Download or read book Proceedings of the Symposia on Interconnects Contact Metallization and Multilevel Metallization and Reliability for Semiconductor Devices Interconnects and Thin Insulator Materials written by T. O. Herndon and published by . This book was released on 1993 with total page 520 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings of the Symposia on Reliability of Semiconductor Devices and Interconnection and Multilevel Metallization Interconnection and Contact Technologies written by Harzara S. Rathore and published by . This book was released on 1989 with total page 516 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Cleaning Technology in Semiconductor Device Manufacturing written by and published by The Electrochemical Society. This book was released on 2000 with total page 636 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Handbook for Cleaning for Semiconductor Manufacturing written by Karen A. Reinhardt and published by John Wiley & Sons. This book was released on 2011-04-12 with total page 596 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides an In-depth discussion of surface conditioning for semiconductor applications The Handbook of Cleaning for Semiconductor Manufacturing: Fundamentals and Applications provides an in-depth discussion of surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet processing is reviewed as well as surface and colloidal aspects of cleaning and etching. Topics covered in this new reference include: Front end line (FEOL) and back end of line (BEOL) cleaning applications such as high-k/metal gate post-etch cleaning and pore sealing, high-dose implant stripping and cleaning, and germanium, and silicon passivation Formulation development practices, methodology and a new directions are presented including chemicals used for preventing corrosion of copper lines, cleaning aluminium lines, reclaiming wafers, and water bonding, as well as the filtering and recirculating of chemicals including reuse and recycling Wetting, cleaning, and drying of features, such as high aspect ratio features and hydrophilic surface states, especially how to dry without watermarks, the abilities to wet hydrophobic surfaces and to remove liquid from deep features The chemical reactions and mechanisms of silicon dioxide etching with hydrofluoric acid, particle removal with ammonium hydroxide/hydrogen peroxide mixture, and metal removal with hydrochloric acid The Handbook of Cleaning for Semiconductor Manufacturing: Fundamentals and Applications is a valuable resource for any engineer or manager associated with using or supplying cleaning and contamination free technologies for semiconductor manufacturing. Engineers working for semiconductor manufacturing, capital equipment, chemicals, or other industries that assures cleanliness of chemicals, material, and equipment in the manufacturing area will also find this handbook an indispensible reference.
Download or read book Cleaning Technology in Semiconductor Device Manufacturing written by and published by . This book was released on 2000 with total page 636 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Optical Characterization Techniques for High performance Microelectronic Device Manufacturing written by and published by . This book was released on 1995 with total page 324 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Handbook of Thin Film Deposition Techniques Principles Methods Equipment and Applications Second Editon written by Krishna Seshan and published by CRC Press. This book was released on 2002-02-01 with total page 72 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Handbook of Thin Film Deposition Techniques: Principles, Methods, Equipment and Applications, Second Edition explores the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition tec
Download or read book Index of Conference Proceedings written by and published by . This book was released on 1994 with total page 976 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Interconnect and Contact Metallization for ULSI written by G. S. Mathad and published by The Electrochemical Society. This book was released on 2000 with total page 358 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings of the Symposium on Interconnect and Contact Metallization written by Harzara S. Rathore and published by The Electrochemical Society. This book was released on 1998 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Handbook of Thin Film Deposition Processes and Techniques written by Krishna Seshan and published by William Andrew. This book was released on 2001-02-01 with total page 430 pages. Available in PDF, EPUB and Kindle. Book excerpt: New second edition of the popular book on deposition (first edition by Klaus Schruegraf) for engineers, technicians, and plant personnel in the semiconductor and related industries. This book traces the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition techniques and the development of highly specialized equipment to enable this deposition. The book includes much cutting-edge material. Entirely new chapters on contamination and contamination control describe the basics and the issues—as feature sizes shrink to sub-micron dimensions, cleanliness and particle elimination has to keep pace. A new chapter on metrology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together all the physical vapor deposition techniques. Two entirely new areas receive full treatment: chemical mechanical polishing which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.
Download or read book Development of Conventional and Time of flight Neutron Depth Profiling at Cornell written by Zhiqiang Li and published by . This book was released on 2002 with total page 234 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings of the Symposium on Electromigration of Metals and First International Symposium on Multilevel Metallization and Packaging written by James R. Lloyd and published by . This book was released on 1985 with total page 214 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings of the Symposium on Multilevel Metallization Interconnection and Contact Technologies written by L B. Rothman and published by . This book was released on 1987 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Chemical Abstracts Service Source Index written by American Chemical Society. Chemical Abstracts Service and published by . This book was released on 1907 with total page 2064 pages. Available in PDF, EPUB and Kindle. Book excerpt: A key source to journal and conference abbreviations in the sciences. Although it focuses on chemistry, other scientific and engineering disciplines are also well represented. In addition to the abbreviation and full title, each entry also contains publishing info, title changes, language and frequency of publication, and libraries owning that title. Over 130,000 entries representing more than 70,000 publications dating back to 1907 are included.
Download or read book Handbook of Thin Film Deposition written by Krishna Seshan and published by William Andrew. This book was released on 2012-06-27 with total page 412 pages. Available in PDF, EPUB and Kindle. Book excerpt: Resumen: The 2nd edition contains new chapters on contamination and contamination control that describe the basics and the issues. Another new chapter on meteorology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together physical vapor deposition techniques. Two entirely new areas are focused on: chemical mechanical polishing, which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.
Download or read book Subject Guide to Books in Print written by and published by . This book was released on 1997 with total page 3310 pages. Available in PDF, EPUB and Kindle. Book excerpt: