Download or read book Plasma Processing for VLSI written by Norman G. Einspruch and published by Academic Press. This book was released on 2014-12-01 with total page 544 pages. Available in PDF, EPUB and Kindle. Book excerpt: VLSI Electronics: Microstructure Science, Volume 8: Plasma Processing for VLSI (Very Large Scale Integration) discusses the utilization of plasmas for general semiconductor processing. It also includes expositions on advanced deposition of materials for metallization, lithographic methods that use plasmas as exposure sources and for multiple resist patterning, and device structures made possible by anisotropic etching. This volume is divided into four sections. It begins with the history of plasma processing, a discussion of some of the early developments and trends for VLSI. The second section, Deposition, discusses deposition techniques for VLSI such as sputtering metals for metallization and contacts, plasma-enhanced chemical vapor deposition of metals and suicides, and plasma enhanced chemical vapor deposition of dielectrics. The part on Lithography presents the high-resolution trilayer resist system, pulsed x-ray sources for submicrometer x-ray lithography, and high-intensity deep-UV sources. The last part, Etching, provides methods in etching, like ion-beam etching using reactive gases, low-pressure reactive ion etching, and the uses of inert-gas ion milling. The theory and mechanisms of plasma etching are described and a number of new device structures made possible by anisotropic etching are enumerated as well. Scientists, engineers, researchers, device designers, and systems architects will find the book useful.
Download or read book VLSI Electronics Plasma processing for VLSI written by Norman G. Einspruch and published by . This book was released on 1981 with total page 552 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book VLSI Electronics Plasma processing for VLSI written by Norman G. Einspruch and published by . This book was released on 1981 with total page 480 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Plasma Processing of Semiconductors written by P.F. Williams and published by Springer Science & Business Media. This book was released on 2013-11-11 with total page 610 pages. Available in PDF, EPUB and Kindle. Book excerpt: Plasma Processing of Semiconductors contains 28 contributions from 18 experts and covers plasma etching, plasma deposition, plasma-surface interactions, numerical modelling, plasma diagnostics, less conventional processing applications of plasmas, and industrial applications. Audience: Coverage ranges from introductory to state of the art, thus the book is suitable for graduate-level students seeking an introduction to the field as well as established workers wishing to broaden or update their knowledge.
Download or read book Applications of Plasma Processes to VLSI Technology written by Takuo Sugano and published by Wiley-Interscience. This book was released on 1985-09-24 with total page 426 pages. Available in PDF, EPUB and Kindle. Book excerpt: Presents state-of-the-art research in microelectronic processing for very large scale integration. Emphasizing applications and techniques, this book provides considerable insight into Japan's technological effort in this important area of science. Focuses on research involving plasma deposition and dry etching. Considerable attention is devoted to MOS gate fabrication, the studies of the influence of process parameters on electrical properties, dry processing technologies, and the theory of plasma chemical reactions.
Download or read book Fundamental Electron Interactions with Plasma Processing Gases written by Loucas G. Christophorou and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 791 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume deals with the basic knowledge and understanding of fundamental interactions of low energy electrons with molecules. It pro vides an up-to-date and comprehensive account of the fundamental in teractions of low-energy electrons with molecules of current interest in modern technology, especially the semiconductor industry. The primary electron-molecule interaction processes of elastic and in elastic electron scattering, electron-impact ionization, electron-impact dissociation, and electron attachment are discussed, and state-of-the art authoritative data on the cross sections of these processes as well as on rate and transport coefficients are provided. This fundamental knowledge has been obtained by us over the last eight years through a critical review and comprehensive assessment of "all" available data on low-energy electron collisions with plasma processing gases which we conducted at the National Institute of Standards and Technology (NIST). Data from this work were originally published in the Journal of Physical and Chemical Reference Data, and have been updated and expanded here. The fundamental electron-molecule interaction processes are discussed in Chapter 1. The cross sections and rate coefficients most often used to describe these interactions are defined in Chapter 2, where some recent advances in the methods employed for their measurement or calculation are outlined. The methodology we adopted for the critical evaluation, synthesis, and assessment of the existing data is described in Chapter 3. The critically assessed data and recommended or suggested cross sections and rate and transport coefficients for ten plasma etching gases are presented and discussed in Chapters 4, 5, and 6.
Download or read book Plasma Etching Processes for Interconnect Realization in VLSI written by Nicolas Posseme and published by Elsevier. This book was released on 2015-04-14 with total page 123 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the first of two books presenting the challenges and future prospects of plasma etching processes for microelectronics, reviewing the past, present and future issues of etching processes in order to improve the understanding of these issues through innovative solutions.This book focuses on back end of line (BEOL) for high performance device realization and presents an overview of all etch challenges for interconnect realization as well as the current etch solutions proposed in the semiconductor industry. The choice of copper/low-k interconnect architecture is one of the keys for integrated circuit performance, process manufacturability and scalability. Today, implementation of porous low-k material is mandatory in order to minimize signal propagation delay in interconnections. In this context, the traditional plasma process issues (plasma-induced damage, dimension and profile control, selectivity) and new emerging challenges (residue formation, dielectric wiggling) are critical points of research in order to control the reliability and reduce defects in interconnects. These issues and potential solutions are illustrated by the authors through different process architectures available in the semiconductor industry (metallic or organic hard mask strategies). - Presents the difficulties encountered for interconnect realization in very large-scale integrated (VLSI) circuits - Focused on plasma-dielectric surface interaction - Helps you further reduce the dielectric constant for the future technological nodes
Download or read book VLSI Handbook written by Norman Einspruch and published by Academic Press. This book was released on 2012-12-02 with total page 929 pages. Available in PDF, EPUB and Kindle. Book excerpt: VLSI Handbook is a reference guide on very large scale integration (VLSI) microelectronics and its aspects such as circuits, fabrication, and systems applications. This handbook readily answers specific questions and presents a systematic compilation of information regarding the VLSI technology. There are a total of 52 chapters in this book and are grouped according to the fields of design, materials and processes, and examples of specific system applications. Some of the chapters under fields of design are design automation for integrated circuits and computer tools for integrated circuit design. For the materials and processes, there are many chapters that discuss this aspect. Some of them are manufacturing process technology for metal-oxide semiconductor (MOS) VLSI; MOS VLSI circuit technology; and facilities for VLSI circuit fabrication. Other concepts and materials discussed in the book are the use of silicon material in different processes of VLSI, nitrides, silicides, metallization, and plasma. This handbook is very useful to students of engineering and physics. Also, researchers (in physics and chemistry of materials and processes), device designers, and system designers can also benefit from this book.
Download or read book Plasma Processing of Materials written by National Research Council and published by National Academies Press. This book was released on 1991-02-01 with total page 88 pages. Available in PDF, EPUB and Kindle. Book excerpt: Plasma processing of materials is a critical technology to several of the largest manufacturing industries in the worldâ€"electronics, aerospace, automotive, steel, biomedical, and toxic waste management. This book describes the relationship between plasma processes and the many industrial applications, examines in detail plasma processing in the electronics industry, highlights the scientific foundation underlying this technology, and discusses education issues in this multidisciplinary field. The committee recommends a coordinated, focused, and well-funded research program in this area that involves the university, federal laboratory, and industrial sectors of the community. It also points out that because plasma processing is an integral part of the infrastructure of so many American industries, it is important for both the economy and the national security that America maintain a strong leadership role in this technology.
Download or read book Dry Etching for VLSI written by A.J. van Roosmalen and published by Springer Science & Business Media. This book was released on 2013-06-29 with total page 247 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book has been written as part of a series of scientific books being published by Plenum Press. The scope of the series is to review a chosen topic in each volume. To supplement this information, the abstracts to the most important references cited in the text are reprinted, thus allowing the reader to find in-depth material without having to refer to many additional publications. This volume is dedicated to the field of dry (plasma) etching, as applied in silicon semiconductor processing. Although a number of books have appeared dealing with this area of physics and chemistry, these all deal with parts of the field. This book is unique in that it gives a compact, yet complete, in-depth overview of fundamentals, systems, processes, tools, and applications of etching with gas plasmas for VLSI. Examples are given throughout the fundamental sections, in order to give the reader a better insight in the meaning and magnitude of the many parameters relevant to dry etching. Electrical engineering concepts are emphasized to explain the pros and cons of reactor concepts and excitation frequency ranges. In the description of practical applications, extensive use is made of cross-referencing between processes and materials, as well as theory and practice. It is thus intended to provide a total model for understanding dry etching. The book has been written such that no previous knowledge of the subject is required. It is intended as a review of all aspects of dry etching for silicon semiconductor processing.
Download or read book Plasma Processes for VLSI Pattern Transfer written by Bomy A. Chen and published by . This book was released on 1990 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Plasma Processing of Polymers written by Ricardo d'Agostino and published by Springer Science & Business Media. This book was released on 1997-11-30 with total page 554 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of the NATO Advanced Study Institute on Plasma Treatments and Deposition of Polymers, Acquafredda di Maratea, Italy, May 19-June 2, 1996
Download or read book Plasma Processing of Nanomaterials written by R. Mohan Sankaran and published by CRC Press. This book was released on 2017-12-19 with total page 433 pages. Available in PDF, EPUB and Kindle. Book excerpt: We are at a critical evolutionary juncture in the research and development of low-temperature plasmas, which have become essential to synthesizing and processing vital nanoscale materials. More and more industries are increasingly dependent on plasma technology to develop integrated small-scale devices, but physical limits to growth, and other challenges, threaten progress. Plasma Processing of Nanomaterials is an in-depth guide to the art and science of plasma-based chemical processes used to synthesize, process, and modify various classes of nanoscale materials such as nanoparticles, carbon nanotubes, and semiconductor nanowires. Plasma technology enables a wide range of academic and industrial applications in fields including electronics, textiles, automotives, aerospace, and biomedical. A prime example is the semiconductor industry, in which engineers revolutionized microelectronics by using plasmas to deposit and etch thin films and fabricate integrated circuits. An overview of progress and future potential in plasma processing, this reference illustrates key experimental and theoretical aspects by presenting practical examples of: Nanoscale etching/deposition of thin films Catalytic growth of carbon nanotubes and semiconductor nanowires Silicon nanoparticle synthesis Functionalization of carbon nanotubes Self-organized nanostructures Significant advances are expected in nanoelectronics, photovoltaics, and other emerging fields as plasma technology is further optimized to improve the implementation of nanomaterials with well-defined size, shape, and composition. Moving away from the usual focus on wet techniques embraced in chemistry and physics, the author sheds light on pivotal breakthroughs being made by the smaller plasma community. Written for a diverse audience working in fields ranging from nanoelectronics and energy sensors to catalysis and nanomedicine, this resource will help readers improve development and application of nanomaterials in their own work. About the Author: R. Mohan Sankaran received the American Vacuum Society’s 2011 Peter Mark Memorial Award for his outstanding contributions to tandem plasma synthesis.
Download or read book Handbook of Advanced Plasma Processing Techniques written by R.J. Shul and published by Springer Science & Business Media. This book was released on 2011-06-28 with total page 664 pages. Available in PDF, EPUB and Kindle. Book excerpt: Pattern transfer by dry etching and plasma-enhanced chemical vapor de position are two of the cornerstone techniques for modern integrated cir cuit fabrication. The success of these methods has also sparked interest in their application to other techniques, such as surface-micromachined sen sors, read/write heads for data storage and magnetic random access memory (MRAM). The extremely complex chemistry and physics of plasmas and their interactions with the exposed surfaces of semiconductors and other materi als is often overlooked at the manufacturing stage. In this case, the process is optimized by an informed "trial-and-error" approach which relies heavily on design-of-experiment techniques and the intuition of the process engineer. The need for regular cleaning of plasma reactors to remove built-up reaction or precursor gas products adds an extra degree of complexity because the interaction of the reactive species in the plasma with the reactor walls can also have a strong effect on the number of these species available for etching or deposition. Since the microelectronics industry depends on having high process yields at each step of the fabrication process, it is imperative that a full understanding of plasma etching and deposition techniques be achieved.
Download or read book Film Deposition by Plasma Techniques written by Mitsuharu Konuma and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Properties of thin films depend strongly upon the deposition technique and conditions chosen. In order to achieve the desired film, optimum deposition conditions have to be found by carrying out experiments in a trial-and error fashion with varying parameters. The data obtained on one growth apparatus are often not transferable to another. This is especially true for film deposition processes using a cold plasma because of our poor under standing of the mechanisms. Relatively precise studies have been carried out on the role that physical effects play in film formation such as sputter deposition. However, there are many open questions regarding processes that involve chemical reactions, for example, reactive sputter deposition or plasma enhanced chemical vapor deposition. Much further research is re quired in order to understand the fundamental deposition processes. A sys tematic collection of basic data, some of which may be readily available in other branches of science, for example, reaction cross sections for gases with energetic electrons, is also required. The need for pfasma deposition techniques is felt strongly in industrial applications because these techniques are superior to traditional thin-film deposition techniques in many ways. In fact, plasma deposition techniques have developed rapidly in the semiconductor and electronics industries. Fields of possible application are still expanding. A reliable plasma reactor with an adequate in situ system for monitoring the deposition conditions and film properties must be developed to improve reproducibility and pro ductivity at the industrial level.
Download or read book Plasma Processing XII written by G. S. Mathad and published by The Electrochemical Society. This book was released on 1998 with total page 308 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Plasma Processes for Semiconductor Fabrication written by W. N. G. Hitchon and published by Cambridge University Press. This book was released on 1999-01-28 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt: Plasma processing is a central technique in the fabrication of semiconductor devices. This self-contained book provides an up-to-date description of plasma etching and deposition in semiconductor fabrication. It presents the basic physics and chemistry of these processes, and shows how they can be accurately modeled. The author begins with an overview of plasma reactors and discusses the various models for understanding plasma processes. He then covers plasma chemistry, addressing the effects of different chemicals on the features being etched. Having presented the relevant background material, he then describes in detail the modeling of complex plasma systems, with reference to experimental results. The book closes with a useful glossary of technical terms. No prior knowledge of plasma physics is assumed in the book. It contains many homework exercises and serves as an ideal introduction to plasma processing and technology for graduate students of electrical engineering and materials science. It will also be a useful reference for practicing engineers in the semiconductor industry.
