Download or read book IEEE Transactions on Component Parts written by and published by . This book was released on 1963 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book IEEE Transactions on Component Parts written by and published by . This book was released on 1960 with total page 364 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book IEEE Transactions on Parts Materials and Packaging written by IEEE Parts, Materials, and Packaging Group and published by . This book was released on 1965 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book NIST Serial Holdings written by National Institute of Standards and Technology (U.S.) and published by . This book was released on 2002 with total page 268 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book IEEE Transactions on Components Packaging and Manufacturing Technology written by and published by . This book was released on 1998 with total page 744 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Parts Selection and Management written by Michael Pecht and published by John Wiley & Sons. This book was released on 2005-03-11 with total page 351 pages. Available in PDF, EPUB and Kindle. Book excerpt: Increase profitability and reduce risk through effective parts selection and management Corporations recognize that technology can be the key to fueling product design and development. But just as crucial-if not more-to a company's success are the decisions about when, what, and how a technology will be used. Few companies have failed because the right technology was not available; many have failed when a technology was not effectively selected and managed. Parts Selection and Management is a guide to increasing company profitability and reducing the time-to-profit through the efficient management of the process of parts selection and management. Taking an "eyes-on, hands-off" approach to parts selection, this guidebook addresses risk-assessment, decision-making steps, and subsequent management activities. The book covers everything from methodologies for parts selection and management, product requirements and specifications, and manufacturer assessment procedures to ways to track part changes through the supply chain, reliability assessment, and environmental, legislative, and legal issues. Written by a seasoned professional, teacher, and author in the field, the book enables companies to: * Employ effective risk assessment and mitigation techniques * Make an informed company-wide decision about parts selection and management * Choose parts to fit the functionality of the product and other constraints * Maximize system supportability by preparing for parts obsolescence * Improve supply-chain interactions and communications with customers and regulatory agencies to minimize time-to-profit Shedding light on a neglected but essential aspect of product development, Parts Selection and Management will give your organization the tools you need to avoid the risks associated with product use while promoting flexibility, innovation, and creativity in your product development.
Download or read book Argonne List of Serials written by Argonne National Laboratory. Library Services Department and published by . This book was released on 1972 with total page 344 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book High Frequency Magnetic Components written by Marian K. Kazimierczuk and published by John Wiley & Sons. This book was released on 2011-08-24 with total page 510 pages. Available in PDF, EPUB and Kindle. Book excerpt: If you are looking for a complete study of the fundamental concepts in magnetic theory, read this book. No other textbook covers magnetic components of inductors and transformers for high-frequency applications in detail. This unique text examines design techniques of the major types of inductors and transformers used for a wide variety of high-frequency applications including switching-mode power supplies (SMPS) and resonant circuits. It describes skin effect and proximity effect in detail to provide you with a sound understanding of high-frequency phenomena. As well as this, you will discover thorough coverage on: integrated inductors and the self-capacitance of inductors and transformers, with expressions for self-capacitances in magnetic components; criteria for selecting the core material, as well as core shape and size, and an evaluation of soft ferromagnetic materials used for magnetic cores; winding resistance at high frequencies; expressions for winding and core power losses when non-sinusoidal inductor or transformer current waveforms contain harmonics. Case studies, practical design examples and procedures (using the area product method and the geometry coefficient method) are expertly combined with concept-orientated explanations and student-friendly analysis. Supplied at the end of each chapter are summaries of the key concepts, review questions, and problems, the answers to which are available in a separate solutions manual. Such features make this a fantastic textbook for graduates, senior level undergraduates and professors in the area of power electronics in addition to electrical and computer engineering. This is also an inimitable reference guide for design engineers of power electronics circuits, high-frequency transformers and inductors in areas such as (SMPS) and RF power amplifiers and circuits.
Download or read book Catalog of Copyright Entries written by Library of Congress. Copyright Office and published by . This book was released on 1969 with total page 666 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Catalogue of Title entries of Books and Other Articles Entered in the Office of the Librarian of Congress at Washington Under the Copyright Law Wherein the Copyright Has Been Completed by the Deposit of Two Copies in the Office written by Library of Congress. Copyright Office and published by . This book was released on 1963 with total page 1510 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Reliability Abstracts and Technical Reviews written by and published by . This book was released on 1964 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Lead Free Solder Interconnect Reliability written by Dongkai Shangguan and published by ASM International. This book was released on 2005 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Three Dimensional Integrated Circuit Design written by Vasilis F. Pavlidis and published by Newnes. This book was released on 2017-07-04 with total page 770 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization
Download or read book Software Engineering with Reusable Components written by Johannes Sametinger and published by Springer Science & Business Media. This book was released on 2013-04-17 with total page 275 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book provides a clear understanding of what software reuse is, where the problems are, what benefits to expect, the activities, and its different forms. The reader is also given an overview of what sofware components are, different kinds of components and compositions, a taxonomy thereof, and examples of successful component reuse. An introduction to software engineering and software process models is also provided.
Download or read book 3D Microelectronic Packaging written by Yan Li and published by Springer. This book was released on 2017-01-20 with total page 465 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.
Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer Science & Business Media. This book was released on 2008-12-17 with total page 723 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Download or read book Energy Data Base written by and published by . This book was released on 1984 with total page 884 pages. Available in PDF, EPUB and Kindle. Book excerpt:
