Download or read book International Symposium on Quality Electronic Design written by and published by IEEE Computer Society Press. This book was released on 2002 with total page 584 pages. Available in PDF, EPUB and Kindle. Book excerpt: Annotation Fifty-one papers and 21 posters from the March 2002 symposium report current research in deep submicron integrated circuit design and development. The sessions address interconnect extraction and modeling, design for process variations, metrics, power and noise management, verification, signal integrity, and low power design techniques. Some of the topics are transition aware global signaling (TAGS), the interoperability of EDA tools for sequential logic synthesis, statistical methods for the determination of process corners, power supply noise suppression via clock skew scheduling, and the relation between SAT and BDDs for equivalence checking. No subject index. Annotation copyrighted by Book News Inc., Portland, OR.
Download or read book Physical Design for 3D Integrated Circuits written by Aida Todri-Sanial and published by CRC Press. This book was released on 2017-12-19 with total page 409 pages. Available in PDF, EPUB and Kindle. Book excerpt: Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Download or read book Through Silicon Vias written by Brajesh Kumar Kaushik and published by CRC Press. This book was released on 2016-11-30 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt: Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.
Download or read book Advanced Packaging written by and published by . This book was released on 2008-01 with total page 40 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.
Download or read book VLSI Design and Test written by Brajesh Kumar Kaushik and published by Springer. This book was released on 2017-12-21 with total page 820 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the refereed proceedings of the 21st International Symposium on VLSI Design and Test, VDAT 2017, held in Roorkee, India, in June/July 2017. The 48 full papers presented together with 27 short papers were carefully reviewed and selected from 246 submissions. The papers were organized in topical sections named: digital design; analog/mixed signal; VLSI testing; devices and technology; VLSI architectures; emerging technologies and memory; system design; low power design and test; RF circuits; architecture and CAD; and design verification.
Download or read book Proceedings of Ninth International Congress on Information and Communication Technology written by Xin-She Yang and published by Springer Nature. This book was released on with total page 670 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book VLSI Noise Processing Circuits Theoretical Bases and Implementations written by Hongjiang Song and published by Lulu.com. This book was released on 2015-06-08 with total page 390 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers various VLSI circuit noise effects and VLSI noise processing circuit implementations. All materials are organized in am unified framework with VLSI noise modeling and noise processing circuits across various VLSI signal domains.
Download or read book ISLPED 03 written by and published by . This book was released on 2003 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Wafer Level Chip Scale Packaging written by Shichun Qu and published by Springer. This book was released on 2014-09-10 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt: Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.
Download or read book Quantum Software Engineering written by Manuel A. Serrano and published by Springer Nature. This book was released on 2022-11-13 with total page 321 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a set of software engineering techniques and tools to improve the productivity and assure the quality in quantum software development. Through the collaboration of the software engineering community with the quantum computing community new architectural paradigms for quantum-enabled computing systems will be anticipated and developed. The book starts with a chapter that introduces the main concepts and general foundations related to quantum computing. This is followed by a number of chapters dealing with the quantum software engineering methods and techniques. Topics like the Talavera Manifesto for quantum software engineering, frameworks for hybrid systems, formal methods for quantum software engineering, quantum software modelling languages, and reengineering for quantum software are covered in this part. A second set of chapters then deals with quantum software environments and tools, detailing platforms like QuantumPath®, Classiq as well as quantum software frameworks for deep learning. Overall, the book aims at academic researchers and practitioners involved in the creation of quantum information systems and software platforms. It is assumed that readers have a background in traditional software engineering and information systems.
Download or read book Power Electronic Packaging written by Yong Liu and published by Springer Science & Business Media. This book was released on 2012-02-15 with total page 606 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Download or read book Frequency Measurement Technology written by Ignacio Llamas-Garro and published by Artech House. This book was released on 2017-12-31 with total page 225 pages. Available in PDF, EPUB and Kindle. Book excerpt: This unique first-of-its-kind resource provides practical coverage of the design and implementation of frequency measurement receivers, which aid in identifying unknown signals. The technologies used in frequency measurement interferometry-based on-delay lines and filters are explored in this book. Practitioners also find concrete examples of microwave photonics implementations. The designs and concepts that cover conventional photonic instantaneous frequency measurement (IFM) circuits are explained. This book provides details on new designs for microwave photonic circuits and reconfigurable frequency measurement (RFM) circuits using diodes and MicroElectroMechanical Systems (MEMS). This book explains the many diverse applications of frequency measurement that are used in defense, radar, and communications. The instrumentation used to perform frequency measurements is explained, including the use of block analysis for network and spectrum analyzers and calibration techniques. Readers learn the advantages of using frequency measurement based on microwave/RF techniques, including immunity to electromagnetic interference, low loss, compatibility with fiber signal distribution, and parallel processing signals. Moreover, readers gain insight into the future of frequency measurement receivers. The book examines both the underpinnings and the implementation of frequency measurement receivers using many diverse technological platforms.
Download or read book Design for X written by Charles M. Eastman and published by Springer Science & Business Media. This book was released on 1996-08-31 with total page 506 pages. Available in PDF, EPUB and Kindle. Book excerpt: Bringing together the expertise of worldwide authorities in the field, Design for X is the first comprehensive book to offer systematic and structured coverage of contemporary and concurrent product development techniques. It features over fifteen techniques, including: design for manufacture and assembly; design for distribution; design for quality; and design for the environment. Alternative approaches and common elements are discussed and critical issues such as integration and tradeoff are explored.
Download or read book Handbook of Energy Aware and Green Computing Two Volume Set written by Ishfaq Ahmad and published by CRC Press. This book was released on 2016-02-03 with total page 1284 pages. Available in PDF, EPUB and Kindle. Book excerpt: Implementing energy-efficient CPUs and peripherals as well as reducing resource consumption have become emerging trends in computing. As computers increase in speed and power, their energy issues become more and more prevalent. The need to develop and promote environmentally friendly computer technologies and systems has also come to the forefront
Download or read book 9th International Conference on the Development of Biomedical Engineering in Vietnam written by Van Toi Vo and published by Springer Nature. This book was released on 2023-11-19 with total page 1140 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents cutting-edge research and developments in the field of biomedical engineering, with a special emphasis on results achieved in Vietnam and neighboring low- and middle-income countries. Covering both fundamental and applied research, and focusing on the theme of “Translational Healthcare Technology from Advanced to Low and Middle Income Countries in the Era of Covid and Digital Transformation”, it reports on the design, fabrication, and application of low-cost and portable medical devices, biosensors, and microfluidic devices, on improved methods for biological data acquisition and analysis, on nanoparticles for biological applications, and on new achievements in biomechanics, tissue engineering, and regeneration. It describes the developments of molecular and cellular biology techniques, neuroengineering techniques, and statistical and computational methods, including artificial intelligence, for biomedical applications. It also discusses strategies to address some relevant issues in biomedical education and entrepreneurship. Gathering the proceedings of the 9th International Conference on The Development of Biomedical Engineering in Vietnam, BME 9, held on December 27-29, 2022, in Ho Chi Minh, Vietnam, the book offers important answers to current challenges in the field and a source of inspiration for scientists, engineers, and researchers with various backgrounds working in different research institutes, companies, and countries.
Download or read book Sustained Simulation Performance 2012 written by Michael M. Resch and published by Springer Science & Business Media. This book was released on 2012-10-02 with total page 188 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book presents the state of the art in high performance computing and simulation on modern supercomputer architectures. It covers trends in hardware and software development in general and specifically the future of high performance systems and heterogeneous architectures. The application contributions cover computational fluid dynamics, material science, medical applications and climate research. Innovative fields like coupled multi-physics or multi-scale simulations are presented. All papers were chosen from presentations given at the 14th Teraflop Workshop held in December 2011 at HLRS, University of Stuttgart, Germany and the Workshop on Sustained Simulation Performance at Tohoku University in March 2012.
Download or read book Proceedings written by and published by . This book was released on 2003 with total page 514 pages. Available in PDF, EPUB and Kindle. Book excerpt:
