Download or read book Proceedings of the Symposium on Thin Film Phenomena Interfaces and Interactions written by John E. E. Baglin and published by . This book was released on 1978 with total page 544 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Proceedings of the Symposium on Thin Film Interfaces and Interactions written by John E. E. Baglin and published by . This book was released on 1980 with total page 564 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Proceedings of the Symposium on Electron Ion and Laser Beam Technology written by and published by . This book was released on 1979 with total page 646 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Semiconductors and Semimetals written by and published by Academic Press. This book was released on 1984-12-20 with total page 471 pages. Available in PDF, EPUB and Kindle. Book excerpt: Semiconductors and Semimetals

Download or read book Proceedings of the 1973 Conference on Thin Film Phenomena 15 16 March 1973 IBM Research Laboratory San Jose Calif written by and published by . This book was released on 1973 with total page 172 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Extended Abstracts written by Electrochemical Society and published by . This book was released on 1981 with total page 766 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Influence of Temperature on Microelectronics and System Reliability written by Pradeep Lall and published by CRC Press. This book was released on 2020-07-09 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The

Download or read book Experimental Innovations in Surface Science written by John T. Yates Jr. and published by Springer. This book was released on 2015-08-17 with total page 637 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a new edition of a classic text on experimental methods and instruments in surface science. It offers practical insight useful to chemists, physicists, and materials scientists working in experimental surface science. This enlarged second edition contains almost 300 descriptions of experimental methods. The more than 50 active areas with individual scientific and measurement concepts and activities relevant to each area are presented in this book. The key areas covered are: Vacuum System Technology, Mechanical Fabrication Techniques, Measurement Methods, Thermal Control, Delivery of Adsorbates to Surfaces, UHV Windows, Surface Preparation Methods, High Area Solids, Safety. The book is written for researchers and graduate students.

Download or read book Proceedings of the Seventh Annual Conference on the Physics of Compound Semiconductor Interfaces written by Robert S. Bauer and published by . This book was released on 1980 with total page 294 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Proceedings of the Fifth International Symposium on Diamond Materials written by Electrochemical Society. Meeting and published by The Electrochemical Society. This book was released on 1998 with total page 718 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Proceedings written by and published by . This book was released on 1980 with total page 576 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Index of Conference Proceedings Received written by British Library. Lending Division and published by . This book was released on 1984 with total page 644 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Index of Conference Proceedings Received written by British Library. Document Supply Centre and published by . This book was released on 1987 with total page 792 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Electronics Packaging Forum written by James E. Morris and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 459 pages. Available in PDF, EPUB and Kindle. Book excerpt: Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be clear as to what might be expected by way of content and level of each chapter.

Download or read book Scientific and Technical Books and Serials in Print written by and published by . This book was released on 1989 with total page 1216 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Catalog of Copyright Entries Fourth Series written by Library of Congress. Copyright Office and published by . This book was released on 1978-10 with total page 2158 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Ion Beam Analysis written by H. H. Andersen and published by Elsevier. This book was released on 2017-01-31 with total page 640 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nuclear Instruments and Methods, Volume 168: Ion Beam Analysis presents the proceedings of the Fourth International Conference on Ion Beam Analysis, held in Aarhus, Denmark, on June 25–29, 1979. This book provides information pertinent to the methods and applications ion beam analysis. Organized into eight parts encompassing 95 chapters, this volume begins with an overview of the straggling of energy loss for protons and alpha particles. This text then examines the method for the calculation of the stopping of energetic ions in matter. Other chapters consider the method for measuring relative stopping powers for light energetic ions in highly reactive materials. This book discusses as well the stopping power and straggling of lithium ions with velocities around the Bohr velocity. The final chapter deals with the adsorption behavior of different gases on monocrystalline platinum surfaces. This book is a valuable resource for scientists, technologists, students, and research workers.