Download or read book Microelectronic System Interconnections written by Stuart K. Tewksbury and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1994 with total page 536 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic system interconnections provides a uniques approach to the subject.
Download or read book Microelectronic Interconnections and Assembly written by G.G. Harman and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 295 pages. Available in PDF, EPUB and Kindle. Book excerpt: MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel Mach (Czech Republic) Summary of the Technical Program Thirty two presentations were given in eight technical sessions at the Workshop. A list of these sessions and their chairpersons is attached below. The Workshop was devoted to the technical aspects of advanced interconnections and microassembly, but also included papers on the education issues required to prepare students to work in these areas. In addition to new technical developments, several papers presented overviews predicting the future directions of these technologies. The basic issue is that electronic systems will continue to be miniaturized and at the same time performance must continue to improve. Various industry roadmaps were discussed as well as new smaller packaging and interconnection concepts. The newest chip packages are often based on the selection of an appropriate interconnection method. An example is the chip-scale package, which has horizontal (x-y) dimensions,;; 20% larger than the actual silicon chip itself. The chip is often flip-chip connected to a micro ball-grid-array, but direct chip attach was described also. Several papers described advances in the manufacture of such packages.
Download or read book Microelectronic Systems written by Albert Heuberger and published by Springer Science & Business Media. This book was released on 2011-12-26 with total page 361 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is dedicated to Prof. Dr. Heinz Gerhäuser on the occasion of his retirement both from the position of Executive Director of the Fraunhofer Institute for Integrated Circuits IIS and from the Endowed Chair of Information Technologies with a Focus on Communication Electronics (LIKE) at the Friedrich-Alexander-Universität Erlangen-Nürnberg. Heinz Gerhäuser's vision and entrepreneurial spirit have made the Fraunhofer IIS one of the most successful and renowned German research institutions. He has been Director of the Fraunhofer IIS since 1993, and under his leadership it has grown to become the largest of Germany's 60 Fraunhofer Institutes, a position it retains to this day, currently employing over 730 staff. Likely his most important scientific as well as application-related contribution was his pivotal role in the development of the mp3 format, which would later become a worldwide success. The contributions to this Festschrift were written by both Fraunhofer IIS staff and external project team members in appreciation of Prof. Dr. Gerhäuser's lifetime academic achievements and his inspiring leadership at the Fraunhofer IIS. The papers reflect the broad spectrum of the institute's research activities and are grouped into sections on circuits, information systems, visual computing, and audio and multimedia. They provide academic and industrial researchers in fields like signal processing, sensor networks, microelectronics, and integrated circuits with an up-to-date overview of research results that have a huge potential for cutting-edge industrial applications.
Download or read book Quality Conformance and Qualification of Microelectronic Packages and Interconnects written by Michael Pecht and published by John Wiley & Sons. This book was released on 1994-12-13 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt: All packaging engineers and technologists who want to ensure thatthey give their customers the highest quality, most cost-effectiveproducts should know that the paradigm has shifted. It has shiftedaway from the MIL-STDs and other government standards and testprocedures that don't cost-effectively address potential failuremechanisms or the manufacturing processes of the product. It hasshifted decisively towards tackling the root causes of failure andthe appropriate implementation of cost-effective process controls,qualityscreens, and tests. This book's groundbreaking, science-based approach to developingqualification and quality assurance programs helps engineers reacha new level of reliability in today's high-performancemicroelectronics. It does this with powerful... * Techniques for identifying and modeling failure mechanismsearlier in the design cycle, breaking the need to rely on fielddata * Physics-of-failure product reliability assessment methods thatcan be proactively implemented throughout the design andmanufacture of the product * Process controls that decrease variabilities in the end productand reduce end-of-line screening and testing A wide range of microelectronic package and interconnectconfigurations for both single-and multi-chip modules is examined,including chip and wire-bonds, tape-automated (TAB), flip-TAB,flip-chip bonds, high-density interconnects, chip-on-board designs(COB), MCM, 3-D stack, and many more. The remaining packageelements, such as die attachment, case and lid, leads, and lid andlead seals are also discussed in detail. The product of a distinguished team of authors and editors, thisbook's guidelines for avoiding potential high-risk manufacturingand qualification problems, as well as for implementing ongoingquality assurance, are sure to prove invaluable to both studentsand practicing professionals. For the professional engineer involved in the design andmanufacture of products containing electronic components, here is acomprehensive handbook to the theory and methods surrounding theassembly of microelectronic and electronic components. The bookfocuses on computers and consumer electronic products with internalsubsystems that reflect mechanical design constraints, costlimitations, and aesthetic and ergonomic concerns. Taking a totalsystem approach to packaging, the book systematically examines:basic chip and computer architecture; design and layout;interassembly and interconnections; cooling scheme; materialsselection, including ceramics, glasses, and metals; stress,vibration, and acoustics; and manufacturing and assemblytechnology. 1994 (0-471-53299-1) 800 pp. INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGNGUIDELINES: A Focus on Reliability --Michael Pecht This comprehensive guide features a uniquely organized time-phasedapproach to design, development, qualification, manufacture, andin-service management. It provides step-by-step instructions on howto define realistic system requirements, define the system usageenvironment, identify potential failure modes, characterizematerials and processes by the key control label factors, and useexperiment, step-stress, and accelerated methods to ensure optimumdesign before production begins. Topics covered include: detaileddesign guidelines for substrate...wire and wire, tape automated,and flip-chip bonding...element attachment and case, lead, lead andlid seals--incorporating dimensional and geometric configurationsof package elements, manufacturing and assembly conditions,materials selection, and loading conditions. 1993 (0-471-59446-6)454 pp.
Download or read book Survey study of the Interconnection Problem in Microelectronics written by and published by . This book was released on 1966 with total page 68 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microelectronics Interconnection and Packaging written by Jerry Lyman and published by McGraw-Hill Companies. This book was released on 1980 with total page 338 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book A Functional Description of the Edvac an Automatically sequence Serial Binary Electronic Digital Computer written by Moore School of Electrical Engineering and published by . This book was released on 1949 with total page 1794 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microelectronics Technology and Devices written by and published by The Electrochemical Society. This book was released on 2005 with total page 574 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microelectronic Interconnects and Packages written by and published by . This book was released on 1991 with total page 694 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Survey study of the Interconnection Problem in Microelectronics Conclusion and Management Considerations Final Report written by and published by . This book was released on 1966 with total page 68 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Copper Interconnect Technology written by Tapan Gupta and published by Springer Science & Business Media. This book was released on 2010-01-22 with total page 433 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials is now prevalent in the international microelectronics industry. As the feature size of the Cu-lines forming interconnects is scaled, resistivity of the lines increases. At the same time electromigration and stress-induced voids due to increased current density become significant reliability issues. Although copper/low-k technology has become fairly mature, there is no single book available on the promise and challenges of these next-generation technologies. In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology.
Download or read book Microelectronic Interconnection Substrate written by Charles Z. Leinkram and published by . This book was released on 1971 with total page 5 pages. Available in PDF, EPUB and Kindle. Book excerpt: The patent discloses an interconnection substrate for use in hybrid microelectronic systems interconnecting transistors, resistive elements, semiconductor-integrated circuits, and other microelectronic circuit elements. The substrate consists of an insulative base and three metal films, for example, a first chromium film, a second gold film metallurgically bonded to the chromium film, and a third nickel film bonded to the gold.
Download or read book Integrated Optical Interconnect Architectures for Embedded Systems written by Ian O'Connor and published by Springer Science & Business Media. This book was released on 2012-11-07 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a broad overview of current research in optical interconnect technologies and architectures. Introductory chapters on high-performance computing and the associated issues in conventional interconnect architectures, and on the fundamental building blocks for integrated optical interconnect, provide the foundations for the bulk of the book which brings together leading experts in the field of optical interconnect architectures for data communication. Particular emphasis is given to the ways in which the photonic components are assembled into architectures to address the needs of data-intensive on-chip communication, and to the performance evaluation of such architectures for specific applications.
Download or read book Physics of Failure Based Handbook of Microelectronic Systems written by Shahrzad Salemi and published by RIAC. This book was released on 2008 with total page 271 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Materials for High Density Electronic Packaging and Interconnection written by National Research Council and published by National Academies Press. This book was released on 1990-02-01 with total page 154 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book VLSI Custom Microelectronics written by Stanley L. Hurst and published by CRC Press. This book was released on 1998-11-05 with total page 489 pages. Available in PDF, EPUB and Kindle. Book excerpt: Focuses on the design and production of integrated circuits specifically designed for a particular application from original equipment manufacturers. The book outlines silicon and GaAs semiconductor fabrication techniques and circuit configurations; compares custom design style; discusses computer-aided design tools; and more.
Download or read book Electronic Connection Techniques and Equipment 1968 69 written by G.W.A. Dummer and published by Elsevier. This book was released on 2013-10-02 with total page 571 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic Connection Techniques and Equipment 1968–69 presents the methods and equipment used in the wide field of electronic connections. This book describes all connection methods, including automated systems and microelectronic interconnections. This text covers all aspects of electronic connections, such as the system selection parameters and applications, as well as information on reliability. This book provides information on a wide range of methods and equipment in use and available in the United States of America and in the United Kingdom. Information is also included on welding, smoldering, wrapping, bonding, and crimping. The materials are extensively illustrated with diagrams and photographs describing system, equipment, application, and operation. This book is a valuable resource for readers who are interested in the connection and interconnection of electronic components, equipment, and devices.
