Download or read book Advances in Chemical Mechanical Planarization CMP written by Babu Suryadevara and published by Woodhead Publishing. This book was released on 2021-09-10 with total page 650 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. - Reviews the most relevant techniques and processes for CMP of dielectric and metal films - Includes chapters devoted to CMP for current and emerging materials - Addresses consumables and process control for improved CMP, including post-CMP

Download or read book Integrated Modeling of Chemical Mechanical Planarization for Sub Micron IC Fabrication written by Jianfeng Luo and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 327 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an "integrated model" and, more specifically, we include the important role of the mechanical elements of the process.

Download or read book Mechanical Aspects of the Material Removal Mechanism in Chemical Mechanical Polishing CMP written by Yongsik Moon and published by . This book was released on 1999 with total page 436 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Advances in CMP Polishing Technologies written by Toshiro Doi and published by William Andrew. This book was released on 2011-12-06 with total page 330 pages. Available in PDF, EPUB and Kindle. Book excerpt: CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan

Download or read book Chemical Mechanical Planarization of Microelectronic Materials written by Joseph M. Steigerwald and published by John Wiley & Sons. This book was released on 2008-09-26 with total page 337 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann-all leading CMP pioneers-provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers. The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry. An indispensable resource for scientists and engineers working in the microelectronics industry Chemical Mechanical Planarization of Microelectronic Materials is the only comprehensive single-source reference to one of the fastest growing integrated circuit manufacturing technologies. It provides engineers and scientists who work in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP, including: * The history of CMP * Chemical and mechanical underpinnings of CMP * CMP materials and processes * Applications of CMP in the microelectronics industry * The CMP of tungsten, aluminum, copper, polysilicon, and various dielectrics, including polymers used in integrated circuit fabrication * Post-CMP cleaning techniques * Chapter-end problem sets are also included to assist readers in developing a practical understanding of CMP.

Download or read book Introduction to Microfabrication written by Sami Franssila and published by John Wiley & Sons. This book was released on 2005-01-28 with total page 424 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microfabrication is the key technology behind integrated circuits,microsensors, photonic crystals, ink jet printers, solar cells andflat panel displays. Microsystems can be complex, but the basicmicrostructures and processes of microfabrication are fairlysimple. Introduction to Microfabrication shows how the commonmicrofabrication concepts can be applied over and over again tocreate devices with a wide variety of structures andfunctions. Featuring: * A comprehensive presentation of basic fabrication processes * An emphasis on materials and microstructures, rather than devicephysics * In-depth discussion on process integration showing how processes,materials and devices interact * A wealth of examples of both conceptual and real devices Introduction to Microfabrication includes 250 homework problems forstudents to familiarise themselves with micro-scale materials,dimensions, measurements, costs and scaling trends. Both researchand manufacturing topics are covered, with an emphasis on silicon,which is the workhorse of microfabrication. This book will serve as an excellent first text for electricalengineers, chemists, physicists and materials scientists who wishto learn about microstructures and microfabrication techniques,whether in MEMS, microelectronics or emerging applications.

Download or read book Chemical Mechanical Planarization of Semiconductor Materials written by M.R. Oliver and published by Springer Science & Business Media. This book was released on 2004-01-26 with total page 444 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Download or read book Tribocorrosion written by Anna Igual Munoz and published by Springer Nature. This book was released on 2020-06-16 with total page 110 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a toolbox for identifying and addressing tribocorrosion situations from an engineering point of view. It is an accessible and introductory guideline to the emerging and interdisciplinary field of tribocorrosion covering the main concepts of tribology and corrosion. It describes specific tribocorrosion concepts, models and experimental techniques as well as their application to practical situations in which mechanical and chemical phenomena act simultaneously.

Download or read book Particle Adhesion written by David J. Quesnel and published by CRC Press. This book was released on 2002-02-07 with total page 546 pages. Available in PDF, EPUB and Kindle. Book excerpt: Whenever a curved surface interacts with another surface, the principles of adhesion are at work. From the cells in your body to the dust on your glasses, intermolecular forces cause materials to attract one another. Elastic deformations resulting from these adhesive interactions store strain that can be liberated during particle detachment. Time dependent changes in adhesion can result from plastic deformation that both increases the real effective contact area and reduces the stored energy available to assist in particle removal. Processes such as these, based on the fundamentals tenets of particle adhesion, are now finding applications across many disciplines leading to a rich and rapid development of knowledge. This book documents the use of particle adhesion concepts in a variety of disciplines. Fields as varied as the cleaning of semiconductors, to the controlling of cancer metastasis, to the abatement of environmental pollution all benefit from applications of particle adhesion concepts.

Download or read book Particle Adhesion and Removal written by K. L. Mittal and published by John Wiley & Sons. This book was released on 2015-01-06 with total page 482 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book provides a comprehensive and easily accessible reference source covering all important aspects of particle adhesion and removal. The core objective is to cover both fundamental and applied aspects of particle adhesion and removal with emphasis on recent developments. Among the topics to be covered include: 1. Fundamentals of surface forces in particle adhesion and removal. 2. Mechanisms of particle adhesion and removal. 3. Experimental methods (e.g. AFM, SFA,SFM,IFM, etc.) to understand particle-particle and particle-substrate interactions. 4. Mechanics of adhesion of micro- and nanoscale particles. 5. Various factors affecting particle adhesion to a variety of substrates. 6. Surface modification techniques to modulate particle adhesion. 7. Various cleaning methods (both wet & dry) for particle removal. 8. Relevance of particle adhesion in a host of technologies ranging from simple to ultra-sophisticated.

Download or read book Abrasive Technology written by Anna Rudawska and published by BoD – Books on Demand. This book was released on 2018-10-24 with total page 214 pages. Available in PDF, EPUB and Kindle. Book excerpt: The subject matter of this book is the information on the abrasive technology methods, the characteristics of the methods (for example, the technological parameters, tools, and machines), innovative methods, characteristics of surface structure and surface properties after this type of mechanical process, and application in various industrial branches and other technical and technological domains. Abrasive technology is very important, for example, in precision component manufacturing and nano-technology devices. The aim of this book is to present information on the characteristics and applications of abrasive technology, abrasive tools, tests, and also the innovative methods of this technology. This information enables scientists, engineers, and designers to ensure the soundness and integrity of the fabricated components and to develop new techniques effectively.

Download or read book Polishing of Diamond Materials written by Yiqing Chen and published by Springer Science & Business Media. This book was released on 2013-02-13 with total page 180 pages. Available in PDF, EPUB and Kindle. Book excerpt: Diamond has a unique combination of properties, such as the highest hardness and thermal conductivity among any known material, high electrical resistivity, a large optical band gap and a high transmission, good resistance to chemical erosion, low adhesion and friction, and extremely low thermal expansion coefficient. As such, diamond has been a desirable material in a wide range of applications in mechanical, chemical, optical, thermal and electrical engineering. In many of the cases, the surface of a diamond component or element must have a superior finish, often down to a surface roughness of nanometers. Nevertheless, due to its extreme hardness and chemical inertness, the polishing of diamond and its composites has been a sophisticated process. Polishing of Diamond Materials will provide a state-of-the-art analysis, both theoretically and experimentally, of the most commonly used polishing techniques for mono/poly-crystalline diamond and chemical vapour deposition (CVD) diamond films, including mechanical, chemo-mechanical, thermo-chemical, high energy beam, dynamic friction and other polishing techniques. The in-depth discussions will be on the polishing mechanisms, possible modelling, material removal rate and the quality control of these techniques. A comparison of their advantages and drawbacks will be carried out to provide the reader with a useful guideline for the selection and implementation of these polishing techniques. Polishing of Diamond Materials will be of interest to researchers and engineers in hard materials and precision manufacturing, industry diamond suppliers, diamond jewellery suppliers and postgraduate students in the area of precision manufacturing.

Download or read book Precision Manufacturing written by David A. Dornfeld and published by Springer Science & Business Media. This book was released on 2007-11-22 with total page 785 pages. Available in PDF, EPUB and Kindle. Book excerpt: Precision Manufacturing provides an introduction to precision engineering for manufacturing. With an emphasis on design and performance of precision machinery for manufacturing – machine tool elements and structure, sources of error, precision machining processes and process models sensors for process monitoring and control, metrology, actuators, and machine design. This book will be of interest to design engineers, quality engineers and manufacturing engineers, academics and those who may or may not have previous experience with precision manufacturing, but want to learn more.

Download or read book An Introduction to the Mechanical Properties of Solid Polymers written by I. M. Ward and published by John Wiley & Sons. This book was released on 2005-08-19 with total page 394 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides a comprehensive introduction to the mechanical behaviour of solid polymers. Extensively revised and updated throughout, the second edition now includes new material on mechanical relaxations and anisotropy, composites modelling, non-linear viscoelasticity, yield behaviour and fracture of tough polymers. The accessible approach of the book has been retained with each chapter designed to be self contained and the theory and applications of the subject carefully introduced where appropriate. The latest developments in the field are included alongside worked examples, mathematical appendices and an extensive reference. Fully revised and updated throughout to include all the latest developments in the field Worked examples at the end of the chapter An invaluable resource for students of materials science, chemistry, physics or engineering studying polymer science

Download or read book Tribocorrosion of Passive Metals and Coatings written by D Landolt and published by Elsevier. This book was released on 2011-10-12 with total page 585 pages. Available in PDF, EPUB and Kindle. Book excerpt: Tribocorrosion causes the degradation or alteration of materials through the combined action of corrosion and wear. It limits the performance and life-time of installations, machines and devices with moving parts, and controls certain manufacturing processes such as chemical–mechanical polishing. The effects of tribocorrosion are most pronounced on passive metals which owe their corrosion resistance to a thin protecting oxide film. Most corrosion-resistant engineering alloys belong to this category.This book provides an introduction to the developing field of tribocorrosion and an overview of the latest research. Part one reviews basic notions of corrosion and tribology, before presenting the most recent results on the growth and structure of passive oxide films. Tribocorrosion mechanisms under fretting, sliding and erosion conditions, respectively, are then discussed. Part two focuses on methods for measuring and preventing tribocorrosion. It includes chapters on electrochemical techniques, the design of tribocorrosion test equipment, data evaluation and the optimisation of materials' properties for tribocorrosion systems. Part three presents a selection of tribocorrosion problems in engineering and medicine. Three chapters address the tribocorrosion of medical implants including test methods and clinical implications. Other chapters examine tribocorrosion issues in nuclear power plants, marine environments, automotive cooling circuits, elevated-temperature metal working and chemical–mechanical polishing.With its distinguished editors and international team of expert contributors Tribocorrosion of passive metals and coatings is an invaluable reference tool for engineers and researchers in industry and academia confronted with tribocorrosion problems. - Comprehensively reviews current research on the tribocorrosion of passive metals and coatings, with particular reference to the design of tribocorrosion test equipment, data evaluation and the optimisation of materials' properties for tribocorrosion systems - Chapters discuss tribocorrosion mechanisms under fretting, sliding and erosion conditions before focussing on methods for measuring and preventing tribocorrosion - Includes a comprehensive selection of tribocorrosion problems in engineering and medicine, such as the tribocorrosion of medical implants, and tribocorrosion issues in nuclear power plants, marine environments, automotive cooling circuits and elevated-temperature metal working

Download or read book Handbook of Manufacturing Engineering and Technology written by Andrew Y. C. Nee and published by Springer. This book was released on 2014-10-31 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Springer Reference Work Handbook of Manufacturing Engineering and Technology provides overviews and in-depth and authoritative analyses on the basic and cutting-edge manufacturing technologies and sciences across a broad spectrum of areas. These topics are commonly encountered in industries as well as in academia. Manufacturing engineering curricula across universities are now essential topics covered in major universities worldwide.

Download or read book Analysis of Machining and Machine Tools written by Steven Liang and published by Springer. This book was released on 2015-12-29 with total page 241 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides readers with the fundamental, analytical, and quantitative knowledge of machining process planning and optimization based on advanced and practical understanding of machinery, mechanics, accuracy, dynamics, monitoring techniques, and control strategies that they need to understanding machining and machine tools. It is written for first-year graduate students in mechanical engineering, and is also appropriate for use as a reference book by practicing engineers. It covers topics such as single and multiple point cutting processes; grinding processes; machine tool components, accuracy, and metrology; shear stress in cutting, cutting temperature and thermal analysis, and machine tool chatter. The second section of the book is devoted to “Non-Traditional Machining,” where readers can find chapters on electrical discharge machining, electrochemical machining, laser and electron beam machining, and biomedical machining. Examples of realistic problems that engineers are likely to face in the field are included, along with solutions and explanations that foster a didactic learning experience.