Download or read book Multichip Modules written by Ernest S. Kuh and published by World Scientific. This book was released on 1992 with total page 172 pages. Available in PDF, EPUB and Kindle. Book excerpt: Multichip Module (MCM) technology has been used in high-end systems, such as mainframe and supercomputers as well as military and space applications for some time. Rapid advances in VLSI technology and novel system architecture concepts have presented both challenges and opportunities for MCM technologists. Recent developments in MCM technology indicate that it will eventually take over much of the electronic packaging currently using printed circuit boards. This collection of articles gives an in-depth study of the state-of-the-art of MCM technology from systems, CAD and technology viewpoints. Written by outstanding experts in their fields, this volume should be considered essential reading.
Download or read book Conceptual Design of Multichip Modules and Systems written by Peter A. Sandborn and published by Springer Science & Business Media. This book was released on 2013-03-14 with total page 270 pages. Available in PDF, EPUB and Kindle. Book excerpt: Conceptual Design of Multichip Modules and Systems treats activities which take place at the conceptual and specification level of the design of complex multichip systems. These activities include the formalization of design knowledge (information modeling), tradeoff analysis, partitioning, and decision process capture. All of these functions occur prior to the traditional CAD activities of synthesis and physical design. Inherent in the design of electronic modules are tradeoffs which must be understood before feasible technology, material, process, and partitioning choices can be selected. The lack of a complete set of technology information is an especially serious problem in the packaging and interconnect field since the number of technologies, process, and materials is substantial and selecting optimums is arduous and non-trivial if one truly wants a balance in cost and performance. Numerous tradeoff and design decisions have to be made intelligently and quickly at the beginning of the design cycle before physical design work begins. These critical decisions, made within the first 10% of the total design cycle, ultimately define up to 80% of the final product cost. Conceptual Design of Multichip Modules and Systems lays the groundwork for concurrent estimation level analysis including size, routing, electrical performance, thermal performance, cost, reliability, manufacturability, and testing. It will be useful both as a reference for system designers and as a text for those wishing to gain a perspective on the nature of packaging and interconnect design, concurrent engineering, computer-aided design, and system synthesis.
Download or read book Chip On Board written by John H. Lau and published by Springer Science & Business Media. This book was released on 1994-06-30 with total page 584 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.
Download or read book Physical Design for Multichip Modules written by Mysore Sriram and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 205 pages. Available in PDF, EPUB and Kindle. Book excerpt: Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well as original work by the authors. All major aspects of MCM physical design are discussed, including interconnect analysis and modeling, system partitioning and placement, and multilayer routing. For readers unfamiliar with MCMs, this book presents an overview of the different MCM technologies available today. An in-depth discussion of various recent approaches to interconnect analysis are also presented. Remaining chapters discuss the problems of partitioning, placement, and multilayer routing, with an emphasis on timing performance. For the first time, data from a wide range of sources is integrated to present a clear picture of a new, challenging and very important research area. For students and researchers looking for interesting research topics, open problems and suggestions for further research are clearly stated. Points of interest include : Clear overview of MCM technology and its relationship to physical design; Emphasis on performance-driven design, with a chapter devoted to recent techniques for rapid performance analysis and modeling of MCM interconnects; Different approaches to multilayer MCM routing collected together and compared for the first time; Explanation of algorithms is not overly mathematical, yet is detailed enough to give readers a clear understanding of the approach; Quantitative data provided wherever possible for comparison of different approaches; A comprehensive list of references to recent literature on MCMs provided.
Download or read book High Performance Design Automation for Multi chip Modules and Packages written by Jun-Dong Cho and published by World Scientific. This book was released on 1996 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt: Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages.
Download or read book Multichip Module Technologies and Alternatives The Basics written by Daryl Ann Doane and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 895 pages. Available in PDF, EPUB and Kindle. Book excerpt: Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.
Download or read book Multi Chip Module Test Strategies written by Yervant Zorian and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 161 pages. Available in PDF, EPUB and Kindle. Book excerpt: MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs. Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain. Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).
Download or read book Multichip Modules written by R. Wayne Johnson and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1991 with total page 618 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume provides the information essential for making the right decisions required for new equipment design.
Download or read book Multichip Modules written by and published by . This book was released on 1994 with total page 676 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Multichip Module Technology Handbook written by Philip E. Garrou and published by McGraw-Hill Professional Publishing. This book was released on 1998 with total page 696 pages. Available in PDF, EPUB and Kindle. Book excerpt: MCMs are electronic components that house multiple integrated circuits (ICs) upon a single chip. Their use in design allow systems that are faster, hotter and more reliable than those built with standalone ICs. More and more, the speed needs of electronic systems require MCMs. This comprehensive handbook aims to provide designers with the knowledge needed to understand and work with MCMs.
Download or read book Library of Congress Subject Headings written by Library of Congress. Cataloging Policy and Support Office and published by . This book was released on 2004 with total page 1392 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Library of Congress Subject Headings written by Library of Congress and published by . This book was released on 2013 with total page 1624 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Introduction to Multichip Modules written by Naveed A. Sherwani and published by Wiley-Interscience. This book was released on 1995-11-23 with total page 352 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advantages of MCMs over traditional packaging methods for electronic-based applications in computers, aviation, and the military. Introduction to Multichip Modules discusses both custom built MCMs and programmable MCMs and their role in reducing cost and improving turnaround time. An invaluable resource for students and professionals in electrical engineering who design MCMs and MCM-based systems, and for those in computer science who develop CAD tools for MCMs, this.
Download or read book Multichip Modules and Related Technologies written by Gerald L. Ginsberg and published by McGraw-Hill Companies. This book was released on 1994 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Optimal Design in Self damped Lossy Transmission Lines for Multichip Modules written by Jimmy Shinn-Hwa Wang and published by . This book was released on 1993 with total page 26 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Multichip Modules with Integrated Sensors written by W.K. Jones and published by Springer. This book was released on 1996-10-31 with total page 342 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of the May 1995 workshop. Contains 33 papers which review advances in Multichip Modules (MCM) technology, including ceramic based MCM-C, thin film MCM-D and organic laminate based MCM-L. Sensors based on micromachined silicon structures, thin, and thick film technology are reviewed. Applications of MCM to higher level integration and sensor integration and reliability impacts are presented. The authors address new materials development, characterized methods, and high level integration of sensors into electronic packaging. Annotation copyrighted by Book News, Inc., Portland, OR
Download or read book Proceedings 1996 International Conference on Multichip Modules written by and published by . This book was released on 1996 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt:
