Download or read book Investigations on Microstructure and Mechanical Properties of the Cu Pb free Solder Joint Interfaces written by Qingke Zhang and published by Springer. This book was released on 2015-10-31 with total page 153 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behavior of Pb-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints.

Download or read book Materials Design and Manufacturing for Sustainable Environment written by Elango Natarajan and published by Springer Nature. This book was released on 2022-09-28 with total page 716 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book presents select proceedings of the International Conference on Materials, Design and Manufacturing (ICMDMSE 2022). The book covers recent trends in design and manufacturing practices relating to sustainability. Various topics covered in this book include materials design for sustainability, material characterization, tribology, finite element methods (FEM), computational fluid dynamics in designing materials, manufacturing techniques inclined to sustainability, additive manufacturing, energy, Industry 4.0, MEMS, green manufacturing, and optimization techniques. This book will be useful for researchers and professionals working in various fields of mechanical engineering.

Download or read book Recent Progress in Lead Free Solder Technology written by Mohd Arif Anuar Mohd Salleh and published by Springer Nature. This book was released on 2022-03-01 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.

Download or read book Energy Research Abstracts written by and published by . This book was released on 1994-03 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Lead free Solders written by K. Subramanian and published by John Wiley & Sons. This book was released on 2012-03-06 with total page 510 pages. Available in PDF, EPUB and Kindle. Book excerpt: Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers: Phase diagrams and alloy development Effect of minor alloying additions Composite approaches including nanoscale reinforcements Mechanical issues affecting reliability Reliability under impact loading Thermomechanical fatigue Chemical issues affecting reliability Whisker growth Electromigration Thermomigration Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.

Download or read book Handbook of Lead Free Solder Technology for Microelectronic Assemblies written by Karl J. Puttlitz and published by CRC Press. This book was released on 2004-02-27 with total page 1044 pages. Available in PDF, EPUB and Kindle. Book excerpt: This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.

Download or read book MEMS and Nanotechnology Volume 5 written by Gordon Shaw III and published by Springer Science & Business Media. This book was released on 2013-09-17 with total page 135 pages. Available in PDF, EPUB and Kindle. Book excerpt: MEMS and Nanotechnology, Volume 5: Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics, the fifth volume of eight from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including: Microelectronics Packaging Single Atom/Molecule Mechanical Testing MEMS Devices & Fabrication In-Situ Mechanical Testing Nanoindentation Experimental Analysis of Low-Dimensional Materials for Nanotechnology

Download or read book Materials Transactions written by and published by . This book was released on 2009 with total page 972 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book The Advances in Joining Technology written by Mokhtar Awang and published by Springer. This book was released on 2018-05-22 with total page 107 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume presents selected papers from the 3rd International Conference on Mechanical, Manufacturing and Process Plant Engineering (ICMMPE 2017) which was in Penang, Malaysia, 22nd–23rd November 2017. The proceedings discuss genuine problems covering various topics of mechanical, manufacturing, and Process Plant engineering.

Download or read book Interface Circuits for Microsensor Integrated Systems written by Giuseppe Ferri and published by MDPI. This book was released on 2018-12-07 with total page 171 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a printed edition of the Special Issue "Interface Circuits for Microsensor Integrated Systems" that was published in Micromachines

Download or read book Handbook of Lead Free Solder Technology for Microelectronic Assemblies written by Karl J. Puttlitz and published by CRC Press. This book was released on 2004-02-27 with total page 1044 pages. Available in PDF, EPUB and Kindle. Book excerpt: This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specif

Download or read book Solder Joint Technology written by King-Ning Tu and published by Springer Science & Business Media. This book was released on 2007-07-27 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt: The European Union’s directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. This book provides a comprehensive examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.

Download or read book Lead Free Electronic Solders written by KV Subramanian and published by Springer Science & Business Media. This book was released on 2007-06-28 with total page 370 pages. Available in PDF, EPUB and Kindle. Book excerpt: Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. This comprehensive book examines all the important issues associated with lead-free electronic solder. It collects the work of researchers recognized for their significant scientific contributions in the area.

Download or read book Advances in Materials Processing written by Yafang Han and published by Springer. This book was released on 2018-04-17 with total page 1274 pages. Available in PDF, EPUB and Kindle. Book excerpt: This proceedings volume gathers selected papers presented at the Chinese Materials Conference 2017 (CMC2017), held in Yinchuan City, Ningxia, China, on July 06-12, 2017. This book covers a wide range of material surface science, advanced preparation and processing technologies of materials, high purity materials, silicon purification technology, solidification science and technology, performance and structure safety of petroleum tubular goods and equipment materials, materials genomes, materials simulation, computation and design. The Chinese Materials Conference (CMC) is the most important serial conference of the Chinese Materials Research Society (C-MRS) and has been held each year since the early 1990s. The 2017 installment included 37 Symposia covering four fields: Advances in energy and environmental materials; High performance structural materials; Fundamental research on materials; and Advanced functional materials. More than 5500 participants attended the congress, and the organizers received more than 700 technical papers. Based on the recommendations of symposium organizers and after peer reviewing, 490 papers have been included in the present proceedings, which showcase the latest original research results in the field of materials, achieved by more than 300 research groups at various universities and research institutes.

Download or read book Progresses in Fracture and Strength of Materials and Structures written by Yu Zhou and published by . This book was released on 2007 with total page 852 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Mechanical and Creep Behavior of Advanced Materials written by Indrajit Charit and published by Springer. This book was released on 2017-02-04 with total page 299 pages. Available in PDF, EPUB and Kindle. Book excerpt: This collection commemorates the occasion of the honorary symposium that celebrated the 75th birthday and lifelong contributions of Professor K.L. Murty. The topics cover the present status and recent advances in research areas in which he made seminal contributions. The volume includes articles on a variety of topics such as high-temperature deformation behaviors of materials (elevated temperature creep, tensile, fatigue, superplasticity) and their micromechanistic interpretation, understanding mechanical behavior of HCP metals/alloys using crystallographic texture, radiation effects on deformation and creep of materials, mechanical behavior of nanostructured materials, fracture and fracture mechanisms, development and application of small-volume mechanical testing techniques, and general structure-property correlations.

Download or read book Lead Free Solders written by Abhijit Kar and published by BoD – Books on Demand. This book was released on 2019-10-02 with total page 96 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides some of the most advanced research observations and in-depth knowledge behind lead-free soldering. Readers will find a description of different cutting-edge techniques used for improving the reliability of interconnects manufacturing. Some of the most unconventional topics covered in this book include solder joint formation for microelectronic devices at room temperature and the possibility of soldering ceramic materials, which is limited due to the poor wettability of ceramic substrates with commercial solders following classical soldering techniques. We also discuss the possibilities of nanoscale preparation of solder joints for bringing down the processing temperature so that it does not affect the packaging technologies. Readers will find that precise, systematic discussion of solder joint formation and its interfacial characterization has been depicted for each technique used in different chapters. This book is of interest to both fundamental researchers and also to practicing scientists and will prove invaluable to all those working in industry and academia.