Download or read book Printed Boards Rigid Multilayer Printed Boards with Interlayer Connections Sectional Specification written by British Standards Institute Staff and published by . This book was released on 1997-06 with total page 42 pages. Available in PDF, EPUB and Kindle. Book excerpt: Printed-circuit boards, Printed circuits, Electronic equipment and components, Capability approval, Approval testing, Maintenance, Test specimens, Assessed quality, Quality assurance, Quality assurance systems, Visual inspection (testing), Inspection, Inspection specification, Specification (approval), Dimensional measurement, Electrical testing, Adhesion, Porosity, Performance, Solderability testing, Mechanical testing, Detail specification, Defects, Process control, Interfaces

Download or read book Printed Boards Rigid Multilayer Printed Boards with Interlayer Connections Sectional Specification Capability Detail Specification Performance Levels A B and C written by British Standards Institute Staff and published by . This book was released on 1997-06 with total page 70 pages. Available in PDF, EPUB and Kindle. Book excerpt: Printed-circuit boards, Printed circuits, Electronic equipment and components, Rigid structures, Electrical connections, Capability approval, Approval testing, Detail specification, Specification (approval), Performance, Product specification, Qualification approval, Test specimens, Dimensional tolerances, Position, Process control, Diameter, Electrical testing, Visual inspection (testing), Conformity, Flatness (surface), Flatness measurement, Thickness, Adhesion, Solderability testing, Porosity, Ageing tests

Download or read book Products and Services Catalogue written by and published by . This book was released on 2001 with total page 1228 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Printed Flexible Sensors written by Anindya Nag and published by Springer. This book was released on 2019-03-11 with total page 205 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents recent advances in the design, fabrication and implementation of flexible printed sensors. It explores a range of materials for developing the electrode and substrate parts of the sensors, on the basis of their electrical and mechanical characteristics. The sensors were processed using laser cutting and 3D printing techniques, and the sensors developed were employed in a number of healthcare, environmental and industrial applications, including: monitoring of physiological movements, respiration, salinity and nitrate measurement, and tactile sensing. The type of sensor selected for each application depended on its dimensions, robustness and sensitivity. The sensors fabricated were also embedded in an IoT-based system, allowing them to be integrated into real-time applications.

Download or read book Semiconductor Packaging written by Andrea Chen and published by CRC Press. This book was released on 2016-04-19 with total page 216 pages. Available in PDF, EPUB and Kindle. Book excerpt: In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.

Download or read book Engineering Materials 2 written by Michael F. Ashby and published by Elsevier. This book was released on 2014-06-28 with total page 380 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides a thorough explanation of the basic properties of materials; of how these can be controlled by processing; of how materials are formed, joined and finished; and of the chain of reasoning that leads to a successful choice of material for a particular application. The materials covered are grouped into four classes: metals, ceramics, polymers and composites. Each class is studied in turn, identifying the families of materials in the class, the microstructural features, the processes or treatments used to obtain a particular structure and their design applications. The text is supplemented by practical case studies and example problems with answers, and a valuable programmed learning course on phase diagrams.

Download or read book Polymer Matrix Composites and Technology written by Ru-Min Wang and published by Elsevier. This book was released on 2011-07-14 with total page 570 pages. Available in PDF, EPUB and Kindle. Book excerpt: Given such properties as low density and high strength, polymer matrix composites have become a widely used material in the aerospace and other industries. Polymer matrix composites and technology provides a helpful overview of these materials, their processing and performance.After an introductory chapter, part one reviews the main reinforcement and matrix materials used as well as the nature of the interface between them. Part two discusses forming and molding technologies for polymer matrix composites. The final part of the book covers key aspects of performance, including tensile, compression, shear and bending properties as well as impact, fatigue and creep behaviour.Polymer matrix composites and technology provides both students and those in industry with a valuable introduction to and overview of this important class of materials. - Provides a helpful overview of these materials, their processing and performance incorporating naming and classification of composite materials - Reviews the main reinforcement and matrix materials used as well as the nature of the interface between them including damage mechanisms - Discusses forming and molding technologies for polymer matrix composites outlining various techniques and technologies

Download or read book Food Packaging Technology written by Richard Coles and published by CRC Press. This book was released on 2003-08-15 with total page 370 pages. Available in PDF, EPUB and Kindle. Book excerpt: The protection and preservation of a product, the launch of new products or re-launch of existing products, perception of added-value to products or services, and cost reduction in the supply chain are all objectives of food packaging. Taking into consideration the requirements specific to different products, how can one package successfully meet all of these goals? Food Packaging Technology provides a contemporary overview of food processing and packaging technologies. Covering the wide range of issues you face when developing innovative food packaging, the book includes: Food packaging strategy, design, and development Food biodeterioation and methods of preservation Packaged product quality and shelf life Logistical packaging for food marketing systems Packaging materials and processes The battle rages over which type of container should be used for which application. It is therefore necessary to consider which materials, or combination of materials and processes will best serve the market and enhance brand value. Food Packaging Technology gives you the tools to determine which form of packaging will meet your business goals without compromising the safety of your product.

Download or read book Transformers and Inductors for Power Electronics written by W.G. Hurley and published by John Wiley & Sons. This book was released on 2013-02-21 with total page 374 pages. Available in PDF, EPUB and Kindle. Book excerpt: Based on the fundamentals of electromagnetics, this clear and concise text explains basic and applied principles of transformer and inductor design for power electronic applications. It details both the theory and practice of inductors and transformers employed to filter currents, store electromagnetic energy, provide physical isolation between circuits, and perform stepping up and down of DC and AC voltages. The authors present a broad range of applications from modern power conversion systems. They provide rigorous design guidelines based on a robust methodology for inductor and transformer design. They offer real design examples, informed by proven and working field examples. Key features include: emphasis on high frequency design, including optimisation of the winding layout and treatment of non-sinusoidal waveforms a chapter on planar magnetic with analytical models and descriptions of the processing technologies analysis of the role of variable inductors, and their applications for power factor correction and solar power unique coverage on the measurements of inductance and transformer capacitance, as well as tests for core losses at high frequency worked examples in MATLAB, end-of-chapter problems, and an accompanying website containing solutions, a full set of instructors’ presentations, and copies of all the figures. Covering the basics of the magnetic components of power electronic converters, this book is a comprehensive reference for students and professional engineers dealing with specialised inductor and transformer design. It is especially useful for senior undergraduate and graduate students in electrical engineering and electrical energy systems, and engineers working with power supplies and energy conversion systems who want to update their knowledge on a field that has progressed considerably in recent years.

Download or read book Foldable Flex and Thinned Silicon Multichip Packaging Technology written by John W. Balde and published by Springer Science & Business Media. This book was released on 2003-01-31 with total page 382 pages. Available in PDF, EPUB and Kindle. Book excerpt: Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means. Much of the work in this field has not been widely disseminated other than by papers presented at conferences and workshops. This book is organized to report on the developments in this technology, but with special additional material and emphasis. The intent is to do more than report on present state of the art. It is intended as an advocacy book, pointing out the reasons for 3-D assemblies, the reasons for Silicon-in-a-Package multichip modules, and the commercial availability of the techniques. The contributing authors, all leaders in this technical field, explore the needs, reveal the state of development and production, and point to changes in technology that can bring this technology into wider use for more complex applications. It is an advocacy book in this respect - advocacy for the use of a technology that is already mature, and advocacy for exploring ways to make it even more capable for the future. It will also do more than discuss the present; it will point out the deficiencies of the constructions, the needed availability of good flex material, the use of newer flex materials, such as LCP, and the implications from the use of the Integrated Mesh Power Systems to enhance the capability for future designs. Lastly it will discuss the serious problem of heat removal if multiple microprocessors are included.

Download or read book Engineered Materials Handbook Desk Edition written by ASM International. Handbook Committee and published by ASM International. This book was released on 1995-11-01 with total page 1313 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive reference on the properties, selection, processing, and applications of the most widely used nonmetallic engineering materials. Section 1, General Information and Data, contains information applicable both to polymers and to ceramics and glasses. It includes an illustrated glossary, a collection of engineering tables and data, and a guide to materials selection. Sections 2 through 7 focus on polymeric materials--plastics, elastomers, polymer-matrix composites, adhesives, and sealants--with the information largely updated and expanded from the first three volumes of the Engineered Materials Handbook. Ceramics and glasses are covered in Sections 8 through 12, also with updated and expanded information. Annotation copyright by Book News, Inc., Portland, OR

Download or read book MEMS Materials and Processes Handbook written by Reza Ghodssi and published by Springer Science & Business Media. This book was released on 2011-03-18 with total page 1211 pages. Available in PDF, EPUB and Kindle. Book excerpt: MEMs Materials and Processes Handbook" is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on "Materials" and "Processes". The extensive Material Selection Guide" and a "Material Database" guides the reader through the selection of appropriate materials for the required task at hand. The "Processes" section of the book is organized as a catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMs.

Download or read book Plastics Materials and Processes written by Charles A. Harper and published by John Wiley & Sons. This book was released on 2003-10-10 with total page 1008 pages. Available in PDF, EPUB and Kindle. Book excerpt: Plastics Materials and Processes: A Concise Encyclopedia is a resource for anyone with an interest in plastic materials and processes, from seasoned professionals to laypeople. Arranged in alphabetical order, it clearly explains all of the materials and processes as well as their major application areas and usages. Plastics Materials and Processes: A Concise Encyclopedia: Discusses and describes applications and practical uses of the materials and processes. Clear definitions and sufficient depth to satisfy the information seekers needs

Download or read book Compendium of Polymer Terminology and Nomenclature written by Richard G Jones and published by Royal Society of Chemistry. This book was released on 2009-01-19 with total page 465 pages. Available in PDF, EPUB and Kindle. Book excerpt: The IUPAC system of polymer nomenclature has aided the generation of unambiguous names that re ect the historical development of chemistry. However, the explosion in the circulation of information and the globalization of human activities mean that it is now necessary to have a common language for use in legal situations, patents, export-import regulations, and environmental health and safety information. Rather than recommending a ‘unique name’ for each structure, rules have been developed for assigning ‘preferred IUPAC names’, while continuing to allow alternatives in order to preserve the diversity and adaptability of nomenclature. Compendium of Polymer Terminology and Nomenclature is the only publication to collect the most important work on this subject into a single volume. It serves as a handy compendium for scientists and removes the need for time consuming literature searches. One of a series issued by the International Union of Pure and Applied Chemistry (IUPAC), it covers the terminology used in many and varied aspects of polymer science as well as the nomenclature of several di erent types of polymer including regular and irregular single-strand organic polymers, copolymers and regular double-strand (ladder and spiro) organic polymers.

Download or read book Materials Design and Manufacturing for Sustainable Environment written by Santhakumar Mohan and published by Springer Nature. This book was released on 2021-02-06 with total page 909 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book comprises the select proceedings of the International Conference on Materials, Design and Manufacturing for Sustainable Environment (ICMDMSE 2020). The primary focus is on emerging materials and cutting-edge manufacturing technologies for sustainable environment. The book covers a wide range of topics such as advanced materials, vibration, tribology, finite element method (FEM), heat transfer, fluid mechanics, energy engineering, additive manufacturing, robotics and automation, automobile engineering, industry 4.0, MEMS and nanotechnology, optimization techniques, condition monitoring, and new paradigms in technology management. Contents of this book will be useful to students, researchers, and practitioners alike.

Download or read book Power Electronics Design written by Keith H. Sueker and published by Elsevier. This book was released on 2005-08-09 with total page 274 pages. Available in PDF, EPUB and Kindle. Book excerpt: A wealth of practical design information ... the next-best-thing to having a mentor with a quarter-century of experience!

Download or read book Interfacial Compatibility in Microelectronics written by Tomi Laurila and published by Springer Science & Business Media. This book was released on 2012-01-10 with total page 221 pages. Available in PDF, EPUB and Kindle. Book excerpt: Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the “traditional” method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced. In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes: solutions to several common reliability issues in microsystem technology, methods to understand and predict failure mechanisms at interfaces between dissimilar materials and an approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA. Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike.