric ALT and illustrated via case studies. This new reliability methodology – parametric ALT should help mechanical and civil engineers to uncover design parameters improving product design and avoiding recalls. Updated chapters cover product recalls and assessment of their significance, modern definitions in reliability engineering, parametric accelerated life testing in mechanical systems, and extended case studies. For this revised edition, one new chapter has been introduced to reflect recent developments in analysis of fluid motion and mechanical vibration. Other chapters are expanded and updated to improve the explanation of topics including structures and load analysis, failure mechanics, design and reliability testing, and mechanical system failure. The broad scope gives the reader an overview of the state-of-the-art in the reliability design of mechanical systems and an indication of future directions and applications. It will serve as a solid introduction to the field for advanced students, and a valuable reference for those working in the development of mechanical systems and related areas.
Download or read book Preindications of Failure in Electronic Components written by J. W. Klapheke and published by . This book was released on 1965 with total page 68 pages. Available in PDF, EPUB and Kindle. Book excerpt: This report discusses state-of-the-art information and techniques concerned with indications of potential degradation and catastrophic failure in electronic components. The objective of this survey is to present a comprehensive description of past, present, and future planned work on preindicators of failure for certain electronic components. This study is intended to provide basic information for future development in automatic checkout equipment. The following electronic parts were covered in the survey: semiconductors (transistors, diodes, and microcircuits), resistors, capacitors, inductors, computer cores, other items used in a computer, and vacuum tubes. Such items as wire, insulation, lamps, relays, and rotary devices were not considered. Precursors of failure have been investigated for electronic components but few have been identified at the present time. Most of these investigations were undertaken as part of programs directed at physics of failure, screening, or accelerated testing. The results of this study show that predictors of failure for semiconductors (transistors, diodes, and microcircuits) have received more attention than other types of parts. Current noise (l/f noise) and infrared emission profiles show promise as precursors that would apply to all types of semiconductors. Apparently computer cores and inductors are the least considered. (Author).
Download or read book Handbook of Materials Failure Analysis written by Abdel Salam Hamdy Makhlouf and published by Butterworth-Heinemann. This book was released on 2019-10-22 with total page 388 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Materials Failure Analysis: With Case Studies from the Electronics Industries examines the reasons materials fail in certain situations, including material defects and mechanical failure as a result of various causes. The book begins with a general overview of materials failure analysis and its importance. It then proceeds to discussions on the types of failure analysis, specific tools and techniques, and an analysis of materials failure from various causes. As failure can occur for several reasons, including materials defects-related failure, materials design-related failure, or corrosion-related failures, the topics covered in this comprehensive source are an important tool for practitioners. - Provides the most up-to-date and balanced coverage of failure analysis, combining foundational knowledge and current research on the latest developments and innovations in the field - Offers an ideal accompaniment for those interested in materials forensic investigation, failure of materials, static failure analysis, dynamic failure analysis, and fatigue life prediction - Presents compelling new case studies from key industries to demonstrate concepts
