Download or read book Electrical Performance of Electronic Packaging written by and published by . This book was released on 2004 with total page 394 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Real Time Modelling and Processing for Communication Systems written by Muhammad Alam and published by Springer. This book was released on 2017-12-27 with total page 293 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents cutting-edge work on real-time modelling and processing, a highly active research field in both the research and industrial domains. Going beyond conventional real-time systems, major efforts are required to develop accurate and computational efficient real-time modelling algorithms and design automation tools that reflect the technological advances in high-speed and ultra-low-power transceiver communication architectures based on nanoscale devices. The book addresses basic and more advanced topics, such as I/O buffer circuits for ensuring reliable chip-to-chip communication, I/O buffer behavioural modelling, multiport empirical models for memory interfaces, compact behavioural modelling for memristive devices, and resource reservation modelling for distributed embedded systems. The respective chapters detail new research findings, new models, algorithms, implementations and simulations of the above-mentioned topics. As such, the book will help both graduate students and researchers understand the latest research into real-time modelling and processing.
Download or read book Proceedings written by and published by . This book was released on 2004 with total page 1220 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microelectronics Packaging Handbook written by R.R. Tummala and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 1060 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
Download or read book Advanced Signal Integrity for High Speed Digital Designs written by Stephen H. Hall and published by John Wiley & Sons. This book was released on 2011-09-20 with total page 608 pages. Available in PDF, EPUB and Kindle. Book excerpt: A synergistic approach to signal integrity for high-speed digital design This book is designed to provide contemporary readers with an understanding of the emerging high-speed signal integrity issues that are creating roadblocks in digital design. Written by the foremost experts on the subject, it leverages concepts and techniques from non-related fields such as applied physics and microwave engineering and applies them to high-speed digital design—creating the optimal combination between theory and practical applications. Following an introduction to the importance of signal integrity, chapter coverage includes: Electromagnetic fundamentals for signal integrity Transmission line fundamentals Crosstalk Non-ideal conductor models, including surface roughness and frequency-dependent inductance Frequency-dependent properties of dielectrics Differential signaling Mathematical requirements of physical channels S-parameters for digital engineers Non-ideal return paths and via resonance I/O circuits and models Equalization Modeling and budgeting of timing jitter and noise System analysis using response surface modeling Each chapter includes many figures and numerous examples to help readers relate the concepts to everyday design and concludes with problems for readers to test their understanding of the material. Advanced Signal Integrity for High-Speed Digital Designs is suitable as a textbook for graduate-level courses on signal integrity, for programs taught in industry for professional engineers, and as a reference for the high-speed digital designer.
Download or read book CMOS Multichannel Single Chip Receivers for Multi Gigabit Optical Data Communications written by Paul Muller and published by Springer Science & Business Media. This book was released on 2007-10-08 with total page 207 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the world of optical data communications this book will be an absolute must-read. It focuses on optical communications for short and very short distance applications and discusses the monolithic integration of optical receivers with processing elements in standard CMOS technologies. What’s more, it provides the reader with the necessary background knowledge to fully understand the trade-offs in short-distance communication receiver design and presents the key issues to be addressed in the development of such receivers in CMOS technologies. Moreover, novel design approaches are presented.
Download or read book Machine Learning based Design and Optimization of High Speed Circuits written by Vazgen Melikyan and published by Springer Nature. This book was released on 2024-01-31 with total page 351 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes machine learning-based new principles, methods of design and optimization of high-speed integrated circuits, included in one electronic system, which can exchange information between each other up to 128/256/512 Gbps speed. The efficiency of methods has been proven and is described on the examples of practical designs. This will enable readers to use them in similar electronic system designs. The author demonstrates newly developed principles and methods to accelerate communication between ICs, working in non-standard operating conditions, considering signal deviation compensation with linearity self-calibration. The observed circuit types also include but are not limited to mixed-signal, high performance heterogeneous integrated circuits as well as digital cores.
Download or read book 5th Electronics Packaging Technology Conference written by Mahadevan K. Iyer and published by IEEE Computer Society Press. This book was released on 2003 with total page 854 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electrical Modeling and Design for 3D System Integration written by Er-Ping Li and published by John Wiley & Sons. This book was released on 2012-03-19 with total page 394 pages. Available in PDF, EPUB and Kindle. Book excerpt: New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures. Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through: The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards An equivalent circuit model of through-silicon vias Metal-oxide-semiconductor capacitance effects of through-silicon vias Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.
Download or read book Surrogate Based Modeling and Optimization written by Slawomir Koziel and published by Springer Science & Business Media. This book was released on 2013-06-06 with total page 413 pages. Available in PDF, EPUB and Kindle. Book excerpt: Contemporary engineering design is heavily based on computer simulations. Accurate, high-fidelity simulations are used not only for design verification but, even more importantly, to adjust parameters of the system to have it meet given performance requirements. Unfortunately, accurate simulations are often computationally very expensive with evaluation times as long as hours or even days per design, making design automation using conventional methods impractical. These and other problems can be alleviated by the development and employment of so-called surrogates that reliably represent the expensive, simulation-based model of the system or device of interest but they are much more reasonable and analytically tractable. This volume features surrogate-based modeling and optimization techniques, and their applications for solving difficult and computationally expensive engineering design problems. It begins by presenting the basic concepts and formulations of the surrogate-based modeling and optimization paradigm and then discusses relevant modeling techniques, optimization algorithms and design procedures, as well as state-of-the-art developments. The chapters are self-contained with basic concepts and formulations along with applications and examples. The book will be useful to researchers in engineering and mathematics, in particular those who employ computationally heavy simulations in their design work.
Download or read book BMAS written by and published by . This book was released on 2004 with total page 158 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book System on Package written by Rao Tummala and published by McGraw Hill Professional. This book was released on 2007-07-22 with total page 807 pages. Available in PDF, EPUB and Kindle. Book excerpt: System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
Download or read book Index of Conference Proceedings written by British Library. Document Supply Centre and published by . This book was released on 2001 with total page 870 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Graduate Quarterly written by and published by . This book was released on 1994 with total page 192 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Computational Methods in Large Scale Simulation written by Khin Yong Lam and published by Lecture Notes Series, Institut. This book was released on 2005 with total page 406 pages. Available in PDF, EPUB and Kindle. Book excerpt: Methods of multiscale modeling in mechanics / W.A. Curtin -- Efficient and accurate boundary methods for computational optics / Christian Hafner and J. Smajic -- Finite element modeling of periodic structures / Zheng Lou and Jian-Ming Jin -- Factorization of potential and field distributions without utilizing the addition theorem / Ali-Reza Baghai-Wadji and Erping Li -- Virtualization-aware application framework for hierarchical multiscale simulations on a grid / Aiichiro Nakano [und weitere] -- Molecular dynamics simulation and local quantities / Tamio Ikeshoji -- Recent advances in modeling and simulation of high-speed interconnects / Michel Nakhla and Ram Achat -- Multiscale modeling of degradation and failure of interconnect lines driven by electromigration and stress gradients / Robert Atkinson and Alberto Cuitiño
Download or read book International Symposium on Advanced Packaging Materials written by and published by . This book was released on 2005 with total page 322 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book The Optics Encyclopedia written by Thomas Gordon Brown and published by . This book was released on 2004 with total page 688 pages. Available in PDF, EPUB and Kindle. Book excerpt:
