Download or read book Proceedings of the International Symposium on the Physical Failure Analysis of Integrated Circuits written by and published by . This book was released on 2004 with total page 390 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book ISTFA 2013 written by A. S. M. International and published by ASM International. This book was released on 2013-01-01 with total page 634 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures.
Download or read book ISTFA 2014 written by A. S. M. International and published by ASM International. This book was released on 2014-11-01 with total page 561 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers address the symposium's theme, Exploring the Many Facets of Failure Analysis.
Download or read book ISTFA 2017 Proceedings from the 43rd International Symposium for Testing and Failure Analysis written by ASM International and published by ASM International. This book was released on 2017-12-01 with total page 666 pages. Available in PDF, EPUB and Kindle. Book excerpt: The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
Download or read book ISTFA 2011 written by and published by ASM International. This book was released on 2011 with total page 479 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book ISTFA 2018 Proceedings from the 44th International Symposium for Testing and Failure Analysis written by ASM International and published by ASM International. This book was released on 2018-12-01 with total page 593 pages. Available in PDF, EPUB and Kindle. Book excerpt: The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.
Download or read book Proceedings of the 9th International Symposium on the Physical Failure Analysis of Integrated Circuits written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 2002 with total page 306 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Istfa 2005 written by ASM International and published by ASM International. This book was released on 2005-01-01 with total page 524 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Silicon on Insulator Technology Materials to VLSI written by J.-P. Colinge and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 375 pages. Available in PDF, EPUB and Kindle. Book excerpt: Silicon-on-Insulator Technology: Materials to VLSI, Third Edition, retraces the evolution of SOI materials, devices and circuits over a period of roughly twenty years. Twenty years of progress, research and development during which SOI material fabrication techniques have been born and abandoned, devices have been invented and forgotten, but, most importantly, twenty years during which SOI Technology has little by little proven it could outperform bulk silicon in every possible way. The turn of the century turned out to be a milestone for the semiconductor industry, as high-quality SOI wafers suddenly became available in large quantities. From then on, it took only a few years to witness the use of SOI technology in a wealth of applications ranging from audio amplifiers and wristwatches to 64-bit microprocessors. This book presents a complete and state-of-the-art review of SOI materials, devices and circuits. SOI fabrication and characterization techniques, SOI CMOS processing, and the physics of the SOI MOSFET receive an in-depth analysis.
Download or read book ESD written by Steven H. Voldman and published by John Wiley & Sons. This book was released on 2005-12-13 with total page 420 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume is the first in a series of three books addressing Electrostatic Discharge (ESD) physics, devices, circuits and design across the full range of integrated circuit technologies. ESD Physics and Devices provides a concise treatment of the ESD phenomenon and the physics of devices operating under ESD conditions. Voldman presents an accessible introduction to the field for engineers and researchers requiring a solid grounding in this important area. The book contains advanced CMOS, Silicon On Insulator, Silicon Germanium, and Silicon Germanium Carbon. In addition it also addresses ESD in advanced CMOS with discussions on shallow trench isolation (STI), Copper and Low K materials. Provides a clear understanding of ESD device physics and the fundamentals of ESD phenomena. Analyses the behaviour of semiconductor devices under ESD conditions. Addresses the growing awareness of the problems resulting from ESD phenomena in advanced integrated circuits. Covers ESD testing, failure criteria and scaling theory for CMOS, SOI (silicon on insulator), BiCMOS and BiCMOS SiGe (Silicon Germanium) technologies for the first time. Discusses the design and development implications of ESD in semiconductor technologies. An invaluable reference for EMC non-specialist engineers and researchers working in the fields of IC and transistor design. Also, suitable for researchers and advanced students in the fields of device/circuit modelling and semiconductor reliability.
Download or read book The ESD Handbook written by Steven H. Voldman and published by John Wiley & Sons. This book was released on 2021-03-02 with total page 1168 pages. Available in PDF, EPUB and Kindle. Book excerpt: A practical and comprehensive reference that explores Electrostatic Discharge (ESD) in semiconductor components and electronic systems The ESD Handbook offers a comprehensive reference that explores topics relevant to ESD design in semiconductor components and explores ESD in various systems. Electrostatic discharge is a common problem in the semiconductor environment and this reference fills a gap in the literature by discussing ESD protection. Written by a noted expert on the topic, the text offers a topic-by-topic reference that includes illustrative figures, discussions, and drawings. The handbook covers a wide-range of topics including ESD in manufacturing (garments, wrist straps, and shoes); ESD Testing; ESD device physics; ESD semiconductor process effects; ESD failure mechanisms; ESD circuits in different technologies (CMOS, Bipolar, etc.); ESD circuit types (Pin, Power, Pin-to-Pin, etc.); and much more. In addition, the text includes a glossary, index, tables, illustrations, and a variety of case studies. Contains a well-organized reference that provides a quick review on a range of ESD topics Fills the gap in the current literature by providing information from purely scientific and physical aspects to practical applications Offers information in clear and accessible terms Written by the accomplished author of the popular ESD book series Written for technicians, operators, engineers, circuit designers, and failure analysis engineers, The ESD Handbook contains an accessible reference to ESD design and ESD systems.
Download or read book Index of Conference Proceedings written by British Library. Document Supply Centre and published by . This book was released on 2000 with total page 836 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microelectronics Failure Analysis written by EDFAS Desk Reference Committee and published by ASM International. This book was released on 2011 with total page 673 pages. Available in PDF, EPUB and Kindle. Book excerpt: Includes bibliographical references and index.
Download or read book Photovoltaic Thermal Collectors with Nanofluids and Nano PCM written by Ali H. A. Al-Waeli and published by Springer Nature. This book was released on 2024-01-20 with total page 135 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book gives you theory and design of PV/T systems. Are you interested in solar energy? If you are, you must have read about solar panels, or photovoltaics (PV). If you have installed a photovoltaic system, you must have noticed it not to generate the amount of power mentioned in its datasheet. A major issue that PV suffers from is its temperature, which causes a drop in its power. Among the solutions to this issue is to use active cooling methods, such as the hybrid photovoltaic thermal (PV/T) system. These systems can produce electrical and thermal energy simultaneously and within same area. The thermal collector serves to cool down the PV surface temperature, which negatively affects the PV efficiency, to reclaim the efficiency or bring it back close to standard testing conditions value. Moreover, the thermal collector will convey this heat using a working fluid and extract it as thermal energy. On the other hand, the electrical power generated from the PV can be utilized in standalone or grid-connected configuration. Moreover, the book presents a novel PV/T collector which can utilize nanofluids and nano-Phase Change Material (PCM) to enhance its performance in tropical climate conditions. The methods used to develop the heat transfer and energy balance equations are presented as well. PV/T collector numerical simulation using MATLAB and computational fluid dynamic (CFD) was also presented. Finally, the approach of life cycle cost analysis (LCCA) is presented to evaluate PV/T with nanofluid and nano-PCM, economically.
Download or read book Microelectronics Failure Analysis written by and published by ASM International. This book was released on 2004-01-01 with total page 813 pages. Available in PDF, EPUB and Kindle. Book excerpt: For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron
Download or read book Thirty fourth International Symposium for Testing and Failure Analysis written by ASM International and published by ASM International. This book was released on 2008-01-01 with total page 551 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Progress in Transmission Electron Microscopy 1 written by Xiao-Feng Zhang and published by Springer Science & Business Media. This book was released on 2001-10-18 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: Transmission electron microscopy (TEM) is now recognized as a crucial tool in materials science. This book, authored by a team of expert Chinese and international authors, covers many aspects of modern electron microscopy, from the architecture of novel electron microscopes, advanced theories and techniques in TEM and sample preparation, to a variety of hands-on examples of TEM applications. Volume I concentrates on the newly developed concepts and methods which are making TEM a powerful and indispensible tool in materials science.
