Download or read book Proceedings written by and published by . This book was released on 2003 with total page 494 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Index of Conference Proceedings written by British Library. Document Supply Centre and published by . This book was released on 2003 with total page 870 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Proceedings of the Second International Conference on Soft Computing for Problem Solving SocProS 2012 December 28 30 2012 written by B. V. Babu and published by Springer. This book was released on 2014-07-08 with total page 1529 pages. Available in PDF, EPUB and Kindle. Book excerpt: The present book is based on the research papers presented in the International Conference on Soft Computing for Problem Solving (SocProS 2012), held at JK Lakshmipat University, Jaipur, India. This book provides the latest developments in the area of soft computing and covers a variety of topics, including mathematical modeling, image processing, optimization, swarm intelligence, evolutionary algorithms, fuzzy logic, neural networks, forecasting, data mining, etc. The objective of the book is to familiarize the reader with the latest scientific developments that are taking place in various fields and the latest sophisticated problem solving tools that are being developed to deal with the complex and intricate problems that are otherwise difficult to solve by the usual and traditional methods. The book is directed to the researchers and scientists engaged in various fields of Science and Technology.

Download or read book Network on Chip Architectures written by Chrysostomos Nicopoulos and published by Springer Science & Business Media. This book was released on 2009-09-18 with total page 237 pages. Available in PDF, EPUB and Kindle. Book excerpt: [2]. The Cell Processor from Sony, Toshiba and IBM (STI) [3], and the Sun UltraSPARC T1 (formerly codenamed Niagara) [4] signal the growing popularity of such systems. Furthermore, Intel’s very recently announced 80-core TeraFLOP chip [5] exemplifies the irreversible march toward many-core systems with tens or even hundreds of processing elements. 1.2 The Dawn of the Communication-Centric Revolution The multi-core thrust has ushered the gradual displacement of the computati- centric design model by a more communication-centric approach [6]. The large, sophisticated monolithic modules are giving way to several smaller, simpler p- cessing elements working in tandem. This trend has led to a surge in the popularity of multi-core systems, which typically manifest themselves in two distinct incarnations: heterogeneous Multi-Processor Systems-on-Chip (MPSoC) and homogeneous Chip Multi-Processors (CMP). The SoC philosophy revolves around the technique of Platform-Based Design (PBD) [7], which advocates the reuse of Intellectual Property (IP) cores in flexible design templates that can be customized accordingly to satisfy the demands of particular implementations. The appeal of such a modular approach lies in the substantially reduced Time-To- Market (TTM) incubation period, which is a direct outcome of lower circuit complexity and reduced design effort. The whole system can now be viewed as a diverse collection of pre-existing IP components integrated on a single die.

Download or read book The Chip Is the Network written by Radu Marculescu and published by Now Publishers Inc. This book was released on 2008-12-24 with total page 101 pages. Available in PDF, EPUB and Kindle. Book excerpt: Addresses the concept of network in three different contexts representing the deterministic, probabilistic, and statistical physics-inspired design paradigms.

Download or read book ATS 2003 written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 2003 with total page 544 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Asian Test Symposium provides an international forum for engineers and researchers from all countries of the World, especially from Asia, to present and discuss various aspects of system, board and device testing with design, manufacturing and field considerations in mind. ATS 2003's papers shares state-of-the-art ideas and technologies in testing.

Download or read book Statistical Analysis and Optimization for VLSI Timing and Power written by Ashish Srivastava and published by Springer Science & Business Media. This book was released on 2006-04-04 with total page 284 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covers the statistical analysis and optimization issues arising due to increased process variations in current technologies. Comprises a valuable reference for statistical analysis and optimization techniques in current and future VLSI design for CAD-Tool developers and for researchers interested in starting work in this very active area of research. Written by author who lead much research in this area who provide novel ideas and approaches to handle the addressed issues

Download or read book Cooling Of Microelectronic And Nanoelectronic Equipment Advances And Emerging Research written by Madhusudan Iyengar and published by World Scientific. This book was released on 2014-08-25 with total page 471 pages. Available in PDF, EPUB and Kindle. Book excerpt: To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.

Download or read book Low Power High Level Synthesis for Nanoscale CMOS Circuits written by Saraju P. Mohanty and published by Springer Science & Business Media. This book was released on 2008-05-31 with total page 325 pages. Available in PDF, EPUB and Kindle. Book excerpt: This self-contained book addresses the need for analysis, characterization, estimation, and optimization of the various forms of power dissipation in the presence of process variations of nano-CMOS technologies. The authors show very large-scale integration (VLSI) researchers and engineers how to minimize the different types of power consumption of digital circuits. The material deals primarily with high-level (architectural or behavioral) energy dissipation.

Download or read book Electronic Design Automation for IC Implementation Circuit Design and Process Technology written by Luciano Lavagno and published by CRC Press. This book was released on 2017-02-03 with total page 893 pages. Available in PDF, EPUB and Kindle. Book excerpt: The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on 3D circuit integration and clock design Offering improved depth and modernity, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.

Download or read book Integrated Circuit and System Design Power and Timing Modeling Optimization and Simulation written by Rene van Leuken and published by Springer. This book was released on 2011-01-16 with total page 270 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the refereed proceedings of the 20th International Conference on Integrated Circuit and System Design, PATMOS 2010, held in Grenoble, France, in September 2010. The 24 revised full papers presented and the 9 extended abstracts were carefully reviewed and are organized in topical sections on design flows; circuit techniques; low power circuits; self-timed circuits; process variation; high-level modeling of poweraware heterogeneous designs in SystemC-AMS; and minalogic.

Download or read book Encyclopedia Of Thermal Packaging Set 2 Thermal Packaging Tools A 4 volume Set written by and published by World Scientific. This book was released on 2014-10-23 with total page 1397 pages. Available in PDF, EPUB and Kindle. Book excerpt: remove This Encyclopedia comes in 3 sets. To check out Set 1 and Set 3, please visit Set 1: Thermal Packaging Techniques and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 2: Thermal Packaging ToolsThe second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order “compact” thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve “correct by design” thermal packaging solutions.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.

Download or read book Advances in Optical Science and Engineering written by Vasudevan Lakshminarayanan and published by Springer. This book was released on 2015-06-02 with total page 620 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Proceedings of First International Conference on Opto-Electronics and Applied Optics 2014, IEM OPTRONIX 2014 presents the research contributions presented in the conference by researchers from both India and abroad. Contributions from established scientists as well as students are included. The book is organized to enable easy access to various topics of interest. The first part includes the Keynote addresses by Phillip Russell, Max Planck Institute of the Light Sciences, Erlangen, Germany and Lorenzo Pavesi, University of Trento, Italy. The second part focuses on the Plenary Talks given by eminent scientists, namely, Azizur Rahman, City University London, London; Bishnu Pal, President, The Optical Society of India; Kamakhya Ghatak, National Institute of Technology, Agartala; Kehar Singh, Former Professor, India Institute of Technology Delhi; Mourad Zghal, SUPCOM, University of Carthage, Tunisia; Partha Roy Chaudhuri, IIT Kharagpur; S K. Bhadra, CSIR-Central Glass and Ceramic Research Institute, Kolkata; Sanjib Chatterjee, Raja Ramanna Centre for Advanced Technology, Indore; Takeo Sasaki, Tokyo University, Japan; Lakshminarayan Hazra, Emeritus Professor, University of Calcutta, Kolkata; Shyam Akashe, ITM University, Gwalior and Vasudevan Lakshminarayanan, University of Waterloo, Canada. The subsequent parts focus on topic-wise contributory papers in Application of Solar Energy; Diffraction Tomography; E.M. Radiation Theory and Antenna; Fibre Optics and Devices; Photonics for Space Applications; Micro-Electronics and VLSI; Nano-Photonics, Bio-Photonics and Bio-Medical Optics; Non-linear Phenomena and Chaos; Optical and Digital Data and Image Processing; Optical Communications and Networks; Optical Design; Opto-Electronic Devices; Opto-Electronic Materials and Quantum Optics and Information Processing.

Download or read book 16th International Conference on Information Technology New Generations ITNG 2019 written by Shahram Latifi and published by Springer. This book was released on 2019-05-22 with total page 652 pages. Available in PDF, EPUB and Kindle. Book excerpt: This 16th International Conference on Information Technology - New Generations (ITNG), continues an annual event focusing on state of the art technologies pertaining to digital information and communications. The applications of advanced information technology to such domains as astronomy, biology, education, geosciences, security and health care are among topics of relevance to ITNG. Visionary ideas, theoretical and experimental results, as well as prototypes, designs, and tools that help the information readily flow to the user are of special interest. Machine Learning, Robotics, High Performance Computing, and Innovative Methods of Computing are examples of related topics. The conference features keynote speakers, the best student award, poster award, service award, a technical open panel, and workshops/exhibits from industry, government and academia.

Download or read book Proceedings of Fifth International Conference on Soft Computing for Problem Solving written by Millie Pant and published by Springer. This book was released on 2016-03-19 with total page 1030 pages. Available in PDF, EPUB and Kindle. Book excerpt: The proceedings of SocProS 2015 will serve as an academic bonanza for scientists and researchers working in the field of Soft Computing. This book contains theoretical as well as practical aspects using fuzzy logic, neural networks, evolutionary algorithms, swarm intelligence algorithms, etc., with many applications under the umbrella of ‘Soft Computing’. The book will be beneficial for young as well as experienced researchers dealing across complex and intricate real world problems for which finding a solution by traditional methods is a difficult task. The different application areas covered in the proceedings are: Image Processing, Cryptanalysis, Industrial Optimization, Supply Chain Management, Newly Proposed Nature Inspired Algorithms, Signal Processing, Problems related to Medical and Health Care, Networking Optimization Problems, etc.

Download or read book Nanometer Variation Tolerant SRAM written by Mohamed Abu Rahma and published by Springer Science & Business Media. This book was released on 2012-09-27 with total page 176 pages. Available in PDF, EPUB and Kindle. Book excerpt: Variability is one of the most challenging obstacles for IC design in the nanometer regime. In nanometer technologies, SRAM show an increased sensitivity to process variations due to low-voltage operation requirements, which are aggravated by the strong demand for lower power consumption and cost, while achieving higher performance and density. With the drastic increase in memory densities, lower supply voltages, and higher variations, statistical simulation methodologies become imperative to estimate memory yield and optimize performance and power. This book is an invaluable reference on robust SRAM circuits and statistical design methodologies for researchers and practicing engineers in the field of memory design. It combines state of the art circuit techniques and statistical methodologies to optimize SRAM performance and yield in nanometer technologies. Provides comprehensive review of state-of-the-art, variation-tolerant SRAM circuit techniques; Discusses Impact of device related process variations and how they affect circuit and system performance, from a design point of view; Helps designers optimize memory yield, with practical statistical design methodologies and yield estimation techniques.

Download or read book Embedded Software and Systems written by Zhaohui Wu and published by Springer. This book was released on 2005-08-29 with total page 629 pages. Available in PDF, EPUB and Kindle. Book excerpt: Welcome to the post proceedings of the First International Conference on Embedded Software and Systems (ICESS 2004), which was held in Hangzhou, P. R. China, 9–10 December 2004. Embedded Software and Systems technology is of increasing importance for a wide range of industrial areas, such as aerospace, automotive, telecommunication, and manufacturing automation. Embedded technology is playing an increasingly dominant role in modern society. This is a natural outcome of amazingly fast developments in the embedded field. The ICESS 2004 conference brought together researchers and developers from academia, industry, and government to advance the science, engineering, and technology in embedded software and systems development, and provided them with a forum to present and exchange their ideas, results, work in progress, and experience in all areas of embedded systems research and development. The ICESS 2004 conference attracted much more interest than expected. The total number of paper submissions to the main conference and its three workshops, namely, Pervasive Computing, Automobile Electronics and Tele-communication, was almost 400, from nearly 20 countries and regions. All submissions were reviewed by at least three Program or Technical Committee members or external reviewers. It was extremely difficult to make the final decision on paper acceptance because there were so many excellent, foreseeing, and interesting submissions with brilliant ideas.