Download or read book Reliability and Quality in Microelectronic Manufacturing written by A. Christou and published by RIAC. This book was released on 2006 with total page 410 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Opportunities in Manufacturing Research in the Process Industries written by Henry A. McGee and published by . This book was released on 1992 with total page 76 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings of AF SD Industry NASA Conference and Workshops on Mission Assurance written by and published by . This book was released on 1984 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microelectronics Failure Analysis written by and published by ASM International. This book was released on 2004-01-01 with total page 813 pages. Available in PDF, EPUB and Kindle. Book excerpt: For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron
Download or read book Handbook of Electronic Package Design written by Michael Pecht and published by CRC Press. This book was released on 2018-10-24 with total page 904 pages. Available in PDF, EPUB and Kindle. Book excerpt: Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development
Download or read book Advances in Automation Prompt Concern Over Increased U S Unemployment written by United States. General Accounting Office and published by . This book was released on 1982 with total page 52 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 1976 NASA Authorization written by United States. Congress. House. Committee on Science and Technology and published by . This book was released on 1975 with total page 1020 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Quality Conformance and Qualification of Microelectronic Packages and Interconnects written by Michael Pecht and published by John Wiley & Sons. This book was released on 1994-12-13 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt: All packaging engineers and technologists who want to ensure thatthey give their customers the highest quality, most cost-effectiveproducts should know that the paradigm has shifted. It has shiftedaway from the MIL-STDs and other government standards and testprocedures that don't cost-effectively address potential failuremechanisms or the manufacturing processes of the product. It hasshifted decisively towards tackling the root causes of failure andthe appropriate implementation of cost-effective process controls,qualityscreens, and tests. This book's groundbreaking, science-based approach to developingqualification and quality assurance programs helps engineers reacha new level of reliability in today's high-performancemicroelectronics. It does this with powerful... * Techniques for identifying and modeling failure mechanismsearlier in the design cycle, breaking the need to rely on fielddata * Physics-of-failure product reliability assessment methods thatcan be proactively implemented throughout the design andmanufacture of the product * Process controls that decrease variabilities in the end productand reduce end-of-line screening and testing A wide range of microelectronic package and interconnectconfigurations for both single-and multi-chip modules is examined,including chip and wire-bonds, tape-automated (TAB), flip-TAB,flip-chip bonds, high-density interconnects, chip-on-board designs(COB), MCM, 3-D stack, and many more. The remaining packageelements, such as die attachment, case and lid, leads, and lid andlead seals are also discussed in detail. The product of a distinguished team of authors and editors, thisbook's guidelines for avoiding potential high-risk manufacturingand qualification problems, as well as for implementing ongoingquality assurance, are sure to prove invaluable to both studentsand practicing professionals. For the professional engineer involved in the design andmanufacture of products containing electronic components, here is acomprehensive handbook to the theory and methods surrounding theassembly of microelectronic and electronic components. The bookfocuses on computers and consumer electronic products with internalsubsystems that reflect mechanical design constraints, costlimitations, and aesthetic and ergonomic concerns. Taking a totalsystem approach to packaging, the book systematically examines:basic chip and computer architecture; design and layout;interassembly and interconnections; cooling scheme; materialsselection, including ceramics, glasses, and metals; stress,vibration, and acoustics; and manufacturing and assemblytechnology. 1994 (0-471-53299-1) 800 pp. INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGNGUIDELINES: A Focus on Reliability --Michael Pecht This comprehensive guide features a uniquely organized time-phasedapproach to design, development, qualification, manufacture, andin-service management. It provides step-by-step instructions on howto define realistic system requirements, define the system usageenvironment, identify potential failure modes, characterizematerials and processes by the key control label factors, and useexperiment, step-stress, and accelerated methods to ensure optimumdesign before production begins. Topics covered include: detaileddesign guidelines for substrate...wire and wire, tape automated,and flip-chip bonding...element attachment and case, lead, lead andlid seals--incorporating dimensional and geometric configurationsof package elements, manufacturing and assembly conditions,materials selection, and loading conditions. 1993 (0-471-59446-6)454 pp.
Download or read book 1976 NASA Authorization Hearing Before 94 1 written by United States. Congress. House Science and Technology Committee and published by . This book was released on 1975 with total page 1028 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Design of Experiments for Engineers and Scientists written by Jiju Antony and published by Elsevier. This book was released on 2023-06-02 with total page 296 pages. Available in PDF, EPUB and Kindle. Book excerpt: This third edition of Design of Experiments for Engineers and Scientists adds to the tried and trusted tools that were successful in so many engineering organizations with new coverage of design of experiments (DoE) in the service sector. Case studies are updated throughout, and new ones are added on dentistry, higher education, and utilities. Although many books have been written on DoE for statisticians, this book overcomes the challenges a wider audience faces in using statistics by using easy-to-read graphical tools. Readers will find the concepts in this book both familiar and easy to understand, and users will soon be able to apply them in their work or research. This classic book is essential reading for engineers and scientists from all disciplines tackling all kinds of product and process quality problems and will be an ideal resource for students of this topic. - Written in nonstatistical language, the book is an essential and accessible text for scientists and engineers who want to learn how to use DoE - Explains why teaching DoE techniques in the improvement phase of Six Sigma is an important part of problem-solving methodology - New edition includes two new chapters on DoE for services as well as case studies illustrating its wider application in the service industry
Download or read book Space Benefits written by United States. National Aeronautics and Space Administration. Technology Utilization Office and published by . This book was released on 1975 with total page 60 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microelectronics Manufacturing Diagnostics Handbook written by Abraham Landzberg and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 663 pages. Available in PDF, EPUB and Kindle. Book excerpt: The world of microelectronics is filled with cusses measurement systems, manufacturing many success stories. From the use of semi control techniques, test, diagnostics, and fail ure analysis. It discusses methods for modeling conductors for powerful desktop computers to their use in maintaining optimum engine per and reducing defects, and for preventing de formance in modem automobiles, they have fects in the first place. The approach described, clearly improved our daily lives. The broad while geared to the microelectronics world, has useability of the technology is enabled, how applicability to any manufacturing process of similar complexity. The authors comprise some ever, only by the progress made in reducing their cost and improving their reliability. De of the best scientific minds in the world, and fect reduction receives a significant focus in our are practitioners of the art. The information modem manufacturing world, and high-quality captured here is world class. I know you will diagnostics is the key step in that process. find the material to be an excellent reference in of product failures enables step func Analysis your application. tion improvements in yield and reliability. which works to reduce cost and open up new Dr. Paul R. Low applications and technologies. IBM Vice President and This book describes the process ofdefect re of Technology Products General Manager duction in the microelectronics world.
Download or read book Space Microelectronics Volume 2 Integrated Circuit Design for Space Applications written by Anatoly Belous and published by Artech House. This book was released on 2017-07-31 with total page 629 pages. Available in PDF, EPUB and Kindle. Book excerpt: This invaluable second volume of a two-volume set is filled with details about the integrated circuit design for space applications. Various considerations for the selection and application of electronic components for designing spacecraft are discussed. The basic constructions of submicron transistors and schottky diodes during the technological process of production are explored. This book provides details on the energy consumption minimization methods for microelectronic devices. Specific topics include: Features and physical mechanisms of the effect of space radiation on all the main classes of microcircuits, including peculiarities of radiation impact on submicron integrated circuits;Special design, technology, and schematic methods of increasing the resistance to various types of space radiation;Recommendations for choosing research equipment and methods for irradiating various samples;Microcircuit designers on the composition of test elements for the study of the effect of radiation;Microprocessors, circuit boards, logic microcircuits, digital, analog, digital–analog microcircuits manufactured in various technologies (bipolar, CMOS, BiCMOS, SOI);Problems involved with designing high speed microelectronic devices and systems based on SOS-and SOI-structures;System-on-chip and system-in-package and methods for rejection of silicon microcircuits with hidden defects during mass production.
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1991 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Department of Housing and Urban Development independent Agencies Appropriations for 1977 written by United States. Congress. House. Committee on Appropriations. Subcommittee on HUD-Independent Agencies and published by . This book was released on 1976 with total page 952 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book In line Characterization Yield Reliability and Failure Analysis in Microelectronics Manufacturing written by and published by . This book was released on 2001 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Improving Product Reliability and Software Quality written by Mark A. Levin and published by John Wiley & Sons. This book was released on 2019-04-16 with total page 473 pages. Available in PDF, EPUB and Kindle. Book excerpt: The authoritative guide to the effective design and production of reliable technology products, revised and updated While most manufacturers have mastered the process of producing quality products, product reliability, software quality and software security has lagged behind. The revised second edition of Improving Product Reliability and Software Quality offers a comprehensive and detailed guide to implementing a hardware reliability and software quality process for technology products. The authors – noted experts in the field – provide useful tools, forms and spreadsheets for executing an effective product reliability and software quality development process and explore proven software quality and product reliability concepts. The authors discuss why so many companies fail after attempting to implement or improve their product reliability and software quality program. They outline the critical steps for implementing a successful program. Success hinges on establishing a reliability lab, hiring the right people and implementing a reliability and software quality process that does the right things well and works well together. Designed to be accessible, the book contains a decision matrix for small, medium and large companies. Throughout the book, the authors describe the hardware reliability and software quality process as well as the tools and techniques needed for putting it in place. The concepts, ideas and material presented are appropriate for any organization. This updated second edition: Contains new chapters on Software tools, Software quality process and software security. Expands the FMEA section to include software fault trees and software FMEAs. Includes two new reliability tools to accelerate design maturity and reduce the risk of premature wearout. Contains new material on preventative maintenance, predictive maintenance and Prognostics and Health Management (PHM) to better manage repair cost and unscheduled downtime. Presents updated information on reliability modeling and hiring reliability and software engineers. Includes a comprehensive review of the reliability process from a multi-disciplinary viewpoint including new material on uprating and counterfeit components. Discusses aspects of competition, key quality and reliability concepts and presents the tools for implementation. Written for engineers, managers and consultants lacking a background in product reliability and software quality theory and statistics, the updated second edition of Improving Product Reliability and Software Quality explores all phases of the product life cycle.
