Download or read book Integrating III V Compound Semiconductors with Silicon Using Wafer Bonding written by Yucai Zhou and published by . This book was released on 2000 with total page 302 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book III V Compound Semiconductors written by Tingkai Li and published by CRC Press. This book was released on 2016-04-19 with total page 588 pages. Available in PDF, EPUB and Kindle. Book excerpt: Silicon-based microelectronics has steadily improved in various performance-to-cost metrics. But after decades of processor scaling, fundamental limitations and considerable new challenges have emerged. The integration of compound semiconductors is the leading candidate to address many of these issues and to continue the relentless pursuit of more
Download or read book Semiconductor Wafer Bonding 10 Science Technology and Applications written by and published by The Electrochemical Society. This book was released on 2008-10 with total page 588 pages. Available in PDF, EPUB and Kindle. Book excerpt: This issue of ECS Transactions on Semiconductor Wafer Bonding will cover the state-of-the-art R&D results of the last 2 years in the field of semiconductor wafer bonding technology. Wafer Bonding is an Enabling Technology that can be used to create novel composite materials systems and devices that would otherwise be unattainable. Wafer Bonding today is rapidly expanding into new applications in such diverse fields as photonics, sensors, MEMS. X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI) and Nanotechnologies.
Download or read book Wafer Bonding written by Marin Alexe and published by Springer Science & Business Media. This book was released on 2004-05-14 with total page 524 pages. Available in PDF, EPUB and Kindle. Book excerpt: During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Download or read book SiGe Ge and Related Compounds 6 Materials Processing and Devices written by D. Harame and published by The Electrochemical Society. This book was released on with total page 1042 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book III V Compound Semiconductors and Devices written by Keh Yung Cheng and published by Springer Nature. This book was released on 2020-11-08 with total page 537 pages. Available in PDF, EPUB and Kindle. Book excerpt: This textbook gives a complete and fundamental introduction to the properties of III-V compound semiconductor devices, highlighting the theoretical and practical aspects of their device physics. Beginning with an introduction to the basics of semiconductor physics, it presents an overview of the physics and preparation of compound semiconductor materials, as well as a detailed look at the electrical and optical properties of compound semiconductor heterostructures. The book concludes with chapters dedicated to a number of heterostructure electronic and photonic devices, including the high-electron-mobility transistor, the heterojunction bipolar transistor, lasers, unipolar photonic devices, and integrated optoelectronic devices. Featuring chapter-end problems, suggested references for further reading, as well as clear, didactic schematics accompanied by six information-rich appendices, this textbook is ideal for graduate students in the areas of semiconductor physics or electrical engineering. In addition, up-to-date results from published research make this textbook especially well-suited as a self-study and reference guide for engineers and researchers in related industries.
Download or read book Hybrid photonic assemblies based on 3D printed coupling structures written by Xu, Yilin and published by KIT Scientific Publishing. This book was released on 2023-04-24 with total page 290 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advances in Optical Fiber Technology written by Moh Yasin and published by BoD – Books on Demand. This book was released on 2015-02-25 with total page 454 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a compilation of works presenting recent developments and practical applications in optical fiber technology. It contains 13 chapters from various institutions that represent global research in various topics such as scattering, dispersion, polarization interference, fuse phenomena and optical manipulation, optical fiber laser and sensor applications, passive optical network (PON) and plastic optical fiber (POF) technology. It provides the reader with a broad overview and sampling of the innovative research on optical fiber technologies.
Download or read book High Brightness Light Emitting Diodes written by and published by Academic Press. This book was released on 1998-02-09 with total page 489 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 48in the Semiconductors and Semimetals series discusses the physics and chemistry of electronic materials, a subject of growing practical importance in the semiconductor devices industry. The contributors discuss the current state of knowledge and provide insight into future developments of this important field.
Download or read book Semiconductor Wafer Bonding Science Technology and Applications V written by Charles E. Hunt and published by The Electrochemical Society. This book was released on 2001 with total page 496 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Silicon based Microphotonics from Basics to Applications written by Società italiana di fisica and published by IOS Press. This book was released on 1999 with total page 472 pages. Available in PDF, EPUB and Kindle. Book excerpt: The evolution of Si-based optoelectronics has been extremely fast in the last few years and it is predicted that this growth will still continue in the near future. The aim of the volume is to present different Si-based luminescing materials as porous silicon, rare-earth doped silicon, Si nanocrystals, silicides, Si-based multilayers and silicon-germanium alloy or superlattice structures. The different devices needed for an all-Si-based optoelectronics are treated, ranging from light sources to waveguides, from amplifiers and modulators to detectors. Both the very basic treatments as well as applications to real prototype devices and integration in an optical integrated circuit are presented. Several issues are highlighted: the problem of electrical transport in low-dimensional Si systems, the possibility of gain in Si-based systems, the low modulation speed of Si-based LEDs. The book gives a fascinating picture of the state-of-the-art in Si microphotonics and a perspective on what one can expect in the near future.
Download or read book Vertical External Cavity Surface Emitting Lasers written by Michael Jetter and published by John Wiley & Sons. This book was released on 2021-09-16 with total page 584 pages. Available in PDF, EPUB and Kindle. Book excerpt: Vertical External Cavity Surface Emitting Lasers Provides comprehensive coverage of the advancement of vertical-external-cavity surface-emitting lasers Vertical-external-cavity surface-emitting lasers (VECSELs) emit coherent light from the infrared to the visible spectral range with high power output. Recent years have seen new device developments – such as the mode-locked integrated (MIXSEL) and the membrane external-cavity surface emitting laser (MECSEL) – expand the application of VECSELs to include laser cooling, spectroscopy, telecommunications, biophotonics, and laser-based displays and projectors. In Vertical External Cavity Surface Emitting Lasers: VECSEL Technology and Applications, leading international research groups provide a comprehensive, fully up-to-date account of all fundamental and technological aspects of vertical external cavity surface emitting lasers. This unique book reviews the physics and technology of optically-pumped disk lasers and discusses the latest developments of VECSEL devices in different wavelength ranges. Topics include OP-VECSEL physics, continuous wave (CW) lasers, frequency doubling, carrier dynamics in SESAMs, and characterization of nonlinear lensing in VECSEL gain samples. This authoritative volume: Summarizes new concepts of DBR-free and MECSEL lasers for the first time Covers the mode-locking concept and its application Provides an overview of the emerging concept of self-mode locking Describes the development of next-generation OPS laser products Vertical External Cavity Surface Emitting Lasers: VECSEL Technology and Applications is an invaluable resource for laser specialists, semiconductor physicists, optical industry professionals, spectroscopists, telecommunications engineers and industrial physicists.
Download or read book Integration of III V Compound Semicond cu tors on Silicon MEMS Structures written by Yan Wang and published by . This book was released on 2000 with total page 356 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Devices for Integrated Circuits written by H. Craig Casey and published by John Wiley & Sons. This book was released on 1998-12-14 with total page 549 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book develops the device physics of the Si and III-V compound semiconductor devices used in integrated circuits. Important equations are derived from basic physical concepts. The physics of these devices are related to the parameters used in SPICE. Terminology is intended to prepare students for reading technical journals on semiconductor devices. This text is suitable for first-year graduate students and seniors in Electrical Engineering; graduate students in Material Science and Chemical Engineering, interested in semiconductor materials; Computer Science students interested in custom VLSI design; and professionals in the semiconductor industry.
Download or read book Handbook of Compound Semiconductors written by Paul H. Holloway and published by Cambridge University Press. This book was released on 2008-10-19 with total page 937 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book reviews the recent advances and current technologies used to produce microelectronic and optoelectronic devices from compound semiconductors. It provides a complete overview of the technologies necessary to grow bulk single-crystal substrates, grow hetero-or homoepitaxial films, and process advanced devices such as HBT's, QW diode lasers, etc.
Download or read book Wafer Bonding written by Marin Alexe and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 510 pages. Available in PDF, EPUB and Kindle. Book excerpt: The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Download or read book High Mobility Materials for CMOS Applications written by Nadine Collaert and published by Woodhead Publishing. This book was released on 2018-06-29 with total page 390 pages. Available in PDF, EPUB and Kindle. Book excerpt: High Mobility Materials for CMOS Applications provides a comprehensive overview of recent developments in the field of (Si)Ge and III-V materials and their integration on Si. The book covers material growth and integration on Si, going all the way from device to circuit design. While the book's focus is on digital applications, a number of chapters also address the use of III-V for RF and analog applications, and in optoelectronics. With CMOS technology moving to the 10nm node and beyond, however, severe concerns with power dissipation and performance are arising, hence the need for this timely work on the advantages and challenges of the technology. - Addresses each of the challenges of utilizing high mobility materials for CMOS applications, presenting possible solutions and the latest innovations - Covers the latest advances in research on heterogeneous integration, gate stack, device design and scalability - Provides a broad overview of the topic, from materials integration to circuits
