Download or read book Integrating Reliability Into Microelectronics Manufacturing written by A. Christou and published by . This book was released on 1994-06-30 with total page 378 pages. Available in PDF, EPUB and Kindle. Book excerpt: Details the methods for integrating reliability into manufacturing, providing a methodology for meeting the technological challenges of VLSI and MMIC circuits. Includes a detailed assessment of the relationship between yield and reliability; reliability concepts in dual use electronics--the priority for the future; an examination of the effects of fabrication technology on microcircuit quality; coverage of quality and reliability in microwave and plastic packages; and a comprehensive review of the new technologies for the future, including micro-electromechanical systems, robotics, and microwave integrated devices. Annotation copyright by Book News, Inc., Portland, OR

Download or read book Reliability Yield and Stress Burn In written by Way Kuo and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 407 pages. Available in PDF, EPUB and Kindle. Book excerpt: The international market is very competitive for high-tech manufacturers to day. Achieving competitive quality and reliability for products requires leader ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date engineering de sign tools and methods. Furthermore, manufacturing yield and reliability are interrelated. Manufacturing yield depends on the number of defects found dur ing both the manufacturing process and the warranty period, which in turn determines the reliability. the production of microelectronics has evolved into Since the early 1970's, one of the world's largest manufacturing industries. As a result, an important agenda is the study of reliability issues in fabricating microelectronic products and consequently the systems that employ these products, particularly, the new generation of microelectronics. Such an agenda should include: • the economic impact of employing the microelectronics fabricated by in dustry, • a study of the relationship between reliability and yield, • the progression toward miniaturization and higher reliability, and • the correctness and complexity of new system designs, which include a very significant portion of software.

Download or read book Reliability and Quality in Microelectronic Manufacturing written by A. Christou and published by RIAC. This book was released on 2006 with total page 410 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Microelectronics Failure Analysis written by EDFAS Desk Reference Committee and published by ASM International. This book was released on 2011 with total page 673 pages. Available in PDF, EPUB and Kindle. Book excerpt: Includes bibliographical references and index.

Download or read book Microelectronics Fialure Analysis Desk Reference Seventh Edition written by Tejinder Gandhi and published by ASM International. This book was released on 2019-11-01 with total page 719 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.

Download or read book VLSI Custom Microelectronics written by Stanley L. Hurst and published by CRC Press. This book was released on 1998-11-05 with total page 489 pages. Available in PDF, EPUB and Kindle. Book excerpt: Focuses on the design and production of integrated circuits specifically designed for a particular application from original equipment manufacturers. The book outlines silicon and GaAs semiconductor fabrication techniques and circuit configurations; compares custom design style; discusses computer-aided design tools; and more.

Download or read book Fan Out Wafer Level Packaging written by John H. Lau and published by Springer. This book was released on 2018-04-05 with total page 319 pages. Available in PDF, EPUB and Kindle. Book excerpt: This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP – such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. – are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.

Download or read book Failure Analysis of Integrated Circuits written by Lawrence C. Wagner and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 256 pages. Available in PDF, EPUB and Kindle. Book excerpt: This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.

Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1995 with total page 702 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Reliability written by Wallace R. Blischke and published by John Wiley & Sons. This book was released on 2011-09-20 with total page 848 pages. Available in PDF, EPUB and Kindle. Book excerpt: Bringing together business and engineering to reliability analysisWith manufactured products exploding in numbers and complexity,reliability studies play an increasingly critical role throughout aproduct's entire life cycle-from design to post-sale support.Reliability: Modeling, Prediction, and Optimization presents aremarkably broad framework for the analysis of the technical andcommercial aspects of product reliability, integrating concepts andmethodologies from such diverse areas as engineering, materialsscience, statistics, probability, operations research, andmanagement. Written in plain language by two highly respectedexperts in the field, this practical work provides engineers,operations managers, and applied statisticians with bothqualitative and quantitative tools for solving a variety ofcomplex, real-world reliability problems. A wealth of examples andcase studies accompanies: * Comprehensive coverage of assessment, prediction, and improvementat each stage of a product's life cycle * Clear explanations of modeling and analysis for hardware rangingfrom a single part to whole systems * Thorough coverage of test design and statistical analysis ofreliability data * A special chapter on software reliability * Coverage of effective management of reliability, product support,testing, pricing, and related topics * Lists of sources for technical information, data, and computerprograms * Hundreds of graphs, charts, and tables, as well as over 500references * PowerPoint slides are available from the Wiley editorialdepartment.

Download or read book Historical Studies in the Societal Impact of Spaceflight written by Steven J. Dick and published by . This book was released on 2015 with total page 686 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Chiplet Design and Heterogeneous Integration Packaging written by John H. Lau and published by Springer Nature. This book was released on 2023-03-27 with total page 542 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Download or read book The Computer Engineering Handbook written by Vojin G. Oklobdzija and published by CRC Press. This book was released on 2001-12-26 with total page 1409 pages. Available in PDF, EPUB and Kindle. Book excerpt: There is arguably no field in greater need of a comprehensive handbook than computer engineering. The unparalleled rate of technological advancement, the explosion of computer applications, and the now-in-progress migration to a wireless world have made it difficult for engineers to keep up with all the developments in specialties outside their own

Download or read book Reliability Engineering written by Elsayed A. Elsayed and published by John Wiley & Sons. This book was released on 2012-05-16 with total page 800 pages. Available in PDF, EPUB and Kindle. Book excerpt: A newly revised and updated edition that details both the theoretical foundations and practical applications of reliability engineering Reliability is one of the most important quality characteristics of components, products, and large and complex systems—but it takes a significant amount of time and resources to bring reliability to fruition. Thoroughly classroom- and industry-tested, this book helps ensure that engineers see reliability success with every product they design, test, and manufacture. Divided into three parts, Reliability Engineering, Second Edition handily describes the theories and their practical uses while presenting readers with real-world examples and problems to solve. Part I focuses on system reliability estimation for time independent and failure dependent models, helping engineers create a reliable design. Part II aids the reader in assembling necessary components and configuring them to achieve desired reliability objectives, conducting reliability tests on components, and using field data from similar components. Part III follows what happens once a product is produced and sold, how the manufacturer must ensure its reliability objectives by providing preventive and scheduled maintenance and warranty policies. This Second Edition includes in-depth and enhanced chapter coverage of: Reliability and Hazard Functions System Reliability Evaluation Time- and Failure-Dependent Reliability Estimation Methods of the Parameters of Failure-Time Distributions Parametric Reliability Models Models for Accelerated Life Testing Renewal Processes and Expected Number of Failures Preventive Maintenance and Inspection Warranty Models Case Studies A comprehensive reference for practitioners and professionals in quality and reliability engineering, Reliability Engineering can also be used for senior undergraduate or graduate courses in industrial and systems, mechanical, and electrical engineering programs.

Download or read book Compound Semiconductor Integrated Circuits written by Tho T. Vu and published by World Scientific. This book was released on 2003 with total page 363 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the book version of a special issue of the International Journal of High Speed Electronics and Systems, reviewing recent work in the field of compound semiconductor integrated circuits. There are fourteen invited papers covering a wide range of applications, frequencies and materials. These papers deal with digital, analog, microwave and millimeter-wave technologies, devices and integrated circuits for wireline fiber-optic lightwave transmissions, and wireless radio-frequency microwave and millimeter-wave communications. In each case, the market is young and experiencing rapid growth for both commercial and millitary applications. Many new semiconductor technologies compete for these new markets, leading to an alphabet soup of semiconductor materials described in these papers. Contents: Present and Future of High-Speed Compound Semiconductor IC's (T Otsuji); Transforming MMIC (E J Martinez); Distributed Amplifier for Fiber-Optic Communication Systems (H Shigematsu et al.); Microwave GaN-Based Power Transistors on Large-Scale Silicon Wafers (S Manohar et al.); Radiation Effects in High Speed III-V Integrated Circuits (T R Weatherford); Radiation Effects in III-V Semiconductor Electronics (B D Weaver et al.); Reliability and Radiation Hardness of Compound Semiconductors (S A Kayali & A H Johnston); and other papers. Readership: Engineers, scientists and graduate students working on high speed electronics and systems, and in the area of compound semiconductor integrated circuits.

Download or read book Microelectronics Manufacturing Diagnostics Handbook written by Abraham Landzberg and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 663 pages. Available in PDF, EPUB and Kindle. Book excerpt: The world of microelectronics is filled with cusses measurement systems, manufacturing many success stories. From the use of semi control techniques, test, diagnostics, and fail ure analysis. It discusses methods for modeling conductors for powerful desktop computers to their use in maintaining optimum engine per and reducing defects, and for preventing de formance in modem automobiles, they have fects in the first place. The approach described, clearly improved our daily lives. The broad while geared to the microelectronics world, has useability of the technology is enabled, how applicability to any manufacturing process of similar complexity. The authors comprise some ever, only by the progress made in reducing their cost and improving their reliability. De of the best scientific minds in the world, and fect reduction receives a significant focus in our are practitioners of the art. The information modem manufacturing world, and high-quality captured here is world class. I know you will diagnostics is the key step in that process. find the material to be an excellent reference in of product failures enables step func Analysis your application. tion improvements in yield and reliability. which works to reduce cost and open up new Dr. Paul R. Low applications and technologies. IBM Vice President and This book describes the process ofdefect re of Technology Products General Manager duction in the microelectronics world.

Download or read book Space Microelectronics Volume 2 Integrated Circuit Design for Space Applications written by Anatoly Belous and published by Artech House. This book was released on 2017-07-31 with total page 629 pages. Available in PDF, EPUB and Kindle. Book excerpt: This invaluable second volume of a two-volume set is filled with details about the integrated circuit design for space applications. Various considerations for the selection and application of electronic components for designing spacecraft are discussed. The basic constructions of submicron transistors and schottky diodes during the technological process of production are explored. This book provides details on the energy consumption minimization methods for microelectronic devices. Specific topics include: Features and physical mechanisms of the effect of space radiation on all the main classes of microcircuits, including peculiarities of radiation impact on submicron integrated circuits;Special design, technology, and schematic methods of increasing the resistance to various types of space radiation;Recommendations for choosing research equipment and methods for irradiating various samples;Microcircuit designers on the composition of test elements for the study of the effect of radiation;Microprocessors, circuit boards, logic microcircuits, digital, analog, digital–analog microcircuits manufactured in various technologies (bipolar, CMOS, BiCMOS, SOI);Problems involved with designing high speed microelectronic devices and systems based on SOS-and SOI-structures;System-on-chip and system-in-package and methods for rejection of silicon microcircuits with hidden defects during mass production.