Download or read book Index to Theses with Abstracts Accepted for Higher Degrees by the Universities of Great Britain and Ireland and the Council for National Academic Awards written by and published by . This book was released on 2006 with total page 678 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Solder Joint Reliability written by John H. Lau and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 649 pages. Available in PDF, EPUB and Kindle. Book excerpt: Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.
Download or read book Lead Free Solder Interconnect Reliability written by Dongkai Shangguan and published by ASM International. This book was released on 2005 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Chemical Abstracts written by and published by . This book was released on 2002 with total page 2540 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Signal written by and published by . This book was released on 2012 with total page 776 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book E M F Electrical Year Book written by and published by . This book was released on 1923 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Current Programs written by and published by . This book was released on 1976 with total page 426 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Lead Free Electronic Solders written by KV Subramanian and published by Springer Science & Business Media. This book was released on 2007-06-28 with total page 370 pages. Available in PDF, EPUB and Kindle. Book excerpt: Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. This comprehensive book examines all the important issues associated with lead-free electronic solder. It collects the work of researchers recognized for their significant scientific contributions in the area.
Download or read book Failure Modes and Mechanisms in Electronic Packages written by P. Singh and published by Springer Science & Business Media. This book was released on 1997-11-30 with total page 398 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.
Download or read book Springer Handbook of Experimental Solid Mechanics written by William N. Sharpe, Jr. and published by Springer Science & Business Media. This book was released on 2008-12-04 with total page 1100 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Springer Handbook of Experimental Solid Mechanics documents both the traditional techniques as well as the new methods for experimental studies of materials, components, and structures. The emergence of new materials and new disciplines, together with the escalating use of on- and off-line computers for rapid data processing and the combined use of experimental and numerical techniques have greatly expanded the capabilities of experimental mechanics. New exciting topics are included on biological materials, MEMS and NEMS, nanoindentation, digital photomechanics, photoacoustic characterization, and atomic force microscopy in experimental solid mechanics. Presenting complete instructions to various areas of experimental solid mechanics, guidance to detailed expositions in important references, and a description of state-of-the-art applications in important technical areas, this thoroughly revised and updated edition is an excellent reference to a widespread academic, industrial, and professional engineering audience.
Download or read book Failure Analysis written by Marius Bazu and published by John Wiley & Sons. This book was released on 2011-03-08 with total page 372 pages. Available in PDF, EPUB and Kindle. Book excerpt: Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.
Download or read book Practical Reliability Engineering written by Patrick O'Connor and published by Wiley. This book was released on 1997-02-24 with total page 72 pages. Available in PDF, EPUB and Kindle. Book excerpt: This classic textbook/reference contains a complete integration of the processes which influence quality and reliability in product specification, design, test, manufacture and support. Provides a step-by-step explanation of proven techniques for the development and production of reliable engineering equipment as well as details of the highly regarded work of Taguchi and Shainin. New to this edition: over 75 pages of self-assessment questions plus a revised bibliography and references. The book fulfills the requirements of the qualifying examinations in reliability engineering of the Institute of Quality Assurance, UK and the American Society of Quality Control.
Download or read book The Electrical Review written by and published by . This book was released on 1921 with total page 938 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Fundamentals of Lead Free Solder Interconnect Technology written by Tae-Kyu Lee and published by Springer. This book was released on 2014-11-05 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt: This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
Download or read book Telegraphic Journal and Monthly Illustrated Review of Electrical Science written by and published by . This book was released on 1921 with total page 618 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Atomic Layer Deposition for Semiconductors written by Cheol Seong Hwang and published by Springer Science & Business Media. This book was released on 2013-10-18 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt: Offering thorough coverage of atomic layer deposition (ALD), this book moves from basic chemistry of ALD and modeling of processes to examine ALD in memory, logic devices and machines. Reviews history, operating principles and ALD processes for each device.
Download or read book Handbook of Modern Sensors written by Jacob Fraden and published by Springer Science & Business Media. This book was released on 2006-04-29 with total page 596 pages. Available in PDF, EPUB and Kindle. Book excerpt: Seven years have passed since the publication of the previous edition of this book. During that time, sensor technologies have made a remarkable leap forward. The sensitivity of the sensors became higher, the dimensions became smaller, the sel- tivity became better, and the prices became lower. What have not changed are the fundamental principles of the sensor design. They are still governed by the laws of Nature. Arguably one of the greatest geniuses who ever lived, Leonardo Da Vinci, had his own peculiar way of praying. He was saying, “Oh Lord, thanks for Thou do not violate your own laws. ” It is comforting indeed that the laws of Nature do not change as time goes by; it is just our appreciation of them that is being re?ned. Thus, this new edition examines the same good old laws of Nature that are employed in the designs of various sensors. This has not changed much since the previous edition. Yet, the sections that describe the practical designs are revised substantially. Recent ideas and developments have been added, and less important and nonessential designs were dropped. Probably the most dramatic recent progress in the sensor technologies relates to wide use of MEMS and MEOMS (micro-electro-mechanical systems and micro-electro-opto-mechanical systems). These are examined in this new edition with greater detail. This book is about devices commonly called sensors. The invention of a - croprocessor has brought highly sophisticated instruments into our everyday lives.
