Download or read book Investigation of Bonding Between Metals and Ceramics written by H. J. Hamjian and published by . This book was released on 1949 with total page 30 pages. Available in PDF, EPUB and Kindle. Book excerpt: The experiments conducted with boron carbide and each of four metals showed that nickel, cobalt, and iron formed a bonding zone between the metal and the ceramic and that chromium showed satisfactory physical wetting characteristics on the ceramic.

Download or read book Joining of Titanium written by Robert Edward Monroe and published by . This book was released on 1967 with total page 86 pages. Available in PDF, EPUB and Kindle. Book excerpt: This report supplies information on joining processes applicable to titanium and its alloys in sheet metal applications, primarily related directly to airframe construction. Although the material presented here does not cover all titanium joining processes, and omits such processes as plasma-arc, submerged-arc, electroslag, flash, and high-frequency resistance welding, the data presented cover materials up to 2-inches thick in some cases and the report should be useful to anyone seeking titanium joining information. The joining processes covered fall into five categories: welding, brazing, metallurgical bonding (diffusion and deformation bonding), adhesive bonding, and mechanical fastening. The fusion welding processes that are discussed in detail include gas tungsten arc, gas metal arc, arc spot, and electron beam. The resistance processes give extended coverage are spot, roll spot, and seam welding. (Author).

Download or read book U S Government Research Reports written by and published by . This book was released on 1964 with total page 2180 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Nuclear Science Abstracts written by and published by . This book was released on 1976-06 with total page 1216 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Index of NACA Technical Publications written by United States. National Advisory Committee for Aeronautics and published by . This book was released on 1952 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Chemically Bonded Phosphate Ceramics written by Arun S. Wagh and published by Elsevier. This book was released on 2016-05-17 with total page 424 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chemically Bonded Phosphate Ceramics brings together the latest developments in chemically bonded phosphate ceramics (CBPCs), including several novel ceramics, from US Federal Laboratories such as Argonne, Oak Ridge, and Brookhaven National Laboratories, as well as Russian and Ukrainian nuclear institutes. Coupled with further advances in their use as biomaterials, these materials have found uses in diverse fields in recent years. Applications range from advanced structural materials to corrosion and fire protection coatings, oil-well cements, stabilization and encapsulation of hazardous and radioactive waste, nuclear radiation shielding materials, and products designed for safe storage of nuclear materials. Such developments call for a single source to cover their science and applications. This book is a unique and comprehensive source to fulfil that need. In the second edition, the author covers the latest developments in nuclear waste containment and introduces new products and applications in areas such as biomedical implants, cements and coatings used in oil-well and other petrochemical applications, and flame-retardant anti-corrosion coatings. - Explores the key applications of CBPCs including nuclear waste storage, oil-well cements, anticorrosion coatings and biomedical implants - Demystifies the chemistry, processes and production methods of CBPCs - Draws on 40 years of developments and applications in the field, including the latest developments from USA, Europe, Ukraine, Russia, China and India

Download or read book Microelectronics Packaging Handbook written by R.R. Tummala and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 742 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Download or read book Bibliography of Technical Reports written by and published by . This book was released on 1950 with total page 396 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1995 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt: Lists citations with abstracts for aerospace related reports obtained from world wide sources and announces documents that have recently been entered into the NASA Scientific and Technical Information Database.

Download or read book Science of Ceramics written by Gerald H. Stewart and published by . This book was released on 1962 with total page 608 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Cumulated Index Medicus written by and published by . This book was released on 1989 with total page 1422 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Glass Technology written by and published by . This book was released on 1960 with total page 602 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Joining of Advanced and Specialty Materials written by Mrityunjay Singh and published by ASM International(OH). This book was released on 1998 with total page 184 pages. Available in PDF, EPUB and Kindle. Book excerpt: Twenty-three papers from the October 1998 conference. Papers discuss such advanced and specialty materials technologies for high performance under severe environmental and temperature conditions and for the construction of large and intricate shapes. The main topics addressed include joining techniq

Download or read book BiomMedD 2014 written by Iulian Antoniac and published by Trans Tech Publications Ltd. This book was released on 2015-03-09 with total page 383 pages. Available in PDF, EPUB and Kindle. Book excerpt: Selected, peer reviewed papers from the 6th International Conference “Biomateri-als, Tissue Engineering & Medical Devices” (BiomMedD’2014), September 17-20, 2014, Constanța, România

Download or read book Reactor Materials written by and published by . This book was released on 1961 with total page 1094 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Annual Report written by CSIRO (Australia). Division of Chemical Physics and published by . This book was released on 1972 with total page 802 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book 3D and Circuit Integration of MEMS written by Masayoshi Esashi and published by John Wiley & Sons. This book was released on 2021-03-16 with total page 528 pages. Available in PDF, EPUB and Kindle. Book excerpt: Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.