Download or read book Proceedings of the Second International Symposium on Chemical Mechanical Planariarization sic in Integrated Circuit Device Manufacturing written by Robert Leon Opila and published by The Electrochemical Society. This book was released on 1998 with total page 290 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Chemical Mechanical Planarization in IC Device Manufacturing III written by Robert Leon Opila and published by The Electrochemical Society. This book was released on 2000 with total page 664 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume contains the proceedings of the third international symposium on Chemical Mechanical Planarization integrated circuit device manufacturing held at the 196th Meeting of the Electrochemical Society in Honolulu, Hawaii. ( October 20 -22 1999).
Download or read book Cumulated Index to the Books written by and published by . This book was released on 1999 with total page 1134 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book American Book Publishing Record written by and published by . This book was released on 1999 with total page 734 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Chemical Mechanical Planariarization in Integrated Circuit Device Manufacturing written by S. Raghavan and published by . This book was released on 1998 with total page 273 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings of the First International Symposium on Chemical Mechanical Planarization written by Iqbal Ali and published by The Electrochemical Society. This book was released on 1997 with total page 294 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Chemical Mechanical Planarization IV written by R. L. Opila and published by The Electrochemical Society. This book was released on 2001 with total page 350 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Chemical Mechanical Planarization VI written by Sudipta Seal and published by The Electrochemical Society. This book was released on 2003 with total page 370 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings of the Third Symposium on Automated Integrated Circuits Manufacturing written by Joseph B. Anthony and published by . This book was released on 1988 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings of the Fifth Symposium on Automated Integrated Circuits Manufacturing written by Vaughn E. Akins and published by . This book was released on 1990 with total page 302 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings of the Second International CIRP Seminar on New Manufacturing Technology written by and published by . This book was released on 1989 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Chemical Mechanical Planarization V written by Sudipta Seal and published by Electrochemical Society. This book was released on 2002 with total page 274 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 16th European Symposium on Computer Aided Process Engineering and 9th International Symposium on Process Systems Engineering written by W. Marquardt and published by . This book was released on 2006 with total page 2254 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Interfacial Forces in Chemical mechanical Polishing CMP written by Dedy Ng and published by . This book was released on 2010 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The demand for microelectronic device miniaturization requires new concepts and technology improvement in the integrated circuits fabrication. In last two decades, Chemical-Mechanical Polishing (CMP) has emerged as the process of choice for planarization. The process takes place at the interface of a substrate, a polishing pad, and an abrasive containing slurry. This synergetic process involves several forces in multi-length scales and multi-mechanisms. This research contributes fundamental understanding of surface and interface sciences of microelectronic materials with three major objectives. In order to extend the industrial impact of this research, the chemical-mechanical polishing (CMP) is used as a model system for this study. The first objective of this research is to investigate the interfacial forces in the CMP system. For the first time, the interfacial forces are discussed systematically and comparatively so that key forces in CMP can be pinpointed. The second objective of this research is to understand the basic principles of lubrication, i.e., fluid drag force that can be used to monitor, evaluate, and optimize CMP processes. New parameters were introduced to include the change of material properties during CMP. Using the experimental results, a new equation was developed to understand the principle of lubrication behind the CMP. The third objective is to study the synergy of those interfacial forces with electrochemistry. The electro-chemical-mechanical polishing (ECMP) of copper was studied. Experiments were conducted on the tribometer in combination with a potentiostat. Friction coefficient was used to monitor the polishing process and correlated with the wear behavior of post-CMP samples. Surface characterization was performed using AFM, SEM, and XPS techniques. Results from experiments were used to generate a new wear model, which provided insight from CMP mechanisms. The ECMP is currently the newest technique used in the semiconductor industries. This research is expected to contribute to the CMP technology and improve its process performance. This dissertation consists of six chapters. The first chapter covers the introduction and background information of surface forces and CMP. The motivation and objectives are discussed in the second chapter. The three major objectives which include approaches and expected results are covered in the next three chapters. Finally chapter VI summarizes the major discovery in this research and provides some recommendations for future work.
Download or read book Proceedings of the Second International Conference on Foundations of Computer aided Process Design written by and published by . This book was released on 1984 with total page 1042 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Grinding and Lapping written by and published by . This book was released on 1909 with total page 54 pages. Available in PDF, EPUB and Kindle. Book excerpt:
