Download or read book MEMS Reliability written by Allyson L. Hartzell and published by Springer Science & Business Media. This book was released on 2010-11-02 with total page 300 pages. Available in PDF, EPUB and Kindle. Book excerpt: The successful launch of viable MEMs product hinges on MEMS reliability, the reliability and qualification for MEMs based products is not widely understood. Companies that have a deep understanding of MEMs reliability view the information as a competitive advantage and are reluctant to share it. MEMs Reliability, focuses on the reliability and manufacturability of MEMS at a fundamental level by addressing process development and characterization, material property characterization, failure mechanisms and physics of failure (POF), design strategies for improving yield, design for reliability (DFR), packaging and testing.
Download or read book Reliability Packaging Testing and Characterization of MEMS MOEMS IV written by Danelle Mary Tanner and published by SPIE-International Society for Optical Engineering. This book was released on 2005 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
Download or read book Reliability Packaging Testing and Characterization of MEMS MOEMS and Nanodevices IX written by Richard C. Kullberg and published by SPIE-International Society for Optical Engineering. This book was released on 2010 with total page 344 pages. Available in PDF, EPUB and Kindle. Book excerpt: Includes Proceedings Vol. 7821
Download or read book Springer Handbook of Nanotechnology written by Bharat Bhushan and published by Springer Science & Business Media. This book was released on 2010-04-23 with total page 1968 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since 2004 and with the 2nd edition in 2006, the Springer Handbook of Nanotechnology has established itself as the definitive reference in the nanoscience and nanotechnology area. It integrates the knowledge from nanofabrication, nanodevices, nanomechanics, Nanotribology, materials science, and reliability engineering in just one volume. Beside the presentation of nanostructures, micro/nanofabrication, and micro/nanodevices, special emphasis is on scanning probe microscopy, nanotribology and nanomechanics, molecularly thick films, industrial applications and microdevice reliability, and on social aspects. In its 3rd edition, the book grew from 8 to 9 parts now including a part with chapters on biomimetics. More information is added to such fields as bionanotechnology, nanorobotics, and (bio)MEMS/NEMS, bio/nanotribology and bio/nanomechanics. The book is organized by an experienced editor with a universal knowledge and written by an international team of over 150 distinguished experts. It addresses mechanical and electrical engineers, materials scientists, physicists and chemists who work either in the nano area or in a field that is or will be influenced by this new key technology.
Download or read book Electrical Contacts written by Paul G. Slade and published by CRC Press. This book was released on 2017-12-19 with total page 1314 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covering the theory, application, and testing of contact materials, Electrical Contacts: Principles and Applications, Second Edition introduces a thorough discussion on making electric contact and contact interface conduction; presents a general outline of, and measurement techniques for, important corrosion mechanisms; considers the results of contact wear when plug-in connections are made and broken; investigates the effect of thin noble metal plating on electronic connections; and relates crucial considerations for making high- and low-power contact joints. It examines contact use in switching devices, including the interruption of AC and DC circuits with currents in the range 10mA to 100kA and circuits up to 1000V, and describes arc formation between open contacts and between opening contacts. Arcing effects on contacts such as erosion, welding, and contamination are also addressed. Containing nearly 3,000 references, tables, equations, figures, drawings, and photographs, the book provides practical examples encompassing everything from electronic circuits to high power circuits, or microamperes to mega amperes. The new edition: Reflects the latest advances in electrical contact science and technology Examines current research on contact corrosion, materials, and switching Includes updates and revisions in each chapter, as well as up-to-date references and new figures and examples throughout Delivers three new chapters on the effects of dust contamination, electronic sensing for switching systems, and contact phenomena for micro-electronic systems (MEMS) applications With contributions from recognized experts in the field, Electrical Contacts: Principles and Applications, Second Edition assists practicing scientists and engineers in the prevention of costly system failures, as well as offers a comprehensive introduction to the subject for technology graduate students, by expanding their knowledge of electrical contact phenomena.
Download or read book Handbook of Force Transducers written by Dan Mihai Stefanescu and published by Springer Science & Business Media. This book was released on 2011-03-16 with total page 634 pages. Available in PDF, EPUB and Kindle. Book excerpt: Part I introduces the basic "Principles and Methods of Force Measurement" according to a classification into a dozen of force transducers types: resistive, inductive, capacitive, piezoelectric, electromagnetic, electrodynamic, magnetoelastic, galvanomagnetic (Hall-effect), vibrating wires, (micro)resonators, acoustic and gyroscopic. Two special chapters refer to force balance techniques and to combined methods in force measurement. Part II discusses the "(Strain Gauge) Force Transducers Components", evolving from the classical force transducer to the digital / intelligent one, with the incorporation of three subsystems (sensors, electromechanics and informatics). The elastic element (EE) is the "heart" of the force transducer and basically determines its performance. A 12-type elastic element classification is proposed (stretched / compressed column or tube, bending beam, bending and/or torsion shaft, middle bent bar with fixed ends, shear beam, bending ring, yoke or frame, diaphragm, axial-stressed torus, axisymmetrical and voluminous EE), with emphasis on the optimum location of the strain gauges. The main properties of the associated Wheatstone bridge, best suited for the parametrical transducers, are examined, together with the appropriate electronic circuits for SGFTs. The handbook fills a gap in the field of Force Measurement, both experts and newcomers, no matter of their particular interest, finding a lot of useful and valuable subjects in the area of Force Transducers; in fact, it is the first specialized monograph in this inter- and multidisciplinary field.
Download or read book Development of CMOS MEMS NEMS Devices written by Jaume Verd and published by MDPI. This book was released on 2019-06-25 with total page 166 pages. Available in PDF, EPUB and Kindle. Book excerpt: Micro and nano-electro-mechanical system (M/NEMS) devices constitute key technological building blocks to enable increased additional functionalities within Integrated Circuits (ICs) in the More-Than-Moore era, as described in the International Technology Roadmap for Semiconductors. The CMOS ICs and M/NEMS dies can be combined in the same package (SiP), or integrated within a single chip (SoC). In the SoC approach the M/NEMS devices are monolithically integrated together with CMOS circuitry allowing the development of compact and low-cost CMOS-M/NEMS devices for multiple applications (physical sensors, chemical sensors, biosensors, actuators, energy actuators, filters, mechanical relays, and others). On-chip CMOS electronics integration can overcome limitations related to the extremely low-level signals in sub-micrometer and nanometer scale electromechanical transducers enabling novel breakthrough applications. This Special Issue aims to gather high quality research contributions dealing with MEMS and NEMS devices monolithically integrated with CMOS, independently of the final application and fabrication approach adopted (MEMS-first, interleaved MEMS, MEMS-last or others).]
Download or read book Aerospace Science and Engineering written by Andrea Alaimo and published by Materials Research Forum LLC. This book was released on 2024-07-05 with total page 209 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Aerospace PhD Days are organized by the Italian Association of Aeronautics and Astronautics, AIDAA, and are open to PhD students working on Aerospace Science and Engineering topics. The 2024 proceedings edition has 42 presentations, with authors from more than ten institutions, including delegates from China, Germany, Lithuania, and Switzerland. Many aerospace disciplines and topics were covered, such as fluid dynamics, structures, stratospheric balloons, maintenance and operations, UAV, dynamics and control, space systems, sustainability of aeronautics and space, aeroelasticity, multiphysics, space debris, aeroacoustics, navigation and traffic management, additive manufacturing, and human-machine interaction. Keywords: Luid Dynamics, Structures, Stratospheric Balloons, Maintenance and Operations, UAV, Dynamics and Control, Space Systems, Sustainability of Aeronautics and Space, Aeroelasticity, Multiphysics, Space Debris, Aeroacoustics, Navigation and Traffic Management, Additive Manufacturing, Human-Machine Interaction.
Download or read book Microelectronics and Signal Processing written by Sanket Goel and published by CRC Press. This book was released on 2021-06-06 with total page 283 pages. Available in PDF, EPUB and Kindle. Book excerpt: Discusses state-of-the-art and the realization of the integrated device to test the amplification proposal of a synthetic nucleic acid template. It covers the control algorithm for designing the Maximum Power Point Tracker (MPPT) enabled electrical interface system. Discusses designing and generating new metasurface antenna for future applications. Covers integration of optical structures with MEMS devices for implementation in Photonic Integrated Circuits. Presents state-of-art in-exact multiplier architectures and their efficient implementation.
Download or read book 3D and Circuit Integration of MEMS written by Masayoshi Esashi and published by John Wiley & Sons. This book was released on 2021-03-16 with total page 528 pages. Available in PDF, EPUB and Kindle. Book excerpt: Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.
Download or read book Biosensing with Silicon written by Enakshi Bhattacharya and published by Springer Nature. This book was released on 2022-01-01 with total page 115 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses two silicon biosensors: an electrochemical sensor – the Electrolyte Insulator Silicon Capacitor (EISCAP), and a mechanical resonant cantilever sensor. The author presents the principle and the technology behind the device fabrication and miniaturization, stable and reproducible functionalization protocols for bioreceptor immobilization, and the measurement and the data analysis for extracting the best performance from these sensors. EISCAP sensors, used for the estimation of triglycerides and urea, have been improved through the use of micromachining processes. The miniaturization brought out advantages as well as challenges which are discussed in this book, resulting in a prototype mini-EISCAP with a readout circuit for fast and accurate estimation of triglycerides. The author also reports on the sensitivity improvements in the estimation of triglycerides and urea obtained with the polycrystalline silicon cantilever and its measurements in liquid media. The book is ideal for materials scientists and engineers working in the field of biosensors and MicroElectroMechanical systems (MEMS) and their optimizations, as well as researchers with biochemical or biomedical expertise, in order to have a fresh and updated review on the last progresses reached with EISCAPs and cantilever sensors.
Download or read book Electronic Enclosures Housings and Packages written by Frank Suli and published by Woodhead Publishing. This book was released on 2018-11-01 with total page 490 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions.
Download or read book Adhesion Aspects in MEMS NEMS written by Seong H. Kim and published by CRC Press. This book was released on 2011-02-18 with total page 424 pages. Available in PDF, EPUB and Kindle. Book excerpt: Phenomena associated with the adhesion interaction of surfaces have been a critical aspect of micro- and nanosystem development and performance since the first MicroElectroMechanicalSystems(MEMS) were fabricated. These phenomena are ubiquitous in nature and are present in all systems, however MEMS devices are particularly sensitive to their effects owing to their small size and limited actuation force that can be generated. Extension of MEMS technology concepts to the nanoscale and development of NanoElectroMechanicalSystems(NEMS) will result in systems even more strongly influenced by surface forces. The book is divided into five parts as follows: Part 1: Understanding Through Continuum Theory; Part 2: Computer Simulation of Interfaces; Part 3: Adhesion and Friction Measurements; Part 4: Adhesion in Practical Applications; and Part 5: Adhesion Mitigation Strategies. This compilation constitutes the first book on this extremely important topic in the burgeoning field of MEMS/NEMS. It is obvious from the topics covered in this book that bountiful information is contained here covering understanding of surface forces and adhesion as well as novel ways to mitigate adhesion in MEMS/NEMS. This book should be of great interest to anyone engaged in the wonderful and fascinating field of MEMS/NEMS, as it captures the current R&D activity.
Download or read book Handbook of Industrial and Systems Engineering Second Edition written by Adedeji B. Badiru and published by CRC Press. This book was released on 2013-10-11 with total page 1480 pages. Available in PDF, EPUB and Kindle. Book excerpt: A new edition of a bestselling industrial and systems engineering reference, Handbook of Industrial and Systems Engineering, Second Edition provides students, researchers, and practitioners with easy access to a wide range of industrial engineering tools and techniques in a concise format. This edition expands the breadth and depth of coverage, emphasizing new systems engineering tools, techniques, and models. See What’s New in the Second Edition: Section covering safety, reliability, and quality Section on operations research, queuing, logistics, and scheduling Expanded appendix to include conversion factors and engineering, systems, and statistical formulae Topics such as control charts, engineering economy, health operational efficiency, healthcare systems, human systems integration, Lean systems, logistics transportation, manufacturing systems, material handling systems, process view of work, and Six Sigma techniques The premise of the handbook remains: to expand the breadth and depth of coverage beyond the traditional handbooks on industrial engineering. The book begins with a general introduction with specific reference to the origin of industrial engineering and the ties to the Industrial Revolution. It covers the fundamentals of industrial engineering and the fundamentals of systems engineering. Building on this foundation, it presents chapters on manufacturing, production systems, and ergonomics, then goes on to discuss economic and financial analysis, management, information engineering, and decision making. Two new sections examine safety, reliability, quality, operations research, queuing, logistics, and scheduling. The book provides an updated collation of the body of knowledge of industrial and systems engineering. The handbook has been substantively expanded from the 36 seminal chapters in the first edition to 56 landmark chapters in the second edition. In addition to the 20 new chapters, 11 of the chapters in the first edition have been updated with new materials. Filling the gap that exists between the traditional and modern practice of industrial and systems engineering, the handbook provides a one-stop resource for teaching, research, and practice.
Download or read book Reliability Packaging Testing and Characterization of MEMS MOEMS and Nanodevices X written by Sonia Garcia-Blanco and published by SPIE-International Society for Optical Engineering. This book was released on 2011 with total page 256 pages. Available in PDF, EPUB and Kindle. Book excerpt: Includes Proceedings Vol. 7821
Download or read book Microelectromechanical Systems Volume 1139 written by Srikar Vengallatore and published by Cambridge University Press. This book was released on 2009-06-23 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectromechanical systems (MEMS) have transitioned from a technology niche to a role of major industrial significance. The worldwide market for MEMS is now approximately $10 billion, and the total value of systems enabled by MEMS is several orders of magnitude higher than this figure. As the market has grown, the material and process sets have broadened and departed from their semiconductor roots. In addition to engineering materials, there is now great interest in integrating multifunctional nanomaterials, smart materials and biomaterials within MEMS/NEMS to enhance functionality, performance and reliability. The opportunities created by this integration have generated a vibrant research community working on new materials and processes. This book reflects the breadth of topics currently under investigation in the field. Novel materials and accompanying processes are discussed, as are more conventional materials and processes. Consistent themes are the need for accurate material property assessment at the relevant length scales and for suitable metrology tools to support the introduction of new materials.
Download or read book Reliability Packaging Testing and Characterization of MEMS MOEMS and Nanodevices XI written by Sonia M. García-Blanco and published by SPIE-International Society for Optical Engineering. This book was released on 2012 with total page 174 pages. Available in PDF, EPUB and Kindle. Book excerpt: Includes Proceedings Vol. 7821
