Download or read book ICPT 2012 International Conference on Planarization CMP Technology written by and published by . This book was released on 2012 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings written by Gerfried Zwicker and published by . This book was released on 2012 with total page 414 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Planarization CMP Technology ICPT 2007 International Conference on written by and published by . This book was released on 2007* with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2014 International Conference on Planarization CMP Technology ICPT written by IEEE Staff and published by . This book was released on 2014-11-19 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: ICPT as an international symposium for Planarization CMP is a magnificent opportunity to have discussions on technologies including FEOL and BEOL CMP, 3D TSV, Fundamentals of CMP, Polishing Processes, Consumables, Equipment, Green Devices, New Applications, Metrology, Cleaning, Defect Control, Process Control, CMP Alternatives, SiC, GaN, Sapphire and Diamond The conference provides a place where every relevant researcher and engineer can get together to discuss openly and exchange information widely Enthusiastic presentations and discussions are expected to be on an equal footing, flat like the surface of wafer, no matter what country, organization position and technology area he she belongs to
Download or read book 2015 International Conference on Planarization CMP Technology ICPT written by IEEE Staff and published by . This book was released on 2015-09-30 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: ICPT, as an international symposium for planarization CMP, is a magnificent opportunity to have discussions on technologies including FEOL and BEOL CMP, 3D TSV, Fundamentals of CMP, Polishing Processes, Consumables, Equipment, Green Devices, New Applicaitons, Metrology, Cleaning, Defect Control, CMP Alternatives, SiC, GaN, Sapphire and Diamond The conference provides a place where every relevant researcher and engineer can get together to discuss openly and exchange information widely Enthusiastic presentations and discussions are expected to be on an euqal footing, irrespective of the attendees countries of origin, organizations positions and technology areas the attendees belong to
Download or read book Handbook of Silicon Wafer Cleaning Technology written by Karen Reinhardt and published by William Andrew. This book was released on 2018-03-16 with total page 794 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Silicon Wafer Cleaning Technology, Third Edition, provides an in-depth discussion of cleaning, etching and surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet and plasma processing are reviewed, including surface and colloidal aspects. This revised edition includes the developments of the last ten years to accommodate a continually involving industry, addressing new technologies and materials, such as germanium and III-V compound semiconductors, and reviewing the various techniques and methods for cleaning and surface conditioning. Chapters include numerous examples of cleaning technique and their results. The book helps the reader understand the process they are using for their cleaning application and why the selected process works. For example, discussion of the mechanism and physics of contamination, metal, particle and organic includes information on particle removal, metal passivation, hydrogen-terminated silicon and other processes that engineers experience in their working environment. In addition, the handbook assists the reader in understanding analytical methods for evaluating contamination. The book is arranged in an order that segments the various cleaning techniques, aqueous and dry processing. Sections include theory, chemistry and physics first, then go into detail for the various methods of cleaning, specifically particle removal and metal removal, amongst others. Focuses on cleaning techniques including wet, plasma and other surface conditioning techniques used to manufacture integrated circuits Reliable reference for anyone that manufactures integrated circuits or supplies the semiconductor and microelectronics industries Covers processes and equipment, as well as new materials and changes required for the surface conditioning process
Download or read book Advances in Chemical Mechanical Planarization CMP written by Babu Suryadevara and published by Woodhead Publishing. This book was released on 2021-09-10 with total page 650 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. Reviews the most relevant techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for current and emerging materials Addresses consumables and process control for improved CMP, including post-CMP
Download or read book Nanoelectronics written by Joachim Knoch and published by Walter de Gruyter GmbH & Co KG. This book was released on 2024-03-18 with total page 468 pages. Available in PDF, EPUB and Kindle. Book excerpt: In recent years, nanoelectronics has become very interdisciplinary requiring students to master aspects of physics, electrical engineering, chemistry etc. The 2nd edition of this textbook is a comprehensive overview of nanoelectronics covering the necessary quantum mechanical and solid-state physics foundation, an overview of semiconductor fabrication as well as a brief introduction into device simulation using the non-equilibrium Greens function formalism. Equipped with this, the work discusses nanoscale field-effect transistors and alternative device concepts such as Schottky-barrier MOSFETs as well as steep slope transistors based on different materials. In addition, cryogenic operation of MOSFETs for the realization of, e.g., classical control electronics of semiconducting spin qubits is studied. The work contains a number of tasks, examples and exercises with step-by-step video solutions as well as tutorial videos that deepen the understanding of the material. With additional access to simulation tools that allow students to do computational experiments, the emphasis is on thorough explanation of the material enabling students to carry out their own research.
Download or read book CAD CAM Robotics and Factories of the Future written by Dipak Kumar Mandal and published by Springer. This book was released on 2016-01-05 with total page 831 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume is based on the proceedings of the 28th International Conference on CAD/CAM, Robotics and Factories of the Future. This book specially focuses on the positive changes made in the field of robotics, CAD/CAM and future outlook for emerging manufacturing units. Some of the important topics discussed in the conference are product development and sustainability, modeling and simulation, automation, robotics and handling systems, supply chain management and logistics, advanced manufacturing processes, human aspects in engineering activities, emerging scenarios in engineering education and training. The contents of this set of proceedings will prove useful to both researchers and practitioners.
Download or read book International Conference on Planarization CMP Technology 2013 written by C-C. Arthur Chen and published by . This book was released on 2013 with total page 318 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Design Rules in a Semiconductor Foundry written by Eitan N. Shauly and published by CRC Press. This book was released on 2022-11-30 with total page 831 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nowadays over 50% of integrated circuits are fabricated at wafer foundries. This book presents a foundry-integrated perspective of the field and is a comprehensive and up-to-date manual designed to serve process, device, layout, and design engineers. It comprises chapters carefully selected to cover topics relevant for them to deal with their work. The book provides an insight into the different types of design rules (DRs) and considerations for setting new DRs. It discusses isolation, gate patterning, S/D contacts, metal lines, MOL, air gaps, and so on. It explains in detail the layout rules needed to support advanced planarization processes, different types of dummies, and related utilities as well as presents a large set of guidelines and layout-aware modeling for RF CMOS and analog modules. It also discusses the layout DRs for different mobility enhancement techniques and their related modeling, listing many of the dedicated rules for static random-access memory (SRAM), embedded polyfuse (ePF), and LogicNVM. The book also provides the setting and calibration of the process parameters set and describes the 28~20 nm planar MOSFET process flow for low-power and high-performance mobile applications in a step-by-step manner. It includes FEOL and BEOL physical and environmental tests for qualifications together with automotive qualification and design for automotive (DfA). Written for the professionals, the book belongs to the bookshelf of microelectronic discipline experts.
Download or read book Developments in Surface Contamination and Cleaning Methods for Surface Cleaning written by Rajiv Kohli and published by William Andrew. This book was released on 2016-11-04 with total page 214 pages. Available in PDF, EPUB and Kindle. Book excerpt: Developments in Surface Contamination and Cleaning: Methods for Surface Cleaning, Volume 9, part of the Developments in Surface Contamination and Cleaning series provide a state-of-the-art guide to the current knowledge on the behavior of film-type and particulate surface contaminants and their associated cleaning methods. This newest volume in the series discusses methods of surface cleaning of contaminants and the resources that are needed to deal with them. Taken as a whole, the series forms a unique reference for professionals and academics working in the area of surface contamination and cleaning. A strong theme running through the series is that of surface contamination and cleaning at the micro and nano scales. Provides a comprehensive coverage of innovations in surface cleaning Written by established experts in the surface cleaning field, presenting an authoritative resource Contains a comprehensive review of the state-of-the-art, including case studies to enhance the learning process
Download or read book Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect written by Jie Cheng and published by Springer. This book was released on 2017-09-06 with total page 148 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO4-based slurry. The thesis subsequently studies Cu/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to mitigate corrosion using different slurry additives. The findings presented here constitute a significant advance in fundamental and technical investigations into the CMP, while also laying the groundwork for future research.
Download or read book Chemistry and Industrial Techniques for Chemical Engineers written by Lionello Pogliani and published by CRC Press. This book was released on 2020-05-14 with total page 389 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book, Chemistry and Industrial Techniques for Chemical Engineers, brings together innovative research, new concepts, and novel developments in the application of new tools for chemical and materials engineers. It contains significant research, reporting new methodologies, and important applications in the fields of chemical engineering as well as the latest coverage of chemical databases and the development of new methods and efficient approaches for chemists. With clear explanations, real-world examples, this volume emphasizes the concepts essential to the practice of chemical science, engineering, and technology while introducing the newest innovations in the field.
Download or read book High Mobility Materials for CMOS Applications written by Nadine Collaert and published by Woodhead Publishing. This book was released on 2018-06-29 with total page 384 pages. Available in PDF, EPUB and Kindle. Book excerpt: High Mobility Materials for CMOS Applications provides a comprehensive overview of recent developments in the field of (Si)Ge and III-V materials and their integration on Si. The book covers material growth and integration on Si, going all the way from device to circuit design. While the book's focus is on digital applications, a number of chapters also address the use of III-V for RF and analog applications, and in optoelectronics. With CMOS technology moving to the 10nm node and beyond, however, severe concerns with power dissipation and performance are arising, hence the need for this timely work on the advantages and challenges of the technology. Addresses each of the challenges of utilizing high mobility materials for CMOS applications, presenting possible solutions and the latest innovations Covers the latest advances in research on heterogeneous integration, gate stack, device design and scalability Provides a broad overview of the topic, from materials integration to circuits
Download or read book Abrasive Technology written by Anna Rudawska and published by BoD – Books on Demand. This book was released on 2018-10-24 with total page 214 pages. Available in PDF, EPUB and Kindle. Book excerpt: The subject matter of this book is the information on the abrasive technology methods, the characteristics of the methods (for example, the technological parameters, tools, and machines), innovative methods, characteristics of surface structure and surface properties after this type of mechanical process, and application in various industrial branches and other technical and technological domains. Abrasive technology is very important, for example, in precision component manufacturing and nano-technology devices. The aim of this book is to present information on the characteristics and applications of abrasive technology, abrasive tools, tests, and also the innovative methods of this technology. This information enables scientists, engineers, and designers to ensure the soundness and integrity of the fabricated components and to develop new techniques effectively.
Download or read book Chemical Mechanical Planarization of Semiconductor Materials written by M.R. Oliver and published by Springer Science & Business Media. This book was released on 2004-01-26 with total page 444 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
