Download or read book Materials Technology and Reliability for Advanced Interconnects 2005 Volume 863 written by Paul R. Besser and published by . This book was released on 2005-08-26 with total page 450 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This volume was first published in 2005.
Download or read book Materials and Strength of Gas Turbine Parts written by Leonid Borisovich Getsov and published by Springer Nature. This book was released on 2021-04-17 with total page 469 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses several mechanical and material problems that are typical for gas turbine components. It discusses accelerated tests and other methods for increasing the reliability of gas turbine engines. Special attention is given to non-traditional methods for calculating the strength characteristics and longevity of the main components. This first volume focuses on the selection of materials, deformation and destruction mechanisms in connection with stationary and non-stationary loading, and types of material damage such as the thermal fatigue. Particular attention is paid to the issues of the properties of single crystal alloys, the relationship between structure and properties, the influence of technological factors and long-term operation. The characteristics of creep resistance, crack resistance, and resistance to cyclic deformation of different alloys are given.
Download or read book Handbook of Thin Film Deposition written by Krishna Seshan and published by William Andrew. This book was released on 2018-02-23 with total page 470 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, materials for memory applications and methods for thin film optical processes. The book is broken up into three sections: scaling, equipment and processing, and applications. In this newly revised edition, the handbook will also explore the limits of thin film applications, most notably as they relate to applications in manufacturing, materials, design and reliability. Offers a practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance, applications and the limitations faced by those processes Covers core processes and applications in the semiconductor industry and new developments within the photovoltaic and optical thin film industries Features a new chapter discussing Gates Dielectrics
Download or read book Handbook of Semiconductor Manufacturing Technology written by Yoshio Nishi and published by CRC Press. This book was released on 2017-12-19 with total page 3276 pages. Available in PDF, EPUB and Kindle. Book excerpt: Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Download or read book Materials Technology and Reliability for Advanced Interconnects and Low K Dielectrics written by G. S. Oehrlein and published by Cambridge University Press. This book was released on 2014-06-05 with total page 614 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the microelectronics industry. The replacement of Al alloys with Cu along with the introduction of new barrier materials to protect Cu from chemical attack, and the utilization of new dielectric materials with a lower relative dielectric constant k than SiO2 in multilevel metallization structures of increasing complexity, are the major themes of evolution in this field. Invited reviews illustrate the significant progress that has been achieved as well as the challenges that remain. Contributed papers presented by researchers from different countries demonstrate progress on current topics using a truly multidisciplinary approach.
Download or read book Interconnect Reliability in Advanced Memory Device Packaging written by Chong Leong, Gan and published by Springer Nature. This book was released on 2023-05-30 with total page 223 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.
Download or read book Materials Technology and Reliability of Low k Dielectrics and Copper Interconnects written by Ting Y. Tsui and published by . This book was released on 2006 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Chemical Mechanical Planarization Volume 867 written by A. Kumar and published by . This book was released on 2005-07-19 with total page 330 pages. Available in PDF, EPUB and Kindle. Book excerpt: Technology requirements associated with the progressive scaling of devices for future technology nodes, coupled with the aggressive introduction of new materials, places tremendous demands on chemical-mechanical polishing. The goal of this 2005 book, which is part of a popular series from MRS, is to bring together experts from a broad spectrum of research and technology groups currently working on CMP, to review advances made, and to offer a comprehensive discussion of future challenges that must be overcome. The book shows trends in the development of consumables, process modules, tool designs, process integration, modeling, defect characterization, and metrology. Topics include: planarization processes and applications; consumables -CMP pads and slurries; CMP equipment and metrology; and CMP modeling and simulation.
Download or read book Materials and Devices for Smart Systems II Volume 888 written by Yasubumi Furuya and published by . This book was released on 2006-04-07 with total page 408 pages. Available in PDF, EPUB and Kindle. Book excerpt: Smart/intelligent systems is a primary technology for present and future applications in areas ranging from everyday life to aerospace missions, from civil to military environments, from robots to information technology. Smart materials are the critical foundation for high-performance smart devices, and smart devices are fundamental components for smart systems. The three cannot be separated. This book bridges the fields of smart materials, sensing and actuating devices, and intelligent systems, and provides an opportunity for researchers from all three arenas to channel information into a coherent, interdisciplinary community. Topics include: piezoelectric actuators; novel devices and systems; shape memory alloys and magnetostrictive devices; nanometer-scale processing and properties; piezoelectric materials; sensor materials and devices; and electroactive polymer actuators.
Download or read book Advanced Devices and Materials for Laser Remote Sensing Volume 883 written by Materials Research Society. Meeting and published by . This book was released on 2005-08-25 with total page 280 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Download or read book Progress in Semiconductor Materials V Volume 891 written by Linda J. Olafsen and published by . This book was released on 2006-06-28 with total page 672 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Download or read book Materials and Devices for Smart Systems written by and published by . This book was released on 2005 with total page 408 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Combinatorial Methods and Informatics in Materials Science Volume 894 written by M. J. Fasolka and published by . This book was released on 2006-05-17 with total page 390 pages. Available in PDF, EPUB and Kindle. Book excerpt: Combinatorial and high-throughput experimental approaches and related informatics, modeling and data-mining methods have permitted researchers to accelerate the pace at which new, complex materials and device systems are discovered, optimized and understood. Today, the development and application of these revolutionary approaches continue to grow and diversify. This book offers an international, interdisciplinary perspective for scientists and engineers interested in combinatorial, high-throughput and advanced informatics approaches to materials research. The range of disciplines includes materials science; chemistry; physics; electrical, chemical and mechanical engineering; materials modeling; and data systems engineering. Presentations share successful studies, and illuminate current and emerging challenges in areas including: the design and fabrication of combinatorial libraries for materials and devices; high-throughput characterization methods for such systems; automation of instrumentation and data analysis; advanced modeling and data mining techniques for rapid materials design and properties prediction; and data system design and software for combinatorial workflows.
Download or read book Electroresponsive Polymers and Their Applications Volume 889 written by Vivek Bharti and published by . This book was released on 2006-03-24 with total page 280 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Download or read book Materials and Technologies for Direct Thermal to electric Energy Conversion written by Jihui Yang and published by . This book was released on 2006 with total page 546 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Actinides basic Science Applications and Technology written by and published by . This book was released on 2005 with total page 464 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Materials Integration and Technology for Monolithic Instruments Volume 869 written by Jeremy A. Theil and published by . This book was released on 2005-07-28 with total page 192 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
