Download or read book Millimeter wave Wafer Scale Phased Arrays and Wireless Communication Circuits and Systems in SiGe and CMOS Technology written by Woorim Shin and published by . This book was released on 2013 with total page 95 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thesis presents a W-band wafer-scale phased array transmitter with high efficiency on-chip antennas. The 4x4 phased array is based on an RF beamforming architecture with an equiphase distribution network and 2-bit phase shifters placed in every element. The differential on-chip antennas are implemented using a 100 um thick quartz superstrate and have an efficiency of ~45% at 110 GHz. The use of electromagnetically coupled antenna leads to wafer-scale phased array concept with simple integration method. The phased array transmitter is implemented in 0.18 [mu]m SiGe BiCMOS process, and the measurement shows an array gain of 26.5 dB, pattern directivity of 17.0 dBi, maximum EIRP of 23-25 dBm at 108-114 GHz. The direct pattern measurement from the phased array transmitter shows beam steering capabilities up to plus/minus ±30° in two orthogonal directions. This is the first demonstration of wafer-scale phased array in silicon technology. Millimeter-wave circuit components in 45nm SOI CMOS technology are also presented. Transmission-line based D-band common-source and cascode amplifers are designed with the peak gain of 8.7 dB at 147 GHz and 6.1 dB at 171 GHz, respectively. The experimental characterization of the technology shows that on-chip passive elements has low-quality factor, and it can offset performance advantage of the active devices. A 60 GHz active phased shifter with quadrature all-pass filter shows -4 dB insertion gain with

Download or read book Single Chip 64 and 256 Element Wafer Scale Phased Arrays and Communication Circuits in Advanced SiGe and CMOS Technologies written by Samet Zihir and published by . This book was released on 2015 with total page 106 pages. Available in PDF, EPUB and Kindle. Book excerpt: The development of millimeter-wave phased arrays has been mostly based on silicon RFIC chips containing 8-16 channels and connected to antennas on organic printed circuit boards, or on wafer-scale phased arrays with on-chip antennas. Extending the wafer-scale array to a large number of elements results in an un-surmountable challenge, mainly that the phased-array chip may be much larger than a full reticle (approximately 22x22 mm2), and this is not allowed using standard integrated circuit design and layout rules. This dissertation focuses on the implementation of wafer-scale phased array with 64- and 256-elements using sub-reticle stitching techniques. An implementation of the largest single-chip wafer-scale phased-array ever built is demonstrated. The measured EIRP is 38 dBm and 45 dBm, with measured half-power beamwidth of 12.5 and 6 at 61 GHz for the 64- and 256-element phased arrays, respectively. This work allows the construction of large-scale (1000+ elements) phased-array systems, either on a single wafer or by assembling several of these chips together on a low cost board.

Download or read book Millimeter Wave Phased Arrays for 5G Communications written by Umut Kodak and published by . This book was released on 2019 with total page 116 pages. Available in PDF, EPUB and Kindle. Book excerpt: The fifth-generation (5G) wireless communication standard is being developed to supply faster wireless data transfer to ever-growing number of cellular network subscribers, and millimeter-wave phasedarray transceivers have been proven to be perfect candidates for 5G infrastructure. This dissertation focuses on the design and implementation of phased-arrays at 28 GHz and 60 GHz using 45-nm CMOS SOI and 0.18-[mu]m SiGe BiCMOS technologies, respectively. A common-leg transmit/receive phased-array front-end module is implemented for high-efficiency and high-linearity 5G applications. The design flow is discussed and the error-vector magnitude (EVM) measurements are demonstrated with 8 Gbps data-rate. Reusing some of the sub-blocks of this design, a 28 GHz two-element passive bidirectional phased-array core-chip is designed and flip-chip packaged. The details of this design is presented in the appendix. The 60 GHz dual-polarized dual-beam wafer-scale phased-array transceiver addresses the challenges of building a phased-array that is larger than the standard maximum reticle size (22x22 mm2) for increased coverage. The design strategies are discussed as well as the system and communication link analysis. This work shows the construction of infinite-element phased-arrays on a low-cost printed circuit board (PCB) using only bondwires to form a functional wafer-scale array.

Download or read book Low Power Wireless Communication Circuits and Systems written by Kiat Seng Yeo and published by CRC Press. This book was released on 2018-05-03 with total page 342 pages. Available in PDF, EPUB and Kindle. Book excerpt: The increasing demand for extremely high-data-rate communications has urged researchers to develop new communication systems. Currently, wireless transmission with more than one Giga-bits-per-second (Gbps) data rates is becoming essential due to increased connectivity between different portable and smart devices. To realize Gbps data rates, millimeter-wave (MMW) bands around 60 GHz is attractive due to the availability of large bandwidth of 9 GHz. Recent research work in the Gbps data rates around 60 GHz band has focused on short-range indoor applications, such as uncompressed video transfer, high-speed file transfer between electronic devices, and communication to and from kiosk. Many of these applications are limited to 10 m or less, because of the huge free space path loss and oxygen absorption for 60 GHz band MMW signal. This book introduces new knowledge and novel circuit techniques to design low-power MMW circuits and systems. It also focuses on unlocking the potential applications of the 60 GHz band for high-speed outdoor applications. The innovative design application significantly improves and enables high-data-rate low-cost communication links between two access points seamlessly. The 60 GHz transceiver system-on-chip provides an alternative solution to upgrade existing networks without introducing any building renovation or external network laying works.

Download or read book Millimeter Wave Antennas Configurations and Applications written by Jaco du Preez and published by Springer. This book was released on 2016-06-20 with total page 165 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book comprehensively reviews the state of the art in millimeter-wave antennas, traces important recent developments and provides information on a wide range of antenna configurations and applications. While fundamental theoretical aspects are discussed whenever necessary, the book primarily focuses on design principles and concepts, manufacture, measurement techniques, and practical results. Each of the various antenna types scalable to millimeter-wave dimensions is considered individually, with coverage of leaky-wave and surface-wave antennas, printed antennas, integrated antennas, and reflector and lens systems. The final two chapters address the subject from a systems perspective, providing an overview of supporting circuitry and examining in detail diverse millimeter-wave applications, including high-speed wireless communications, radio astronomy, and radar. The vast amount of information now available on millimeter-wave systems can be daunting for researchers and designers entering the field. This book offers readers essential guidance, helping them to gain a thorough understanding based on the most recent research findings and serving as a sound basis for informed decision-making.

Download or read book Millimeter Wave Circuits for 5G and Radar written by Gernot Hueber and published by Cambridge University Press. This book was released on 2019-06-20 with total page 455 pages. Available in PDF, EPUB and Kindle. Book excerpt: Discover the concepts, architectures, components, tools, and techniques needed to design millimeter-wave circuits for current and emerging wireless system applications. Focusing on applications in 5G, connectivity, radar, and more, leading experts in radio frequency integrated circuit (RFIC) design provide a comprehensive treatment of cutting-edge physical-layer technologies for radio frequency (RF) transceivers - specifically RF, analog, mixed-signal, and digital circuits and architectures. The full design chain is covered, from system design requirements through to building blocks, transceivers, and process technology. Gain insight into the key novelties of 5G through authoritative chapters on massive MIMO and phased arrays, and learn about the very latest technology developments, such as FinFET logic process technology for RF and millimeter-wave applications. This is an essential reading and an excellent reference for high-frequency circuit designers in both academia and industry.

Download or read book SiGe Integrated Circuits for Millimeter wave Imaging and Phased Arrays written by Jason W. May and published by . This book was released on 2009 with total page 119 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Silicon based Millimeter wave Circuits for W band Applications written by Chun-Cheng Wang and published by . This book was released on 2012 with total page 115 pages. Available in PDF, EPUB and Kindle. Book excerpt: Historically, monolithic microwave integrated circuits (MMICs) have been designed using III-V semiconductor technologies, such as GaAs and InP. In recent years, the number of publications reporting silicon-based millimeter-wave (mm-wave) transmitter, receivers, and transceivers has grown steadily. For mm-wave applications including gigabit/s point-to-point links (57-64 GHz), automotive radar (77-81 GHz) and imaging (94 GHz) to reach mainstream market, the cost, size and power consumption of silicon-based solution has to be significantly below what is being achieved today using compound semiconductor technology. This dissertation focuses the effort of designing and implementing silicon-based solutions through circuit- and system-level innovation for applications in the W-band frequency band (75-110GHz), in particular, 94GHz passive imaging band. A W-band front-end receiver in 65nm CMOS based entirely on slow-wave CPW (SW-CPW) with frequency tripler as the LO is designed and measured. The receiver achieves a total gain of 35-dB, -3dB-BW of 12 GHz, a NF of 9-dB, a P1-dB of -40dBm, a low power consumption of 108mW under 1.2/0.8V. This front-end receiver chipset in conjuction with an analog back-end can be used to form a radiometer. Leveraging the work done in 65nm CMOS, the first integrated 2x2 focal-plane array (FPA) for passive imaging is implemented in a 0.18um SiGe BiCMOS process (fT/fmax=200/180GHz). The FPA incorporates four Dicke-type receivers. Each receiver employs a direct-conversion architecture consisting of an on-chip slot dipole antenna, an SPDT switch, a lower noise amplifier, a single-balanced mixer, an injection-locked frequency tripler (ILFT), a zero-IF variable gain amplifier, a power detector, an active bandpass filter and a synchronous demodulator. The LO signal is generated by a shared Ka-band PLL and distributed symmetrically to four ILFTs. This work demonstrates the highest level of integration of any silicon-based systems in the 94GHz imaging band. Finally, the main design bottleneck of any wireless transceiver system, the frequency synthesizer/phase-locked loop is investigated. Two monolithically integrated W-band frequency synthesizers are presented. Implemented in a 0.18um SiGe BiCMOS, both architectures incorporate the same 30.3-33.8GHz PLL core. One synthesizer uses an injection-locked frequency tripler (ILFT) with locking range of 92.8-98.1GHz and the other employ a harmonic-based frequency tripler (HBFT) with 3-dB bandwidth of 10.5GHz from 90.9-101.4GHz, respectively. The frequency synthesizer is suitable for integration in mm-wave phased array and multi-pixel systems such as W-band radar/imaging and 120GHz Gb/s communication.

Download or read book Systems Engineering of Phased Arrays written by Rick Sturdivant and published by Artech House. This book was released on 2018-11-30 with total page 288 pages. Available in PDF, EPUB and Kindle. Book excerpt: Phased arrays, while traditionally used in radar systems, are now being used or proposed for use in internet of things (IoT) networks, high-speed back haul communication, terabit-per-second satellite systems, 5G mobile networks, and mobile phones. This book considers systems engineering of phased arrays and addresses not only radar, but also these modern applications. It presents a system-level perspective and approach that is essential for the successful development of modern phased arrays. Using practical examples, this book helps solve problems often encountered by technical professionals. Thermal management challenges, antenna element design issues, and architectures solutions are explored as well as the benefits and challenges of digital beam forming. This book provides the information required to train engineers to design and develop phased arrays and contains questions at the end of each chapter that professors will find useful for instruction.

Download or read book Millimeter Wave mmWave Communications written by Manuel García Sanchez and published by MDPI. This book was released on 2020-03-25 with total page 188 pages. Available in PDF, EPUB and Kindle. Book excerpt: The millimeter-wave frequency band (30–300 GHz) is considered a potential candidate to host very high data rate communications. First used for high capacity radio links and then for broadband indoor wireless networks, the interest in this frequency band has increased as it is proposed to accommodate future 5G mobile communication systems. The large bandwidth available will enable a number of new uses for 5G. In addition, due to the large propagation attenuation, this frequency band may provide some additional advantages regarding frequency reuse and communication security. However, a number of issues have to be addressed to make mm-wave communications viable. This book collects a number of contributions that present solutions to these challenges.

Download or read book Integrated Microwave and Millimeter wave Phased array Designs in Silicon Technologies written by Kwang-Jin Koh and published by . This book was released on 2008 with total page 149 pages. Available in PDF, EPUB and Kindle. Book excerpt: This research focuses on the design and analysis of on-chip phased-array receivers and transmitters in silicon technologies. Passive phase shifters have been widely used in conventional discrete implementations of phased-arrays which are based on transmit/receive modules in III-V technologies. However their large volume and high loss impose several challenging issues for on-chip integration. To leverage system optimizations of on-chip phased-arrays, active phase shifter architecture is primarily investigated in this dissertation. The active phase shifter utilizes a quadrature signal interpolation where the I/Q signals are added with appropriate amplitude and polarity to synthesize the required phase. The quadrature signal generator is a key element for accurate multi-bit phase states in the active phase shifter. To generate lossless wideband quadrature signals, a novel I/Q signal generator based on second-order L-C series resonance is developed. Active phase shifters with 4-bit and 5-bit control are then designed in 0.13-um and 0.18-um CMOS technologies and tested successfully for 6-26 GHz phased-arrays applications, featuring the smallest chip size ever reported at these frequencies with similar phase resolutions. After successful demonstration of the active phase shifters, an eight-element phased-array receiver is developed in 0.18-um SiGe BiCMOS technology for X- and Ku-band satellite communications. The phased-array receiver adopts corporate-feed architecture implemented with active signal combiners. The phased-array receiver is rigorously characterized including channel-to-channel mismatches and signal coupling errors from different channels. The on-chip phased-array designs are then extended to millimeter-wave frequencies. A four-element phased-array receiver and a sixteen-element phased-array transmitter are designed using the SiGe BiCMOS technology and tested successfully for Q-band applications. Wilkinson couplers are compactly integrated for linear coherent signal combining in the Q-band phased-array receiver. Also in the Q-band transmitter array, passive Tee-junction power dividers are integrated as a linear signal feed network. The power divider is based on a coaxial-type shielded transmission line utilizing three-dimensional metal stack, which leads to a compact corporate-feed network suitable for large on-chip arrays. The sixteen-element phased-array transmitter marks the highest integration of phased-array elements known to-date, proving a good scalability to a large array of the proposed phased-array architecture. Also, each phased-array design integrates all digital control units and presents the first demonstration of on-chip silicon phased-array at the corresponding design frequency, solving one of key barriers for low-cost and complex phased-arrays.

Download or read book Silicon Based Arrays written by Nicholas Saiz and published by . This book was released on 2018 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: This thesis presents the application of millimeter wave silicon integrated circuits towards high data rate wireless communications and wireless power transfer (WPT). Power generation in the D-band is challenging due to device limitations, therefore we present a SiGe transmitter that is fully packaged with a dielectric rod antenna-in-package that provides EIRP greater than 15 dBm at 135 GHz and consumes 366 mW. Next, we propose WPT in the radiative near-field using electrically large phased arrays. The trade-offs of this approach are analyzed to optimize an antenna array over frequency. Finally, a 4-channel Ka-band transmitter beamformer was fabricated on TSMC's 65nm CMOS technology, and is meant for large scalable arrays. Since the cost of the array is partly driven by the electronics, the beamformer architecture aims to reduce the overall chip area using a traveling wave distribution network. The proposed RFIC consumes 1.65 mm2 of die area and 320 mW (84 mW/element).

Download or read book Standing Wave Integrated Circuits for Power Generation Radiation and Beam Steering at Millimeter Wave and Terahertz Spectrum written by Hossein Jalili and published by . This book was released on 2019 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The enormous potentials of millimeter wave (mm-wave) and terahertz (THz) frequency spectrum have sparked significant interest in breaking into this new frontier of technology. High-speed communication, imaging, spectroscopy and radar are just a few examples among many possible applications. Today, however, mm-wave and THz systems are mostly discrete, bulky and expensive, which significantly limits their accessibility and applications. Realization of integrated mm-wave/THz systems in low-cost and reliable silicon technologies can be a technological milestone, paving the way for tremendous opportunities both in high-tech market and academic research. This work is focused on tackling the major challenges of implementing mm-wave/THz integrated sources, including magnitude, bandwidth, radiation and beam steering of the source power. As we move to higher frequencies, the power that can be generated on chip continuously drops. Here, we have demonstrated a versatile method to maximize this power based on independent optimization of harmonic impedances. Scalable standing wave array structures are implemented based on efficient low-loss coupling schemes in order to further boost the produced power by increasing the number of contributing individual sources. Furthermore, we have presented a practical approach to maximizing radiation gain and consequently Equivalent Isotropic Radiated Power (EIRP) of the source by optimizing influential parameters of the radiation apparatus. Achieving wideband operation also becomes more challenging with increasing frequency. This is an important obstacle in our ability to take advantage of the uncongested and large available bandwidth at mm-wave/THz. We implemented standing wave oscillators and employed a varactor-less frequency tuning method to realize wideband operation. We considerably improved the bandwidth benchmark among state-of-the-art integrated radiator arrays in silicon technology. Furthermore, electronic beam steering is a crucial component of the modern wireless systems. However, realizing the necessary wide range of variable phase shift between sources is a difficult task at mm-wave/THz spectrum. Here, we have demonstrated a new phase shifting method based on combining standing and traveling waves and were able to achieve a record beam steering range among relevant published works to date. In this dissertation, we present the ideas, analysis, design methods and experimental results of four implemented prototype integrated circuits. First, a 230-GHz Voltage Controlled Oscillator (VCO) in a 65-nm CMOS technology is presented based on a coupled standing wave structure. This circuit is capable of providing high output power (3.4 dBm maximum) and wideband operation (8.3% frequency tuning range) simultaneously. Taking output power, bandwidth, power consumption and phase noise into account altogether, the circuit has a record performance figure-of-merit (FOM) compared to the state of the art. Then, a 0.34-THz 4-element scalable standing wave radiator array with 20.3 GHz (record bandwidth at the time of publication) and -10.5 dBm maximum radiated power is demonstrated, followed by a 0.34-THz wideband (15.1% frequency tuning range) and wide-angle (128° /53° range) 2D beam steering phased array, both in in 0.13μm SiGe BiCMOS. The phased array circuit has the largest bandwidth and widest steering range among integrated arrays above 300 GHz in silicon technology. Finally, a 0.46-THz 25-element scalable radiator array in a 65-nm CMOS is presented with high radiation gain through an optimized silicon lens set up. This coherent source delivers record EIRP of +19.3 dBm and 8.9% wide frequency tuning range, both largest values reported for integrated arrays above 400 GHz in silicon.

Download or read book High Frequency Integrated Circuits written by Sorin Voinigescu and published by Cambridge University Press. This book was released on 2013-02-28 with total page 921 pages. Available in PDF, EPUB and Kindle. Book excerpt: A transistor-level, design-intensive overview of high speed and high frequency monolithic integrated circuits for wireless and broadband systems from 2 GHz to 200 GHz, this comprehensive text covers high-speed, RF, mm-wave and optical fiber circuits using nanoscale CMOS, SiGe BiCMOS and III-V technologies. Step-by-step design methodologies, end-of-chapter problems and practical simulation and design projects are provided, making this an ideal resource for senior undergraduate and graduate courses in circuit design. With an emphasis on device-circuit topology interaction and optimization, it gives circuit designers and students alike an in-depth understanding of device structures and process limitations affecting circuit performance.

Download or read book Advances in SiGe CMOS RFSOI and Phase Change Circuits for High Performance Phased Arrays written by Dimitrios Baltimas and published by . This book was released on 2022 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Although electronically steered arrays are a century old concept, the research and development interest was primarily driven by the defense industry and radio astronomy without any room for potential commercial applications due to the insurmountable cost. The insufficient beamformer chip performance made the implementation of large phased arrays with high effective isotropic radiated power (EIRP) and increased sensitivity prohibitive. Only with the recent advancements in silicon technologies was the cost barrier reduced to an extent that large phased array systems can be employed in a multitude of commercial applications. Particularly, developments in silicon beamformer chips have enabled the commercialization of phased arrays for 5G wireless communications, satellite communications (SATCOM) and > 100 GHz communication links. This dissertation focuses on the implementation of high performance beamformer chips in different technologies for low-cost and high performance phased array systems. It presents several implementations of ultra wideband switches along with a true-time delay unit from DC-67 GHz using a novel phase change material (PCM) switch that is utilized for the achievement of large instantaneous bandwidths. The presented TTD unit achieves a record 124 ps relative true time delay reported on an IC from DC-67 GHz. This dissertation also presents a K-Band 19-22 GHz Tx/Rx beamformer channel with a state of the art linearity and sensitivity performance. The chip can achieve a very competitive OP1dB / IIP3 (8 dBm / 0 dBm) while its NF is 7 dB leading to state-of-the-art sensitivity performance in K-Band. Finally, this dissertation presents a D-band full RF beamforming Rx channel at D-band. The full RF implementation of the phase shifter and the VGA is introduced at 140 GHz with a NF performance that substantiates this architecture as a potential candidate for D-band phased arrays along with its competitive phase, amplitude control and power dissipation. All presented beamformer chips, illustrate significant advancements in various performance aspects and can be utilized for the implementation of high performance phased arrays.

Download or read book Millimeter Wave Phased Array Radio Front Ends In SiGe BiCMOS Technologies written by Mohamed Elkhouly and published by . This book was released on 2015 with total page 164 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Antenna in Package Technology and Applications written by Duixian Liu and published by John Wiley & Sons. This book was released on 2020-03-31 with total page 416 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.