Download or read book Materials Science in Microelectronics II written by Eugene Machlin and published by Elsevier. This book was released on 2010-07-07 with total page 268 pages. Available in PDF, EPUB and Kindle. Book excerpt: The subject matter of thin-films – which play a key role in microelectronics – divides naturally into two headings: the processing / structure relationship, and the structure / properties relationship. Part II of 'Materials Science in Microelectronics' focuses on the latter of these relationships, examining the effect of structure on the following: •Electrical properties•Magnetic properties•Optical properties•Mechanical properties•Mass transport properties•Interface and junction properties•Defects and properties - Captures the importance of thin films to microelectronic development - Examines the cause / effect relationship of structure on thin film properties

Download or read book Mechanical Properties of Microelectronics Thin Films written by Fariborz Maseeh and published by . This book was released on 1989 with total page 67 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Mechanical Properties of Microelectronics Thin Films written by Fariborz Maseeh and published by . This book was released on 1989 with total page 61 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Characterization of Mechanical Properties of Microelectronic Thin Films written by Fariborz Maseeh and published by . This book was released on 1990 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Fundamental Studies of the Mechanical Behavior of Microelectronics Thin Film Materials written by and published by . This book was released on 1993 with total page 38 pages. Available in PDF, EPUB and Kindle. Book excerpt: This document represents a final technical report for AFOSR Grant No. 89-0185. The research program supported under this grant involved a fundamental study of the mechanical properties of microelectronic thin film materials. The focus of the work was on the microscopic processes that lead to stresses in microelectronic thin films and control the mechanical properties of these materials. Our work ranged form studies of interconnect metals, passivation glasses and heteroepitaxial thin film semiconductors. In previous reports we highlighted work done of the mechanical properties of passivation glasses and interconnect metals and the processes of failure of interconnect metals. In this final report we highlighted our work on misfit dislocation formation in heteropitaxial thin films. The body of the report contains two reports of our work on misfit dislocations. Our overall understanding of misfit dislocations in Si-Ge layers is described in the first report. That report also describes our work on the effect of capping layers on the formation of misfit dislocations. The second report describes our in situ studies of the kinetics of formation of misfit dislocations in Si-Ge films. By measuring the change of substrates curvature as a function of time during annealing we were able to determine the way in which mobile threading dislocation density changes during the course of annealing.

Download or read book Characterization of Mechanical Properties of Microelectronic Thin Films written by Fariborz Maseeh-Tehrani and published by . This book was released on 1990 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Fundamental Studies of the Mechanical Behavior of Microelectronic Thin Film Materials written by William D. Nix and published by . This book was released on 1987 with total page 50 pages. Available in PDF, EPUB and Kindle. Book excerpt: A fundamental program of research on the mechanical properties of microelectronic thin film materials is underway at Stanford University. The work is being supported under AFOSR Grant No. 86-0051. In this interim Scientific Report, some of the progress made during the second year of the program is reviewed. We have made rapid progress since starting this development of new experimental techniques for measuring mechanical properties of thin films. That work led to several publications and to an equal number of invited oral presentations, both of which are listed at the end of this report. Now much of our work involves the use of these techniques to study mechanical properties of thin film materials of interest in microelectronics.

Download or read book Materials Science in Microelectronics I written by Eugene Machlin and published by Elsevier. This book was released on 2010-07-07 with total page 275 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thin films play a key role in the material science of microelectronics, and the subject matter of thin-films divides naturally into two headings: processing / structure relationship, and structure / properties relationship.The first volume of Materials Science in Microelectronics focuses on the first relationship – that between processing and the structure of the thin-film. The state of the thin film's surface during the period that one monolayer exists - before being buried in the next layer – determines the ultimate structure of the thin film, and thus its properties. This volume takes into consideration the following potential influencing factors: crystal defects, void structure, grain structure, interface structure in epitaxial films, the structure of amorphous films, and reaction-induced structure.An ideal text or reference work for students and researchers in material science, who need to learn the basics of thin films.

Download or read book Stress Analysis and Mechanical Characterization of Thin Films for Microelectronics and MEMS Applications written by Patrick Waters and published by . This book was released on 2008 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: ABSTRACT: Thin films are used for a variety of applications, which can include electronic devices, optical coatings and decorative parts. They are used for their physical, electrical, magnetic, optical and mechanical properties, and many times these properties are required simultaneously. Obtaining these desired properties starts with the deposition process and they are verified by a number of analysis techniques after deposition. A DC magnetron sputter system was used here to deposit tungsten films, with film thickness and residual stress uniformity being of primary interest. The film thickness was measured to vary by up to 45 % from the center to outer edge of a 4" wafer. Ar pressure was found to influence the thin film residual stress with lower Ar pressures leading to compressive residual stress ( -1.5 GPa) and higher Ar pressures leading to tensile residual stress (1 GPa). Residual stress measurements of the tungsten films were made using a wafer curvature technique and X-ray diffraction. The results of the two techniques were compared and found to be within 20 %. Nanoindentation was used to analyze the mechanical properties of several types of thin films that are commonly used in microelectronic devices. Thin film reduced modulus, hardness, interfacial toughness and fracture toughness were some of the mechanical properties measured. Difficulties with performing shallow indents (less than 100 nm) were addressed, with proper calibration procedures for the indentation equipment and tip area function detailed. Pile-up during the indentation of soft films will lead to errors in the indentation contact depth and area, leading to an overestimation of the films' reduced modulus and hardness. A method was developed to account for pile-up in determining the indentation contact depth and calculating a new contact area for improving the analysis of reduced modulus and hardness. Residual stresses in thin films are normally undesired because in extreme cases they may result in thru-film cracking or interfacial film delamination. With the use of lithography techniques to pattern wafers with areas of an adhesion reducing layer, thin film delamination was controlled. The patterned delamination microchannels may be used as an alternative method of creating microchannels for fluid transport in MEMS devices. Delamination morphology was influenced by the amount of residual stress in the film and the critical buckling stress, which was primarily controlled by the width of the adhesion reducing layers.

Download or read book Metal Based Thin Films for Electronics written by Klaus Wetzig and published by John Wiley & Sons. This book was released on 2006-03-06 with total page 388 pages. Available in PDF, EPUB and Kindle. Book excerpt: This up-to-date handbook covers the main topics of preparation, characterization and properties of complex metal-based layer systems. The authors -- an outstanding group of researchers -- discuss advanced methods for structure, chemical and electronic state characterization with reference to the properties of thin functional layers, such as metallization and barrier layers for microelectronics, magnetoresistive layers for GMR and TMR, sensor and resistance layers. As such, the book addresses materials specialists in industry, especially in microelectronics, as well as scientists, and can also be recommended for advanced studies in materials science, analytics, surface and solid state science.

Download or read book Dielectric Films for Advanced Microelectronics written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2007-04-04 with total page 508 pages. Available in PDF, EPUB and Kindle. Book excerpt: The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are a few examples of the miniaturized device technologies that depend on the utilization of thin film materials. This book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It contains clear, concise explanations of material science of dielectric films and their problem for device operation, including high-k, low-k, medium-k dielectric films and also specific features and requirements for dielectric films used in the packaging technology. A broad range of related topics are covered, from physical principles to design, fabrication, characterization, and applications of novel dielectric films.

Download or read book Preparation and Properties of Thin Films written by K. N. Tu and published by Elsevier. This book was released on 2013-10-22 with total page 351 pages. Available in PDF, EPUB and Kindle. Book excerpt: Treatise on Materials Science and Technology, Volume 24: Preparation and Properties of Thin Films covers the progress made in the preparation of thin films and the corresponding study of their properties. The book discusses the preparation and property correlations in thin film; the variation of microstructure of thin films; and the molecular beam epitaxy of superlattices in thin film. The text also describes the epitaxial growth of silicon structures (thermal-, laser-, and electron-beam-induced); the characterization of grain boundaries in bicrystalline thin films; and the mechanical properties of thin films on substrates. The ion beam modification of thin film; the use of thin alloy films for metallization in microelectronic devices; and the fabrication and physical properties of ultrasmall structures are also encompassed. Materials scientists and materials engineers will find the book invaluable.

Download or read book The Physical Properties of Thin Metal Films written by G.P. Zhigal'skii and published by CRC Press. This book was released on 2003-07-10 with total page 234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thin films of conducting materials, such as metals, alloys and semiconductors are currently in use in many areas of science and technology, particularly in modern integrated circuit microelectronics that require high quality thin films for the manufacture of connection layers, resistors and ohmic contacts. These conducting films are also important for fundamental investigations in physics, radio-physics and physical chemistry. Physical Properties of Thin Metal Films provides a clear presentation of the complex physical properties particular to thin conducting films and includes the necessary theory, confirming experiments and applications. The volume will be an invaluable reference for graduates, engineers and scientists working in the electronics industry and fields of pure and applied science.

Download or read book Materials Handbook for Hybrid Microelectronics written by Joseph Alison King and published by Artech House Publishers. This book was released on 1988 with total page 682 pages. Available in PDF, EPUB and Kindle. Book excerpt: The result of a joint effort between representatives of private industry and academia, the publication is divided into sections on elements, alloys, insulators and compound semi-conductors. An index and bibliography are lacking. Numerous simple graphs and charts are provided, in fact most of the boo

Download or read book Thin Film Microelectronics written by L. Holland and published by . This book was released on 1965 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Thin Films Volume 875 written by Thomas E. Buchheit and published by Cambridge University Press. This book was released on 2005 with total page 480 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book has a long tradition of representing current topics in thin-film properties and how they are related to the performance and reliability of thin-film structures. Several emerging and well-developed technologies rely on understanding the behavior of these structures. This book provides a forum for an exchange of ideas among researchers who are interested in the mechanical behavior of thin films, broadly applied to their materials choice or methodology. The book focuses on stress-related phenomena in thin films for a wide range of materials. Of particular interest are studies that explore the frontiers of thin-film materials science with regard to materials selection or size scale. Topics include: elasticity in thin films; characterizing thin films by nanoindentation; mechanical behavior of nanostructured films; mechanical properties of thin; thin-film plasticity; thin-film plasticity; thin-film plasticity; novel testing techniques; in situ characterization techniques; adhesion and fracture of thin films; fatigue and stress in interconnect and metallization; deformation, growth and microstructure in thin films and thin-film processing.

Download or read book Handbook of Thin Films Five Volume Set written by Hari Singh Nalwa and published by Academic Press. This book was released on 2001-10-29 with total page 661 pages. Available in PDF, EPUB and Kindle. Book excerpt: This five-volume handbook focuses on processing techniques, characterization methods, and physical properties of thin films (thin layers of insulating, conducting, or semiconductor material). The editor has composed five separate, thematic volumes on thin films of metals, semimetals, glasses, ceramics, alloys, organics, diamonds, graphites, porous materials, noncrystalline solids, supramolecules, polymers, copolymers, biopolymers, composites, blends, activated carbons, intermetallics, chalcogenides, dyes, pigments, nanostructured materials, biomaterials, inorganic/polymer composites, organoceramics, metallocenes, disordered systems, liquid crystals, quasicrystals, and layered structures. Thin films is a field of the utmost importance in today's materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, digital camcorders, sensitive broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are but a few examples of miniaturized device technologies that depend the utilization of thin film materials. The Handbook of Thin Films Materials is a comprehensive reference focusing on processing techniques, characterization methods, and physical properties of these thin film materials.