Download or read book Proceedings of the Eastern Manufacturing Technology Conference written by and published by . This book was released on 1987 with total page 254 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Advances in Manufacturing Technology XXXIV written by M. Shafik and published by IOS Press. This book was released on 2021-09-23 with total page 442 pages. Available in PDF, EPUB and Kindle. Book excerpt: The development of technologies and management of operations is key to sustaining the success of manufacturing businesses, and since the late 1970s, the International Conference on Manufacturing Research (ICMR) has been a major annual event for academics and industrialists engaged in manufacturing research. The conference is renowned as a friendly and inclusive platform that brings together a broad community of researchers who share a common goal. This book presents the proceedings of ICMR2021, the 18th International Conference on Manufacturing Research, incorporating the 35th National Conference on Manufacturing Research, and held in Derby, UK, from 7 to 10 September 2021. The theme of the ICMR2021 conference is digital manufacturing. Within the context of Industrial 4.0, ICMR2021 provided a platform for researchers, academics and industrialists to share their vision, knowledge and experience, and to discuss emerging trends and new challenges in the field. The 60 papers included in the book are divided into 10 parts, each covering a different area of manufacturing research. These are: digital manufacturing, smart manufacturing; additive manufacturing; robotics and industrial automation; composite manufacturing; machining processes; product design and development; information and knowledge management; lean and quality management; and decision support and production optimization. The book will be of interest to all those involved in developing and managing new techniques in manufacturing industry.

Download or read book Proceedings of the International Machinery Monitoring Diagnostics Conference Exhibit written by and published by . This book was released on 1989 with total page 958 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Towards Sustainable Customization Bridging Smart Products and Manufacturing Systems written by Ann-Louise Andersen and published by Springer Nature. This book was released on 2021-10-31 with total page 1054 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book features state-of-the-art contributions from two well-established conferences: Changeable, Agile, Reconfigurable and Virtual Production Conference (CARV2020) and Mass Customization and Personalization Conference (MCPC2020). Together, they focus on the joint design, development, and management of products, production systems, and business for sustainable customization and personalization. The book covers a large range of topics within this domain, ranging from industrial success factors to original contributions within the field.

Download or read book Metal Cutting Theory and Practice written by David A. Stephenson and published by CRC Press. This book was released on 2016-04-06 with total page 956 pages. Available in PDF, EPUB and Kindle. Book excerpt: A Complete Reference Covering the Latest Technology in Metal Cutting Tools, Processes, and Equipment Metal Cutting Theory and Practice, Third Edition shapes the future of material removal in new and lasting ways. Centered on metallic work materials and traditional chip-forming cutting methods, the book provides a physical understanding of conventional and high-speed machining processes applied to metallic work pieces, and serves as a basis for effective process design and troubleshooting. This latest edition of a well-known reference highlights recent developments, covers the latest research results, and reflects current areas of emphasis in industrial practice. Based on the authors’ extensive automotive production experience, it covers several structural changes, and includes an extensive review of computer aided engineering (CAE) methods for process analysis and design. Providing updated material throughout, it offers insight and understanding to engineers looking to design, operate, troubleshoot, and improve high quality, cost effective metal cutting operations. The book contains extensive up-to-date references to both scientific and trade literature, and provides a description of error mapping and compensation strategies for CNC machines based on recently issued international standards, and includes chapters on cutting fluids and gear machining. The authors also offer updated information on tooling grades and practices for machining compacted graphite iron, nickel alloys, and other hard-to-machine materials, as well as a full description of minimum quantity lubrication systems, tooling, and processing practices. In addition, updated topics include machine tool types and structures, cutting tool materials and coatings, cutting mechanics and temperatures, process simulation and analysis, and tool wear from both chemical and mechanical viewpoints. Comprised of 17 chapters, this detailed study: Describes the common machining operations used to produce specific shapes or surface characteristics Contains conventional and advanced cutting tool technologies Explains the properties and characteristics of tools which influence tool design or selection Clarifies the physical mechanisms which lead to tool failure and identifies general strategies for reducing failure rates and increasing tool life Includes common machinability criteria, tests, and indices Breaks down the economics of machining operations Offers an overview of the engineering aspects of MQL machining Summarizes gear machining and finishing methods for common gear types, and more Metal Cutting Theory and Practice, Third Edition emphasizes the physical understanding and analysis for robust process design, troubleshooting, and improvement, and aids manufacturing engineering professionals, and engineering students in manufacturing engineering and machining processes programs.

Download or read book Proceedings written by and published by . This book was released on 1994 with total page 1158 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Proceeding of the International Science and Technology Conference FarEast on 2019 written by Denis B. Solovev and published by Springer Nature. This book was released on 2020-04-13 with total page 1010 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the proceedings of the International Science and Technology Conference “FarEastCon 2019,” which took place on October 1–4, 2019, in Vladivostok, Russian Federation. The conference provided a platform for gathering expert opinions on projects and initiatives aimed at the implementation of far-sighted scientific research and development, and allowed current theoretical and practical advances to be shared with the broader research community. Featuring selected papers from the conference, this book will be of interest to experts in various fields whose work involves developing innovative solutions and increasing the efficiency of economic activities.

Download or read book Competing in World class Manufacturing written by Craig Giffi and published by McGraw-Hill Professional Publishing. This book was released on 1990 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt: Here's the first book to give you a complete manufacturing strategy. Based on an in-depth study of the strategies and operating practices of dozens of leading manufacturers, this book describes a common framework for world-class manufacturers.

Download or read book Proceedings of the Container Technology Conference written by and published by . This book was released on 1981 with total page 212 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Manufacturing Review written by and published by . This book was released on 1990 with total page 662 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Proceeding of the International Science and Technology Conference FarEast on 2020 written by Denis B. Solovev and published by Springer Nature. This book was released on 2021-06-06 with total page 1272 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the proceedings of the International Science and Technology Conference “FarEastCon 2020,” which took place on October 6–9, 2020, in Vladivostok, Russian Federation. The conference provided a platform for gathering expert opinions on projects and initiatives aimed at the implementation of far-sighted scientific research and development and allowed current theoretical and practical advances to be shared with the broader research community. Featuring selected papers from the conference, this book is of interest to experts in various fields whose work involves developing innovative solutions and increasing the efficiency of economic activities.

Download or read book Proceeding of the International Science and Technology Conference FarEast on 2021 written by Denis B. Solovev and published by Springer Nature. This book was released on 2022-02-26 with total page 1017 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the proceedings of the International Science and Technology Conference “FarEastCon 2021,” which took place on October 5–8, 2021, in Vladivostok, Russian Federation. The book discusses modern achievements and promising research in the sphere of intelligent technologies in solving real, applied problems in various fields of industry and economic policies of different countries. Featuring selected papers from the conference, this book is of interest to experts in various fields whose work involves developing innovative solutions and increasing the efficiency of economic activities.

Download or read book Designing Socially Embedded Technologies in the Real World written by Volker Wulf and published by Springer. This book was released on 2015-07-03 with total page 431 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is concerned with the associated issues between the differing paradigms of academic and organizational computing infrastructures. Driven by the increasing impact Information Communication Technology (ICT) has on our working and social lives, researchers within the Computer Supported Cooperative Work (CSCW) field try and find ways to situate new hardware and software in rapidly changing socio-digital ecologies. Adopting a design-orientated research perspective, researchers from the European Society for Socially Embedded Technologies (EUSSET) elaborate on the challenges and opportunities we face through the increasing permeation of society by ICT from commercial, academic, design and organizational perspectives. Designing Socially Embedded Technologies in the Real-World is directed at researchers, industry practitioners and will be of great interest to any other societal actors who are involved with the design of IT systems.

Download or read book Electronics Packaging Forum written by James E. Morris and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 459 pages. Available in PDF, EPUB and Kindle. Book excerpt: Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be clear as to what might be expected by way of content and level of each chapter.

Download or read book Proceedings of the 19th Asian Workshop on Polymer Processing AWPP 2022 written by Wen Shyang Chow and published by Springer Nature. This book was released on 2023-06-30 with total page 363 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the selected papers from the 19th Asian Workshop in Polymer Processing (AWPP 2022) highlighting the latest research breakthroughs in the field of polymeric materials and processing technologies. The topics of the conference provides an exclusive forum for intellectually stimulating and engaging interactions among academicians and industrialists to share their recent scientific breakthroughs and emerging trends in polymer processing technologies and their contributions towards environmental sustainability. Its content appeals to the researchers, academics, industry practitioners working in the field of green sustainable polymers.

Download or read book Microelectronics Packaging Handbook written by R.R. Tummala and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 1060 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Download or read book Area Array Interconnection Handbook written by Karl J. Puttlitz and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 1250 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.