Download or read book Natural Convection Immersion Cooling of an Array of Simulated Chips in an Enclosure Filled with Dielectric Liquid written by Turgay Pamuk and published by . This book was released on 1987 with total page 71 pages. Available in PDF, EPUB and Kindle. Book excerpt: An experimental natural convection heat transfer study of a simulated electronic circuit board has been conducted. The board has an array of 9 simulated chips, each dissipating up to 2.5 Watts. The board is immersed in FC75, a fluorocarbon liquid, in an enclosure whose top and bottom surfaces are constant temperature heat sinks. The experimental data have been expressed in terms of relevant dimensionless heat transfer parameters such as Nusselt and Rayleigh numbers. The trend is that, the chips located higher in the enclosure have lower heat transfer rates. Otherwise the chips in the same row behave in a similar way which implies a quasi-two dimensionality. Keywords: Electronic cooling.
Download or read book Natural Convection Immersion Cooling of an Array of Vertically Oriented Heated Protrusions in an Enclosure Filled with a Dielectric Liquid Effects of Enclosure Width Prandtl Number and Component Orientation written by Scott T. Matthews and published by . This book was released on 1991 with total page 97 pages. Available in PDF, EPUB and Kindle. Book excerpt: The natural convection heat transfer characteristics of a 3x3 array of vertically oriented heated protrusions, immersed in a dielectric liquid, were investigated. Aluminum blocks, 24mm x 8mm x 6mm, were used to simulate 20 pin dual in-line packages. Surface temperature measurements of the components were made by imbedding copper-constantan thermocouples below the surface of each component face. A constant heat flux was provided to each component using an Inconel foil heating element. Power supplied to each component varied from 0.115W to 2.90W. The aluminum blocks were mounted on a plexiglass substrate to form a 3x3 array of simulated electronic components. The circuit board containing the components was placed in a rectangular, plexiglass enclosure with inner dimensions: L = 203.2mm H = 152.0mm W = 82.6mm, and a wall thickness of 25.4mm. The upper boundary was maintained at 10 C, while all other exterior surfaces were insulated. The chamber width, measured from the surface of the circuit board to the opposite, inner wall of the enclosure, was varied from 42mm to 7mm by inserting plexiglass spacers into the enclosure. Two dielectric liquids, FC-75 and FC-43, were used as working fluids. Non dimensional data from this study was combined with the data obtained for a horizontal component orientation, to develop an empirical correlation which predicts the Nusselt number as a function of Rayleigh number, Prandtl number, component orientation and chamber width. This correlation was found to be accurate to within 11% of the original curve fit data.
Download or read book An Advanced Study of Natural Convection Immersion Cooling of a 3 X 3 Array of Simulated Components in an Enclosure Filled with Dielectric Liquid written by and published by . This book was released on 1988 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: An experimental study has been conducted to examine the three dimensional natural convection heat transfer from an array of simulated electronic components immersed in a chamber filled with Fluorinert FC-75, a commercially available dielectric liquid. The top and bottom walls of the chamber were maintained at uniform temperature while all other surfaces were insulated. The simulated components were in the form of a 3 x 3 array of discrete protruding aluminum blocks, each with geometrical dimensions of a 20 Pin Dual-inline-Package. The components were electrically powered resulting in a range of energy dissipation levels from 0.1 to 3.1 watts. Flow visualization in steady state was accomplished using Magnesium particles illuminated by a Helium Neon laser plane. Component surface temperature measurements allowed determination of the heat transfer characteristics. Timewise fluctuations of temperature at several locations were measured with increasing power levels. Keywords: Computer programs, Electronic cooling, Protruding heat sources, Flow visualization, Convective heat transfer, Immersion cooling, Dielectric liquids, Theses. (jhd).
Download or read book An Advanced Study of Natural Convection Immersion Cooling of a 3 X 3 Array of Simulated Components in an Enclosure Filled with Dielectric Liquid written by Terry J. Benedict and published by . This book was released on 1988 with total page 113 pages. Available in PDF, EPUB and Kindle. Book excerpt: An experimental study has been conducted to examine the three dimensional natural convection heat transfer from an array of simulated electronic components immersed in a chamber filled with Fluorinert FC-75, a commercially available dielectric liquid. The top and bottom walls of the chamber were maintained at uniform temperature while all other surfaces were insulated. The simulated components were in the form of a 3 x 3 array of discrete protruding aluminum blocks, each with geometrical dimensions of a 20 Pin Dual-inline-Package. The components were electrically powered resulting in a range of energy dissipation levels from 0.1 to 3.1 watts. Flow visualization in steady state was accomplished using Magnesium particles illuminated by a Helium Neon laser plane. Component surface temperature measurements allowed determination of the heat transfer characteristics. Timewise fluctuations of temperature at several locations were measured with increasing power levels. Keywords: Computer programs, Electronic cooling, Protruding heat sources, Flow visualization, Convective heat transfer, Immersion cooling, Dielectric liquids, Theses. (jhd).
Download or read book Natural Convection Immersion Cooling of an Array of Vertically Oriented Heated Protrusions in an Enclosure Filled with a Dielectric Liquid Effects of Enclosure Width Prandtl Number and Component Orientation written by and published by . This book was released on 1991 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: The natural convection heat transfer characteristics of a 3x3 array of vertically oriented heated protrusions, immersed in a dielectric liquid, were investigated. Aluminum blocks, 24mm x 8mm x 6mm, were used to simulate 20 pin dual in-line packages. Surface temperature measurements of the components were made by imbedding copper-constantan thermocouples below the surface of each component face. A constant heat flux was provided to each component using an Inconel foil heating element. Power supplied to each component varied from 0.115W to 2.90W. The aluminum blocks were mounted on a plexiglass substrate to form a 3x3 array of simulated electronic components. The circuit board containing the components was placed in a rectangular, plexiglass enclosure with inner dimensions: L = 203.2mm H = 152.0mm W = 82.6mm, and a wall thickness of 25.4mm. The upper boundary was maintained at 10 C, while all other exterior surfaces were insulated. The chamber width, measured from the surface of the circuit board to the opposite, inner wall of the enclosure, was varied from 42mm to 7mm by inserting plexiglass spacers into the enclosure. Two dielectric liquids, FC-75 and FC-43, were used as working fluids. Non dimensional data from this study was combined with the data obtained for a horizontal component orientation, to develop an empirical correlation which predicts the Nusselt number as a function of Rayleigh number, Prandtl number, component orientation and chamber width. This correlation was found to be accurate to within 11% of the original curve fit data.
Download or read book Naval Research Reviews written by and published by . This book was released on 1992 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1992 with total page 1572 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Applied Computational Fluid Dynamics written by Vijay K. Garg and published by CRC Press. This book was released on 1998-05-08 with total page 442 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Describes the latest techniques and real-life applications of computational fluid dynamics (CFD) and heat transfer in aeronautics, materials processing and manufacturing, electronic cooling, and environmental control. Includes new material from experienced researchers in the field. Complete with detailed equations for fluid flow and heat transfer."
Download or read book Natural Convection Cooling of a 3 by 3 Array of Rectangular Protrusions in an Enclosure Filled with Dielectric Liquid written by Edgardo I. Torres and published by . This book was released on 1988 with total page 138 pages. Available in PDF, EPUB and Kindle. Book excerpt: An experimental investigation of natural convection immersion cooling of two configurations of discrete heat sources in an enclosure filled with Fluorinert FC-75 has been conducted. A three by three array of rectangular protrusions was employed. In the first study, using the same equipment set-up of Benedict, the influence of changing the enclosure bottom surface boundary condition of flow patterns and heat transfer characteristics was examined. Both insulated and uniform temperature boundary conditions were considered. In the second set of experiments, a new chamber with the protrusions oriented vertically was assembled and effects of component orientation on the heat transfer characteristics were examined. In addition, timewise variations of temperature in several locations were measured an interpreted a different power levels. Theses. Keywords: Direct Immersion, Natural Convection Cooling, Dielectric Liquid Protrusions, Enclosure, Simulated Circuit Board, Strip Heaters, Flow Visualization, Convective Heat Transfer. (MJM).
Download or read book Masters Theses in the Pure and Applied Sciences written by Wade H. Shafer and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 430 pages. Available in PDF, EPUB and Kindle. Book excerpt: Masters Theses in the Pure and Applied Sciences was first conceived, published, and disseminated by the Center for Information and Numerical Oata Analysis and Synthesis (CINOAS) * at Purdue. University in 1957, starting its coverage of theses with the academic year 1955. Beginning with Volume 13, the printing and dissemination phases of the activity were transferred to University Microfilms/Xerox of Ann Arbor, Michigan, with the thought that such an arrangement would be more beneficial to the academic and general scientific and technical community. After five years of this joint undertaking we had concluded that it was in the interest of all con cerned if the printing and distribution of the volumes were handled by an interna tional publishing house to assure improved service and broader dissemination. Hence, starting with Volume 18, Masters Theses in the Pure and Applied Sciences has been disseminated on a worldwide basis by Plenum Publishing Cor poration of New York, and in the same year the coverage was broadened to include Canadian universities. All back issues can also be ordered from Plenum. We have reported in Volume 33 (thesis year 1988) a total of 13,273 theses titles from 23 Canadian and 1 85 United States universities. We are sure that this broader base for these titles reported will greatly enhance the value of this important annual reference work. While Volume 33 reports theses submitted in 1988, on occasion, certain univer sities do report theses submitted in previous years but not reported at the time.
Download or read book The CRC Handbook of Mechanical Engineering written by D. Yogi Goswami and published by CRC Press. This book was released on 2004-09-29 with total page 2690 pages. Available in PDF, EPUB and Kindle. Book excerpt: The second edition of this standard-setting handbook provides and all-encompassing reference for the practicing engineer in industry, government, and academia, with relevant background and up-to-date information on the most important topics of modern mechanical engineering. These topics include modern manufacturing and design, robotics, computer engineering, environmental engineering, economics, patent law, and communication/information systems. The final chapter and appendix provide information regarding physical properties and mathematical and computational methods. New topics include nanotechnology, MEMS, electronic packaging, global climate change, electric and hybrid vehicles, and bioengineering.
Download or read book Applied Mechanics Reviews written by and published by . This book was released on 1989 with total page 1518 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Cooling of Electronic Systems written by Sadik Kakaç and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 953 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.
Download or read book Technical Reports Awareness Circular TRAC written by and published by . This book was released on 1988-08 with total page 518 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Use of Services for Family Planning and Infertility United States 1982 written by Gerry E. Hendershot and published by . This book was released on 1988 with total page 982 pages. Available in PDF, EPUB and Kindle. Book excerpt: The 1982 statistics on the use of family planning and infertility services presented in this report are preliminary results from Cycle III of the National Survey of Family Growth (NSFG), conducted by the National Center for Health Statistics. Data were collected through personal interviews with a multistage area probability sample of 7969 women aged 15-44. A detailed series of questions was asked to obtain relatively complete estimates of the extent and type of family planning services received. Statistics on family planning services are limited to women who were able to conceive 3 years before the interview date. Overall, 79% of currently mrried nonsterile women reported using some type of family planning service during the previous 3 years. There were no statistically significant differences between white (79%), black (75%) or Hispanic (77%) wives, or between the 2 income groups. The 1982 survey questions were more comprehensive than those of earlier cycles of the survey. The annual rate of visits for family planning services in 1982 was 1077 visits /1000 women. Teenagers had the highest annual visit rate (1581/1000) of any age group for all sources of family planning services combined. Visit rates declined sharply with age from 1447 at ages 15-24 to 479 at ages 35-44. Similar declines with age also were found in the visit rates for white and black women separately. Nevertheless, the annual visit rate for black women (1334/1000) was significantly higher than that for white women (1033). The highest overall visit rate was for black women 15-19 years of age (1867/1000). Nearly 2/3 of all family planning visits were to private medical sources. Teenagers of all races had higher family planning service visit rates to clinics than to private medical sources, as did black women age 15-24. White women age 20 and older had higher visit rates to private medical services than to clinics. Never married women had higher visit rates to clinics than currently or formerly married women. Data were also collected in 1982 on use of medical services for infertility by women who had difficulty in conceiving or carrying a pregnancy to term. About 1 million ever married women had 1 or more infertility visits in the 12 months before the interview. During the 3 years before interview, about 1.9 million women had infertility visits. For all ever married women, as well as for white and black women separately, infertility services were more likely to be secured from private medical sources than from clinics. The survey design, reliability of the estimates and the terms used are explained in the technical notes.
Download or read book Advances in Thermal Modeling of Electronic Components and Systems written by and published by . This book was released on 1998 with total page 480 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Experiments on Liquid Immersion Natural Convection Cooling of Leadless Chip Carriers Mounted on Ceramic Substrate written by Rufino A. Paje and published by . This book was released on 1989 with total page 86 pages. Available in PDF, EPUB and Kindle. Book excerpt: An experimental investigation of natural convection heat transfer from a commercially available semiconductor device package is presented. The package was centrally mounted on a ceramic substrate. The package-substrate assembly formed one surface of a dielectric-filled cubical enclosure of aspect ratio one. The top surface of the enclosure was maintained at prescribed temperature. Surface temperature measurements were made at various locations on the substrate, the package lid, as well as the chip center. These measurements are reported for three dielectric fluids and three enclosures top surface temperatures, both with the substrate oriented horizontally as well as vertically. The results indicate that the maximum input power without exceeding a chip junction temperature of 80 C is 2.58 watts with FC-75 as the cooling fluid and the upper boundary maintained at 15 C. This is significantly larger than the maximum of 1.21 watts allowable with the natural convection air cooling. Keywords: Theses; Heat transfer; Heat conductance; Leadless chip carriers; Liquid immersion; Cooling natural convection. (kt).
