EBookClubs

Read Books & Download eBooks Full Online

EBookClubs

Read Books & Download eBooks Full Online

Book Measurement of Adhesion of Evaporated Aluminum copper Thin Films on Polyimide Using the Electromagnetic Tensile Test Method

Download or read book Measurement of Adhesion of Evaporated Aluminum copper Thin Films on Polyimide Using the Electromagnetic Tensile Test Method written by Bruno P. Baranski and published by . This book was released on 1985 with total page 186 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Electromagnetic Tensile Adhesion Test Method

Download or read book Electromagnetic Tensile Adhesion Test Method written by S. Krongelb and published by . This book was released on 1978 with total page 15 pages. Available in PDF, EPUB and Kindle. Book excerpt: A method is described for applying a known tensile stress to a thin-film structure without requiring any mechanical attachment to the film. The stress is developed by the interaction of an external magnetic field with an electric current through a suitably patterned specimen of the film to be evaluated. An apparatus for producing the required magnetic fields and electric currents is described, and procedures are given for preparing suitable test specimens using conventional electronic device fabrication technology. Results showing the use of this technique for measuring the adhesion of evaporated copper on thermally oxidized silicon are presented. The maximum stress which can be produced is limited by the available magnetic field, the fabrication of the test structure, and the heating effect of the current through this structure. These factors are discussed, and it is shown that useful stresses of at least 24 000 psi (165 600 kPa) are practical by the electromagnetic method.

Book Adhesion Measurement of Thin Films  Thick Films and Bulk Coatings

Download or read book Adhesion Measurement of Thin Films Thick Films and Bulk Coatings written by K. L. Mittal and published by ASTM International. This book was released on 1978 with total page 420 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Adhesion Measurement of Films and Coatings

Download or read book Adhesion Measurement of Films and Coatings written by Kash L. Mittal and published by CRC Press. This book was released on 2014-07-30 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book chronicles the proceedings of the International Symposium on Adhesion Measurement of Films and Coatings, held in Boston. The articles in this book were previously published in three special issues of the Journal of Adhesion Science and Technology. Films and coatings are used for a variety of purposes and their adequate adhesion to the und

Book Adhesion Measurement of Films and Coatings

Download or read book Adhesion Measurement of Films and Coatings written by K. L. MIttal and published by Walter de Gruyter GmbH & Co KG. This book was released on 2022-12-19 with total page 468 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Adhesion Measurement Methods

Download or read book Adhesion Measurement Methods written by Robert Lacombe and published by CRC Press. This book was released on 2005-11-21 with total page 448 pages. Available in PDF, EPUB and Kindle. Book excerpt: Adhesion Measurement Methods: Theory and Practice provides practical information on the most important measurement techniques, their unique advantages and disadvantages, and the selection of the proper method for a given application. It includes useful information and formulae on adhesion related matters such as driving force formulae for various m

Book Physics Briefs

Download or read book Physics Briefs written by and published by . This book was released on 1992 with total page 914 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Threshold Adhesion Failure

Download or read book Threshold Adhesion Failure written by WK. Croll and published by . This book was released on 1978 with total page 26 pages. Available in PDF, EPUB and Kindle. Book excerpt: A detailed study of the scratch test was undertaken to determine its sensitivity, reproducibility, and soundness as a means of measuring the adhesion of aluminum films on fused quartz substrates. The complete-removal failure criterion was found to be quite subjective and often ambiguous, finally leading to the threshold adhesion failure (TAF) concept. Using the TAF approach, it was found that the scratch test is sensitive enough to discriminate between failure and nonfailure within 0.1 g of stylus loading at both low- and high-load levels. Also, the reproducibility of the mean TAF loads is excellent. In addition to the expected TAF load dependence on stylus tip radius of curvature and film thickness, it was also found that any one stylus has its own scribing characteristics which are reflected in the TAF load. The mean TAF loads are, therefore, relative measurements.

Book Adhesion Measurement on Thin Evaporated Films

Download or read book Adhesion Measurement on Thin Evaporated Films written by H. Hirota and published by . This book was released on 1978 with total page 10 pages. Available in PDF, EPUB and Kindle. Book excerpt: Methods to evaluate the adhesion of thin evaporated films to their substrate were devised. One was to pull down and the other to twist off a rod whose bottom was cemented with epoxy to the film. The critical force or torque to strip off the film from the substrate was taken as a measure of the adhesion. It was important to maintain adequate temperature and humidity [16 °C (61 °F) and below 60 percent] during the cementing and measurement, to assure the high adhesion of the cement and the reproducibility of the result.

Book

    Book Details:
  • Author :
  • Publisher :
  • Release : 1981
  • ISBN :
  • Pages : 29 pages

Download or read book written by and published by . This book was released on 1981 with total page 29 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Measurement of Electromigration in Aluminum Thin Films Using Resistive Techniques

Download or read book Measurement of Electromigration in Aluminum Thin Films Using Resistive Techniques written by Lawrence Stearns Potter and published by . This book was released on 1968 with total page 82 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Measurement of Mechanical Properties and Adhesion of Thin Polyimide Films

Download or read book Measurement of Mechanical Properties and Adhesion of Thin Polyimide Films written by Mark George Allen and published by . This book was released on 1986 with total page 264 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book A Technique for Measuring the Adhesion of Thin Films and the Dynamic Tensile Strength of Bonds  with Commercial Applications

Download or read book A Technique for Measuring the Adhesion of Thin Films and the Dynamic Tensile Strength of Bonds with Commercial Applications written by N. C. ANDERHOLM and published by . This book was released on 1972 with total page 7 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Adhesion Measurement of Thin Films  Thick Films  and Bulk Coatings

Download or read book Adhesion Measurement of Thin Films Thick Films and Bulk Coatings written by American Society for Testing and Materials and published by . This book was released on 1978 with total page 402 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Adhesion Measurement of Films and Coatings

Download or read book Adhesion Measurement of Films and Coatings written by Kash L. Mittal and published by CRC Press. This book was released on 1995-04-01 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book chronicles the proceedings of the International Symposium on Adhesion Measurement of Films and Coatings, held in Boston. The articles in this book were previously published in three special issues of the Journal of Adhesion Science and Technology. Films and coatings are used for a variety of purposes and their adequate adhesion to the underlying substrates is of cardinal importance from practical consideration. In the last two decades there has been brisk activity in devising new ways to measure adhesion or ameliorating the existing techniques.

Book Thin Film Adhesion Measurement Using Excimer Laser Ablation Test

Download or read book Thin Film Adhesion Measurement Using Excimer Laser Ablation Test written by Wen-Chieh Lee and published by . This book was released on 1991 with total page 128 pages. Available in PDF, EPUB and Kindle. Book excerpt: "An excimer laser incident on a metallic thin film is used to measure the adhesion between the film and the substrate. The initial optical absorption leads to electron excitation. After collisions and degradation of the excited electrons, the absorbed energy is transferred into various kinds of energy among which the major one is thermal. The superheated surface undergoes vapor explosion which serves as one source of shock wave to break the thin film. The evaporated particles may recoil back to the surface constructing another shock wave to break the film. In addition, a tensile stress may be formed by the large difference of thermal expansion between metallic thin film and polymeric substrate. All these effects cooperate to cause the cracking of the metallic thin film. This thesis provides the theoretical models to explain how the various mechanisms work on adhesion evaluation. Based on these understandings, the experimental data of laser ablation test is more suggestive and meaningful than the tape test which is sometimes ambiguous due to undiscerned effects. The experimental results show that laser ablation is sensitive to small differences in adhesion. In addition, the laser ablation test has a broader range of measurement as compared to that of tape test. One thing to be noticed is that laser ablation test is strongly affected by the thickness of the film."--Abstract.

Book Interaction of Copper with a Vapor Deposited Polyimide Film

Download or read book Interaction of Copper with a Vapor Deposited Polyimide Film written by R. G. Mack and published by . This book was released on 1990 with total page 19 pages. Available in PDF, EPUB and Kindle. Book excerpt: The interaction of copper with a vapor deposited film of PMDA-ODA polyimide was studied using x-ray photoelectron spectroscopy (XPS) and scanning tunnelling microscopy (STM). Copper was evaporated onto the polyimide surface to total thickness estimated to be about five atomic layers. The copper initially interacts with the planar imide ring - the nitrogen XPS signal is preferentially attenuated, some copper is oxidized, and the carbonyl XPS intensities are altered. We find no evidence for chemical interaction with the ODA part of the polyimide. Heating the copper covered surface leads to redistribution of copper, probably below the surface as reported in earlier studies. STM images of the heated surfaces show that substantial surface roughening has occurred. Keywords: Polyimide, Polymer films, Polymer-metal interface, Adhesion, X-ray photoelectron spectroscopy, Scanning tunneling microscopy.