Download or read book The Proceedings of the 17th Annual Conference of China Electrotechnical Society written by Kaigui Xie and published by Springer Nature. This book was released on 2023-03-30 with total page 1314 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book gathers outstanding papers presented at the 17th Annual Conference of China Electrotechnical Society, organized by China Electrotechnical Society (CES), held in Beijing, China, from September 17 to 18, 2022. It covers topics such as electrical technology, power systems, electromagnetic emission technology, and electrical equipment. It introduces the innovative solutions that combine ideas from multiple disciplines. The book is very much helpful and useful for the researchers, engineers, practitioners, research students, and interested readers.
Download or read book The Proceedings of the 17th Annual Conference of China Electrotechnical Society written by Jian Li and published by Springer Nature. This book was released on 2023-03-31 with total page 1411 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book gathers outstanding papers presented at the 17th Annual Conference of China Electrotechnical Society, organized by China Electrotechnical Society (CES), held in Beijing, China, from September 17 to 18, 2022. It covers topics such as electrical technology, power systems, electromagnetic emission technology, and electrical equipment. It introduces the innovative solutions that combine ideas from multiple disciplines. The book is very much helpful and useful for the researchers, engineers, practitioners, research students, and interested readers.
Download or read book Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium written by Mohd Arif Anuar Mohd Salleh and published by Springer Nature. This book was released on 2023-07-02 with total page 873 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials.
Download or read book Proceedings of the International Conference on Metallurgical Engineering and Centenary Celebration written by Sudipta Patra and published by Springer Nature. This book was released on 2023-10-14 with total page 403 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents peer reviewed articles from The International Conference on Metallurgical Engineering and Centenary Celebration (METCENT 2023), held at Indian Institute of Technology (BHU) Varanasi, India from the 26-28th of October 2023. It covers wide areas of metallurgical and materials science, highlighting recent advancements in these areas, including but not limited to Advanced Steels, Computational Material Science, Recent Ferrous/Non-Ferrous Metallurgy Processes, Green Iron and Steel Making Technologies and others. METCENT 2023 provides a unique opportunity to all the Metallurgists, Materials Scientists, Academicians and Industry experts to share their experiences on this special occasion.
Download or read book Proceedings of Second International Conference in Mechanical and Energy Technology written by Sanjay Yadav and published by Springer Nature. This book was released on 2022-06-26 with total page 574 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents selected peer-reviewed papers from the International Conference on Mechanical and Energy Technologies, which was held on October 28–29, 2021, at Galgotias College of Engineering and Technology, Greater Noida, India. The book reports on the latest developments in the field of mechanical and energy technology in contributions prepared by experts from academia and industry. The broad range of topics covered includes aerodynamics and fluid mechanics, artificial intelligence, nonmaterial and nonmanufacturing technologies, rapid manufacturing technologies and prototyping, remanufacturing, renewable energies technologies, metrology and computer-aided inspection, etc. Accordingly, the book offers a valuable resource for researchers in various fields, especially mechanical and industrial engineering, and energy technologies.
Download or read book 2016 17th International Conference on Electronic Packaging Technology ICEPT written by IEEE Staff and published by . This book was released on 2016-08-16 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: ICEPT 2016 is a four day event, featuring technical sessions, invited talks, professional development courses, exhibition, and social networking activities It aims to cover the latest technological developments in electronic packaging, manufacturing and packaging equipment, and provide opportunities to explore the trends of research and development, as well as business in China
Download or read book Encyclopedia Of Packaging Materials Processes And Mechanics Set 1 Die attach And Wafer Bonding Technology A 4 volume Set written by and published by World Scientific. This book was released on 2019-08-27 with total page 1079 pages. Available in PDF, EPUB and Kindle. Book excerpt: Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories.The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging 'learning curve,' the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications.
Download or read book Electronic Enclosures Housings and Packages written by Frank Suli and published by Woodhead Publishing. This book was released on 2018-11-01 with total page 490 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions.
Download or read book Handbook of Materials Failure Analysis written by Abdel Salam Hamdy Makhlouf and published by Butterworth-Heinemann. This book was released on 2019-10-22 with total page 388 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Materials Failure Analysis: With Case Studies from the Electronics Industries examines the reasons materials fail in certain situations, including material defects and mechanical failure as a result of various causes. The book begins with a general overview of materials failure analysis and its importance. It then proceeds to discussions on the types of failure analysis, specific tools and techniques, and an analysis of materials failure from various causes. As failure can occur for several reasons, including materials defects-related failure, materials design-related failure, or corrosion-related failures, the topics covered in this comprehensive source are an important tool for practitioners. - Provides the most up-to-date and balanced coverage of failure analysis, combining foundational knowledge and current research on the latest developments and innovations in the field - Offers an ideal accompaniment for those interested in materials forensic investigation, failure of materials, static failure analysis, dynamic failure analysis, and fatigue life prediction - Presents compelling new case studies from key industries to demonstrate concepts
Download or read book Atomic Layer Deposition written by David Cameron and published by MDPI. This book was released on 2020-12-28 with total page 142 pages. Available in PDF, EPUB and Kindle. Book excerpt: Atomic layer deposition (ALD) is a thin film deposition process renowned for its ability to produce layers with unrivaled control of thickness and composition, conformability to extreme three-dimensional structures, and versatility in the materials it can produce. These range from multi-component compounds to elemental metals and structures with compositions that can be adjusted over the thickness of the film. It has expanded from a small-scale batch process to large scale production, also including continuous processing – known as spatial ALD. It has matured into an industrial technology essential for many areas of materials science and engineering from microelectronics to corrosion protection. Its attributes make it a key technology in studying new materials and structures over an enormous range of applications. This Special Issue contains six research articles and one review article that illustrate the breadth of these applications from energy storage in batteries or supercapacitors to catalysis via x-ray, UV, and visible optics.
Download or read book Recent Progress in Lead Free Solder Technology written by Mohd Arif Anuar Mohd Salleh and published by Springer Nature. This book was released on 2022-03-01 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.
Download or read book The 17th International Conference on Electronic Packaging Technology written by Keyun Bi and published by . This book was released on 2016 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Intermetallics 2016 written by Ana Sofia Ramos and published by MDPI. This book was released on 2018-07-02 with total page 217 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a printed edition of the Special Issue "Intermetallics 2016" that was published in Metals
Download or read book Graphene and Other 2D Layered Nanomaterial Based Films written by Federico Cesano and published by MDPI. This book was released on 2019-12-12 with total page 138 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is dedicated to highlighting some relevant advances in the field of thin films and coatings based on two-dimensional crystals and layered nanomaterials. Due to their layered structure, graphene and a variety of new 2D inorganic nanosystems, called “graphene analogues”, have all attracted tremendous interest due to their unprecedented properties/superior performance, and may find applications in many fields from electronics to biotechnology. These two-dimensional systems are ultrathin and, hence, tend to be flexible, also presenting distinctive and nearly intrinsic characteristics, including electronic, magnetic, optical, thermal conductivity, and superconducting properties. Furthermore, the combination of different structures and synergetic effects may open new and unprecedented perspectives, making these ideal advanced materials for multifunctional assembled systems. As far as the field of coatings is concerned, new layered nanostructures may offer unique and multifunctional properties, including gas barrier, lubricant, conductive, magnetic, photoactive, self-cleaning, and/or antimicrobial surfaces. This book contains new findings on the synthesis and perspectives of multifunctional films that are at the forefront of the science and coating technologies.
Download or read book Flip Chip Hybrid Bonding Fan In and Fan Out Technology written by John H. Lau and published by Springer Nature. This book was released on with total page 515 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Nanoporous Carbons for Soft and Flexible Energy Devices written by Francesca Borghi and published by Springer Nature. This book was released on 2022-01-12 with total page 187 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides an interesting snapshot of new research within the fields of flexible and soft devices which use porous carbon-based materials. The increase in demand for soft and flexible electronics, electrochemical energy storage/conversion systems, piezoresistive pressure sensors has promoted the development of new strategies for the synthesis and integration of nanoporous carbon (NPC) into flexible and soft polymers and inorganic textures. The structural properties of such NPC materials combined with their mechanical, conductive and catalytic properties, show promising results for the technology they are designed for, which can be useful solutions in many other disciplines. An in-depth discussion of the use of NPC materials in different energy devices is provided in every chapter, while at the same time the knowledge of the reader on the various applications where these materials can be used will be broadened. This book sheds new light on nanoporous carbon-based materials and will be of great interest to graduate students and professionals working in this field.
Download or read book Reactive Polymers Fundamentals and Applications written by Johannes Karl Fink and published by William Andrew. This book was released on 2017-10-24 with total page 714 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reactive Polymers: Fundamentals and Applications: A Concise Guide to Industrial Polymers, Third Edition introduces engineers and scientists to a range of reactive polymers and then details their applications and performance benefits. Basic principles and industrial processes are described for each class of reactive resin (thermoset), as well as additives, the curing process, applications and uses. The initial chapters are devoted to individual resin types (e.g., epoxides, cyanacrylates), followed by more general chapters on topics such as reactive extrusion and dental applications. Injection molding of reactive polymers, radiation curing, thermosetting elastomers, and reactive extrusion equipment are covered as well. The use of reactive polymers enables manufacturers to make chemical changes at a late stage in the production process, which, in turn, cause changes in performance and properties. Material selection and control of the reaction are essential to achieve optimal performance. Material new to this edition includes the most recent developments, applications and commercial products for each chemical class of thermosets, as well as sections on fabrication methods, reactive biopolymers, recycling of reactive polymers and case studies. - Covers the basics and most recent developments, including reactive biopolymers, recycling of reactive polymers, nanocomposites and fluorosilicones - Offers an indispensable guide for engineers and advanced students alike - Provides extensive literature and patent review - Reflects a thorough review of all literature published in this area since 2014 - Features revised and updated chapters to reflect the latest research in reactive polymers
