Download or read book Photonics Packaging Integration and Interconnects IX written by and published by . This book was released on 2008 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Photonics Packaging Integration and Interconnects written by and published by . This book was released on 2007 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Photonics Packaging Integration and Interconnects IX written by Alexei L. Glebov and published by Society of Photo Optical. This book was released on 2009 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Includes Proceedings Vol. 7821
Download or read book Photonics Packaging Integration and Interconnects VII written by Allen M. Earman and published by Society of Photo Optical. This book was released on 2007 with total page 274 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
Download or read book Photonics Packaging Integration and Interconnects VIII written by Alexei L. Glebov and published by Society of Photo Optical. This book was released on 2008-01-01 with total page 364 pages. Available in PDF, EPUB and Kindle. Book excerpt: Includes Proceedings Vol. 7821
Download or read book High Speed Photonics Interconnects written by Lukas Chrostowski and published by CRC Press. This book was released on 2017-12-19 with total page 223 pages. Available in PDF, EPUB and Kindle. Book excerpt: Dramatic increases in processing power have rapidly scaled on-chip aggregate bandwidths into the Tb/s range. This necessitates a corresponding increase in the amount of data communicated between chips, so as not to limit overall system performance. To meet the increasing demand for interchip communication bandwidth, researchers are investigating the use of high-speed optical interconnect architectures. Unlike their electrical counterparts, optical interconnects offer high bandwidth and negligible frequency-dependent loss, making possible per-channel data rates of more than 10 Gb/s. High-Speed Photonics Interconnects explores some of the groundbreaking technologies and applications that are based on photonics interconnects. From the Evolution of High-Speed I/O Circuits to the Latest in Photonics Interconnects Packaging and Lasers Featuring contributions by experts from academia and industry, the book brings together in one volume cutting-edge research on various aspects of high-speed photonics interconnects. Contributors delve into a wide range of technologies, from the evolution of high-speed input/output (I/O) circuits to recent trends in photonics interconnects packaging. The book discusses the challenges associated with scaling I/O data rates and current design techniques. It also describes the major high-speed components, channel properties, and performance metrics. The book exposes readers to a myriad of applications enabled by photonics interconnects technology. Learn about Optical Interconnect Technologies Suitable for High-Density Integration with CMOS Chips This richly illustrated work details how optical interchip communication links have the potential to fully leverage increased data rates provided through complementary metal-oxide semiconductor (CMOS) technology scaling at suitable power-efficiency levels. Keeping the mathematics to a minimum, it gives engineers, researchers, graduate students, and entrepreneurs a comprehensive overview of the dynamic landscape of high-speed photonics interconnects.
Download or read book Optoelectronic Interconnects VII Photonics Packaging and Integration II written by Michael R. Feldman and published by SPIE-International Society for Optical Engineering. This book was released on 2000 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Optical Interconnects for Data Centers written by Tolga Tekin and published by Woodhead Publishing. This book was released on 2016-11-01 with total page 431 pages. Available in PDF, EPUB and Kindle. Book excerpt: Current data centre networks, based on electronic packet switches, are experiencing an exponential increase in network traffic due to developments such as cloud computing. Optical interconnects have emerged as a promising alternative offering high throughput and reduced power consumption. Optical Interconnects for Data Centers reviews key developments in the use of optical interconnects in data centres and the current state of the art in transforming this technology into a reality. The book discusses developments in optical materials and components (such as single and multi-mode waveguides), circuit boards and ways the technology can be deployed in data centres. Optical Interconnects for Data Centers is a key reference text for electronics designers, optical engineers, communications engineers and R&D managers working in the communications and electronics industries as well as postgraduate researchers. - Summarizes the state-of-the-art in this emerging field - Presents a comprehensive review of all the key aspects of deploying optical interconnects in data centers, from materials and components, to circuit boards and methods for integration - Contains contributions that are drawn from leading international experts on the topic
Download or read book Photonics Packaging and Integration written by and published by . This book was released on 2003 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Photonic Packaging Sourcebook written by Ulrich H. P. Fischer-Hirchert and published by Springer. This book was released on 2015-04-11 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of current industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Simulation techniques such as FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects.
Download or read book Micro optics VCSELs and Photonic Interconnects II written by Hugo Thienpont and published by Society of Photo Optical. This book was released on 2006 with total page 516 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
Download or read book Micro optics VCSELs and Photonic Interconnects II written by and published by . This book was released on 2006 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Integrated Photonics for Data Communication Applications written by Madeleine Glick and published by Elsevier. This book was released on 2023-07-26 with total page 523 pages. Available in PDF, EPUB and Kindle. Book excerpt: Integrated Photonics for Data Communications Applications reviews the key concepts, design principles, performance metrics and manufacturing processes from advanced photonic devices to integrated photonic circuits. The book presents an overview of the trends and commercial needs of data communication in data centers and high-performance computing, with contributions from end users presenting key performance indicators. In addition, the fundamental building blocks are reviewed, along with the devices (lasers, modulators, photodetectors and passive devices) that are the individual elements that make up the photonic circuits. These chapters include an overview of device structure and design principles and their impact on performance. Following sections focus on putting these devices together to design and fabricate application-specific photonic integrated circuits to meet performance requirements, along with key areas and challenges critical to the commercial manufacturing of photonic integrated circuits and the supply chains being developed to support innovation and market integration are discussed. This series is led by Dr. Lionel Kimerling Executive at AIM Photonics Academy and Thomas Lord Professor of Materials Science and Engineering at MIT and Dr. Sajan Saini Education Director at AIM Photonics Academy at MIT. Each edited volume features thought-leaders from academia and industry in the four application area fronts (data communications, high-speed wireless, smart sensing, and imaging) and addresses the latest advances. - Includes contributions from leading experts and end-users across academia and industry working on the most exciting research directions of integrated photonics for data communications applications - Provides an overview of data communication-specific integrated photonics starting from fundamental building block devices to photonic integrated circuits to manufacturing tools and processes - Presents key performance metrics, design principles, performance impact of manufacturing variations and operating conditions, as well as pivotal performance benchmarks
Download or read book Nanopackaging written by James E. Morris and published by Springer Science & Business Media. This book was released on 2008-12-30 with total page 553 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.
Download or read book Optical Fiber Telecommunications Volume VIA written by Ivan Kaminow and published by Academic Press. This book was released on 2013-05-03 with total page 795 pages. Available in PDF, EPUB and Kindle. Book excerpt: Optical Fiber Telecommunications VI (A&B) is the sixth in a series that has chronicled the progress in the R&D of lightwave communications since the early 1970s. Written by active authorities from academia and industry, this edition brings a fresh look to many essential topics, including devices, subsystems, systems and networks. A central theme is the enabling of high-bandwidth communications in a cost-effective manner for the development of customer applications. These volumes are an ideal reference for R&D engineers and managers, optical systems implementers, university researchers and students, network operators, and investors. Volume A is devoted to components and subsystems, including photonic integrated circuits, multicore and few-mode fibers, photonic crystals, silicon photonics, signal processing, and optical interconnections.
Download or read book Integrated Circuit Packaging Assembly and Interconnections written by William Greig and published by Springer Science & Business Media. This book was released on 2007-04-24 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.
Download or read book Heterogeneous Integrations written by John H. Lau and published by Springer. This book was released on 2019-04-03 with total page 368 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
