Download or read book Influence of Some Interstitial Materials on the Thermal Contact Conductance written by Jin-Tyan Lin and published by . This book was released on 1970 with total page 94 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Experiments have been conducted to investigate the effect of the interstitial materials at the interface of metals in contact. The test specimens were cylinders, axially aligned and loaded. Specimen materials were 606l-T6 aluminum alloy, and the contact fillers were stainless steel wire screens, aluminum foil, paper, and dielectric greases. The tests were conducted at atmospheric environment. The contact pressure ranged from 25 psi to 600 psi. The mean interface temperature ranged from 100 °F to 200 °F. Surface roughnesses of specimens were from 25 to 35 micro-inches, rms. The results of the investigation reveal that if the contact surfaces are sandwiched with interstitial material, the interface conductance is primarily dependent upon the thermal conductivity of this interstitial material. Some materials such as wire screen have the advantage of being less dependent upon temperature, pressure, and contact surface conditions, compared to bare junctions. The interstitial materials can either increase or decrease the contact resistance. In the case of aluminum foil sandwiched between the aluminum surfaces, the interface conductance increases three times, and sandwiched with greases, increases 10 times as much as that of the aluminum bare junction. On the other hand, if sandwiched with paper the interface conductance is lowered to 70 percent. This paper presents various characteristics of interstitial materials and provides some reliable data for engineering design purposes and further analysis in this field"--Abstract, leaf ii.
Download or read book Heat Transfer Between Surfaces in Contact The Effect of Low Conductance Interstitial Materials Part 3 Comparison of the Effective Thermal Insulation for Interstitial Materials Under Compressive Loads written by and published by . This book was released on 1968 with total page 184 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Cooling of Electronic Systems written by Sadik Kakaç and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 953 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.
Download or read book Heat Transfer Between Surfaces in Contact The Effect of Low Conductance Interstitial Materials Parts 4 and 5 Investigation of Thermal Isolation Materials and Their Application in Bolted Flange Joints written by and published by . This book was released on 1968 with total page 154 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Heat Transfer Between Surfaces in Contact The Effect of Low Conductance Interstitial Materials Part 1 Experimental Verification of NASA Test Apparatus written by and published by . This book was released on 1968 with total page 224 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Thermal Contact Conductance written by Chakravarti V. Madhusudana and published by Springer Science & Business Media. This book was released on 2013-09-24 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt: The work covers both theoretical and practical aspects of thermal contact conductance. The theoretical discussion focuses on heat transfer through spots, joints, and surfaces, as well as the role of interstitial materials (both planned and inadvertent). The practical discussion includes formulae and data that can be used in designing heat-transfer equipment for a variety of joints, including special geometries and configurations. All of the material has been updated to reflect the latest advances in the field.
Download or read book Proceedings of International Conference on Thermofluids written by Shripad Revankar and published by Springer Nature. This book was released on 2020-11-21 with total page 676 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents selected and peer-reviewed proceedings of the International Conference on Thermofluids (KIIT Thermo 2020). It focuses on the latest studies and findings in the areas of fluid dynamics, heat transfer, thermodynamics, and combustion. Some of the topics covered in the book include electronic cooling, HVAC system analysis, inverse heat transfer, combustion, nano-fluids, multiphase flow, high-speed flow, and shock waves. The book includes both experimental and numerical studies along with a few review chapters from experienced researchers, and is expected to lead to new research in this important area. This book is of interest to students, researchers as well as practitioners working in the areas of fluid dynamics, thermodynamics, and combustion.
Download or read book Thermal Conductivity 23 written by Kenneth E. Wilkes and published by CRC Press. This book was released on 2021-07-28 with total page 652 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains keynote lectures and 54 technical papers, presented at the 23rd International Thermal Conductivity Conference, on various topics, including techniques, coatings and films, theory, composites, fluids, metals, ceramics, and organics, related to thermal conductivity.
Download or read book Thermal Contact Conductance written by C.V. Madhusudana and published by Springer Science & Business Media. This book was released on 1995-12-15 with total page 192 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heat transfer between two bodies in thermal contact is of fundamental importance in a wide variety of applications ranging from industrial and domestic processes to fundamental biology and chemistry. This book covers both the theoretical and practical aspects of thermal contact conductance. The theoretical discussion covers heat transfer through spots, joints, and surfaces, as well as the role of interstitial materials (both planned and inadvertent). The practical discussion includes formulae and data for use in designing heat-transfer equipment for a variety of joints, including special geometries and configurations.
Download or read book Thermal Conductivity 14 written by P. Klemens and published by Springer. This book was released on 2013-11-11 with total page 571 pages. Available in PDF, EPUB and Kindle. Book excerpt: It was seven years ago this month when I had the pleasure of writing the Foreword to the Proceedings of the Eighth Conference on Thermal Conductivity hosted by TPRC/ Purdue University in 1968. Since then this Conference has developed to the point where one can say it has just entered a new phase. At its meeting in June 1975, the Board of Governors of the International Thermal Conductivity Conferences passed a resolution which formalizes two main policies that were felt to be desirable for a number of years, A key item of the resolution was for CINDAS/Purdue University to become the permanent Sponsor of the Conferences and in this capacity assist the Conferences in all matters which will result in the effective implementation of its goals and mission. In short, CINDAS will serve as a home base for the Conferences thus providing continuity and a permanent point of contact. CINDAS/Purdue University is pleased to accept this respons ibility as it is well within its mission to promote the advancement and dissemination of knowledge on thermophysica! properties of matter. A second important aspect of the Conference resolution was the establishment of a policy to publish the Proceedings of future conferences on a continuing and uniform basis effective with this, the Fourteenth Conference.
Download or read book Effects of Interstitial Gas Pressure on Thermal Contact Conductance written by Richard Raymond Connor and published by . This book was released on 1973 with total page 240 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1983 with total page 764 pages. Available in PDF, EPUB and Kindle. Book excerpt: Lists citations with abstracts for aerospace related reports obtained from world wide sources and announces documents that have recently been entered into the NASA Scientific and Technical Information Database.
Download or read book An Apparatus to Determine the Thermal Contact Conductance Between Dissimilar Metals written by David L. Padgett and published by . This book was released on 1980 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advanced Computational Methods in Mechanical and Materials Engineering written by Ashwani Kumar and published by CRC Press. This book was released on 2021-11-23 with total page 343 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides in-depth knowledge to solve engineering, geometrical, mathematical, and scientific problems with the help of advanced computational methods with a focus on mechanical and materials engineering. Divided into three subsections covering design and fluids, thermal engineering and materials engineering, each chapter includes exhaustive literature review along with thorough analysis and future research scope. Major topics covered pertains to computational fluid dynamics, mechanical performance, design, and fabrication including wide range of applications in industries as automotive, aviation, electronics, nuclear and so forth. Covers computational methods in design and fluid dynamics with a focus on computational fluid dynamics Explains advanced material applications and manufacturing in labs using novel alloys and introduces properties in material Discusses fabrication of graphene reinforced magnesium metal matrix for orthopedic applications Illustrates simulation and optimization gear transmission, heat sink and heat exchangers application Provides unique problem-solution approach including solutions, methodology, experimental setup, and results validation This book is aimed at researchers, graduate students in mechanical engineering, computer fluid dynamics,fluid mechanics, computer modeling, machine parts, and mechatronics.
Download or read book Heat Transfer Handbook written by Adrian Bejan and published by John Wiley & Sons. This book was released on 2003-06-30 with total page 1496 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chapters contributed by thirty world-renown experts. * Covers all aspects of heat transfer, including micro-scale and heat transfer in electronic equipment. * An associated Web site offers computer formulations on thermophysical properties that provide the most up-to-date values.
Download or read book INTRODUCTION TO HEAT TRANSFER written by S. K. SOM and published by PHI Learning Pvt. Ltd.. This book was released on 2008-10-24 with total page 580 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a comprehensive treatment of the essential fundamentals of the topics that should be taught as the first-level course in Heat Transfer to the students of engineering disciplines. The book is designed to stimulate student learning through clear, concise language. The theoretical content is well balanced with the problem-solving methodology necessary for developing an orderly approach to solving a variety of engineering problems. The book provides adequate mathematical rigour to help students achieve a sound understanding of the physical processes involved. Key Features : A well-balanced coverage between analytical treatments, physical concepts and practical demonstrations. Analytical descriptions of theories pertaining to different modes of heat transfer by the application of conservation equations to control volume and also by the application of conservation equations in differential form like continuity equation, Navier–Stokes equations and energy equation. A short description of convective heat transfer based on physical understanding and practical applications without going into mathematical analyses (Chapter 5). A comprehensive description of the principles of convective heat transfer based on mathematical foundation of fluid mechanics with generalized analytical treatments (Chapters 6, 7 and 8). A separate chapter describing the basic mechanisms and principles of mass transfer showing the development of mathematical formulations and finding the solution of simple mass transfer problems. A summary at the end of each chapter to highlight key terminologies and concepts and important formulae developed in that chapter. A number of worked-out examples throughout the text, review questions, and exercise problems (with answers) at the end of each chapter. This book is appropriate for a one-semester course in Heat Transfer for undergraduate engineering students pursuing careers in mechanical, metallurgical, aerospace and chemical disciplines.
Download or read book Thermal Spreading and Contact Resistance written by Yuri S. Muzychka and published by John Wiley & Sons. This book was released on 2023-08-09 with total page 469 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thermal Spreading and Contact Resistance: Fundamentals and Applications Single source reference on how applying thermal spreading and contact resistance can solve problems across a variety of engineering fields Thermal Spreading and Contact Resistance: Fundamentals and Applications offers comprehensive coverage of the key information that engineers need to know to understand thermal spreading and contact resistance, including numerous predictive models for determining thermal spreading resistance and contact conductance of mechanical joints and interfaces, plus detailed examples throughout the book. Written by two of the leading experts in the field, Thermal Spreading and Contact Resistance: Fundamentals and Applications includes information on: Contact conductance, mass transfer, transport from super-hydrophobic surfaces, droplet/surface phase change problems, and tribology applications such as sliding surfaces and roller bearings Heat transfer in micro-devices and thermal spreaders, orthotropic systems, and multi-source applications for electronics thermal management applications Fundamental principles, thermal spreading in isotropic half-space regions, circular flux tubes and disc spreaders, and rectangular flux channels and compound spreaders Systems with non-uniform sink plane conductance, transient spreading resistance, and contact resistance between both non-conforming and conforming rough surfaces Providing comprehensive coverage of the subject, Thermal Spreading and Contact Resistance: Fundamentals and Applications is an essential resource for mechanical, aerospace, and chemical engineers working on research in the fields of heat transfer, thermal management of electronics, and tribology, as well as thermal engineers and researchers in the field of thermal physics.
