Download or read book Materials Handbook for Hybrid Microelectronics written by Joseph Alison King and published by Artech House Publishers. This book was released on 1988 with total page 682 pages. Available in PDF, EPUB and Kindle. Book excerpt: The result of a joint effort between representatives of private industry and academia, the publication is divided into sections on elements, alloys, insulators and compound semi-conductors. An index and bibliography are lacking. Numerous simple graphs and charts are provided, in fact most of the boo

Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.

Download or read book Hybrid Microelectronics Handbook written by Jerry E. Sergent and published by McGraw-Hill Companies. This book was released on 1995 with total page 778 pages. Available in PDF, EPUB and Kindle. Book excerpt: Featuring new contributions from experts in the field, the second edition of the Handbook provides electronics design, process, and packaging engineers with the data they need to design, test, and manufacture today's most-wanted hybrid microcircuits.

Download or read book Microelectronics Manufacturing Diagnostics Handbook written by Abraham Landzberg and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 663 pages. Available in PDF, EPUB and Kindle. Book excerpt: The world of microelectronics is filled with cusses measurement systems, manufacturing many success stories. From the use of semi control techniques, test, diagnostics, and fail ure analysis. It discusses methods for modeling conductors for powerful desktop computers to their use in maintaining optimum engine per and reducing defects, and for preventing de formance in modem automobiles, they have fects in the first place. The approach described, clearly improved our daily lives. The broad while geared to the microelectronics world, has useability of the technology is enabled, how applicability to any manufacturing process of similar complexity. The authors comprise some ever, only by the progress made in reducing their cost and improving their reliability. De of the best scientific minds in the world, and fect reduction receives a significant focus in our are practitioners of the art. The information modem manufacturing world, and high-quality captured here is world class. I know you will diagnostics is the key step in that process. find the material to be an excellent reference in of product failures enables step func Analysis your application. tion improvements in yield and reliability. which works to reduce cost and open up new Dr. Paul R. Low applications and technologies. IBM Vice President and This book describes the process ofdefect re of Technology Products General Manager duction in the microelectronics world.

Download or read book Handbook of Thick and Thin Film Hybrid Microelectronics written by Tapan Gupta and published by Wiley-Interscience. This book was released on 2003-04-17 with total page 432 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the first handbook on the fabrication and design of hybrid microelectronic circuits. * Deals with all aspects of the technology, design, layout and processing of materials. * Fills the need for a comprehensive survey of a widely-used technology.

Download or read book Hybrid Microcircuit Technology Handbook written by James J. Licari and published by Elsevier. This book was released on 1998-12-31 with total page 603 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, important chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines will be of value to materials and process engineers, chemists, and electrical engineers who design and test hybrid circuits.

Download or read book Modeling and Simulation for Microelectronic Packaging Assembly written by Shen Liu and published by John Wiley & Sons. This book was released on 2011-05-17 with total page 586 pages. Available in PDF, EPUB and Kindle. Book excerpt: Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging

Download or read book Handbook of Manufacturing Engineering Second Edition 4 Volume Set written by Richard Crowson and published by CRC Press. This book was released on 1996-07-17 with total page 1142 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides single-source coverage on the full range of activities that meet the manufacturing engineering process, including management, product and process design, tooling, equipment selection, faciltiy planning and layout, plant contruction, materials handling and storage, method analysis, time standards, and production control. The text examines every topic involved with product and factory development, parts fabrication, and assembly processes.

Download or read book Modern Microwave and Millimeter Wave Power Electronics written by Gregory S. Nusinovich and published by John Wiley & Sons. This book was released on 2005-04-19 with total page 885 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive study of microwave vacuum electronic devices and their current and future applications While both vacuum and solid-state electronics continue to evolve and provide unique solutions, emerging commercial and military applications that call for higher power and higher frequencies to accommodate massive volumes of transmitted data are the natural domain of vacuum electronics technology. Modern Microwave and Millimeter-Wave Power Electronics provides systems designers, engineers, and researchers-especially those with primarily solid-state training-with a thoroughly up-to-date survey of the rich field of microwave vacuum electronic device (MVED) technology. This book familiarizes the R&D and academic communities with the capabilities and limitations of MVED and highlights the exciting scientific breakthroughs of the past decade that are dramatically increasing the compactness, efficiency, cost-effectiveness, and reliability of this entire class of devices. This comprehensive text explores a wide range of topics: Traveling-wave tubes, which form the backbone of satellite and airborne communications, as well as of military electronic countermeasures systems Microfabricated MVEDs and advanced electron beam sources Klystrons, gyro-amplifiers, and crossed-field devices "Virtual prototyping" of MVEDs via advanced 3-D computational models High-Power Microwave (HPM) sources Next-generation microwave structures and circuits How to achieve linear amplification Advanced materials technologies for MVEDs A Web site appendix providing a step-by-step walk-through of a typical MVED design process Concluding with an in-depth examination of emerging applications and future possibilities for MVEDs, Modern Microwave and Millimeter-Wave Power Electronics ensures that systems designers and engineers understand and utilize the significant potential of this mature, yet continually developing technology. SPECIAL NOTE: All of the editors' royalties realized from the sale of this book will fund the future research and publication activities of graduate students in the vacuum electronics field.

Download or read book Materials Handbook for Hybrid Microelectronics written by Joseph A. King and published by . This book was released on 1988-01-01 with total page 628 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Fatigue under Thermal and Mechanical Loading Mechanisms Mechanics and Modelling written by J. Bressers and published by Springer Science & Business Media. This book was released on 2013-04-17 with total page 497 pages. Available in PDF, EPUB and Kindle. Book excerpt: The International Symposium "Fatigue under Thermal and Mechanical Loading", held at Petten (The Netherlands) on May 22-24, 1995, was jointly organized by the Institute for Advanced Materials of The Joint Research Centre, E. C. , and by the Societe Fran~se de Metallurgie et de Materiaux. The fast heating and cooling cycles experienced by many high temperature components cause thermally induced stresses, which often operate in combination with mechanical loads. The resulting thermal / mechanical fatigue cycle leads to material degradation mechanisms and failure modes typical of service cycles. The growing awareness that the synergism between the combined thermal and mechanical loads can not be reproduced by means of isothermal tests, has resulted in an increasing interest in thermal and thermo-mechanical fatigue testing. This trend has been reinforced by the constant pull by industry for more performant, yet safer high temperature systems, pushing the materials to the limit of their properties. Dedicated ASTM meetings in particular have set the scene for this area of research. The proceedings of the symposium organized by D. A. Spera and D. F. Mowbray in 1975 provided a reference book on thermal fatigue which reflects the knowledge and experimental capabilities of the mid-seventies.

Download or read book Electronic Magnetic and Optical Materials written by Pradeep Fulay and published by CRC Press. This book was released on 2016-11-18 with total page 554 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book integrates materials science with other engineering subjects such as physics, chemistry and electrical engineering. The authors discuss devices and technologies used by the electronics, magnetics and photonics industries and offer a perspective on the manufacturing technologies used in device fabrication. The new addition includes chapters on optical properties and devices and addresses nanoscale phenomena and nanoscience, a subject that has made significant progress in the past decade regarding the fabrication of various materials and devices with nanometer-scale features.

Download or read book Ceramic Interconnect Technology Handbook written by Fred D. Barlow, III and published by CRC Press. This book was released on 2018-10-03 with total page 472 pages. Available in PDF, EPUB and Kindle. Book excerpt: Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.

Download or read book Thermal Design of Electronic Equipment written by Ralph Remsburg and published by CRC Press. This book was released on 2017-12-19 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt: In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.

Download or read book Power Electronic Modules written by William W. Sheng and published by CRC Press. This book was released on 2004-09-29 with total page 293 pages. Available in PDF, EPUB and Kindle. Book excerpt: Designing and building power semiconductor modules requires a broad, interdisciplinary base of knowledge and experience, ranging from semiconductor materials and technologies, thermal management, and soldering to environmental constraints, inspection techniques, and statistical process control. This diversity poses a significant challenge to engine

Download or read book Integrated Circuit Hybrid and Multichip Module Package Design Guidelines written by Michael Pecht and published by John Wiley & Sons. This book was released on 1994-03-31 with total page 470 pages. Available in PDF, EPUB and Kindle. Book excerpt: Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals. Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to: * Define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost * Define the system usage environment so that all operating, shipping, and storage conditions, including electrical, thermal, radiation, and mechanical loads, are assessed using realistic data * Identify potential failure modes, sites, mechanisms, and architecture-stress interactions--PLUS appropriate measures you can take to reduce, eliminate, or accommodate expected failures * Characterize materials and processes by the key controllable factors, such as types and levels of defects, variations in material properties and dimensions, and the manufacturing and assembly processes involved * Use experiment, step-stress, and accelerated methods to ensure optimum design before production begins Detailed design guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage. Detailed guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage. of related interest... PHYSICAL ARCHITECTURE OF VLSI SYSTEMS --Allan D. Kraus, Robert Hannemann and Michael Pecht For the professional engineer involved in the design and manufacture of products containing electronic components, here is a comprehensive handbook to the theory and methods surrounding the assembly of microelectronic and electronic components. The book focuses on computers and consumer electronic products with internal subsystems that reflect mechanical design constraints, cost limitations, and aesthetic and ergonomic concerns. Taking a total system approach to packaging, the book systematically examines: basic chip and computer architecture; design and layout; interassembly and interconnections; cooling scheme; materials selection, including ceramics, glasses, and metals; stress, vibration, and acoustics; and manufacturing and assembly technology. 1994 (0-471-53299-1) pp. SOLDERING PROCESSES AND EQUIPMENT --Michael G. Pecht This comprehensive, fundamentals first handbook outlines the soldering methods and techniques used in the manufacture of microelectronic chips and electronic circuit boards. In a clear, easy-to-access format, the book discusses: soldering processes and classification; the material dynamics of heat soldering when assembling differing materials; wave and reflow soldering; controlling contamination during manufacturing cleanings; techniques for assuring reliability and quality control during manufacturing; rework, repair, and manual assembly; the modern assembly / repair station; and more. The book also provides clear guidelines on assembly techniques as well as an appendix of various solder equipment manufacturers. 1993 (0-471-59167-X) 312 pp.

Download or read book Handbook of Thick Film Hybrid Microelectronics written by Charles A. Harper and published by McGraw-Hill Companies. This book was released on 1974 with total page 712 pages. Available in PDF, EPUB and Kindle. Book excerpt: