Download or read book High speed Interconnect Design Characterization and Applications written by Jinsook Kim and published by . This book was released on 2006 with total page 322 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book High speed Interconnect Design and Characterization written by Pingshan Wang and published by . This book was released on 2004 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Signal Integrity Characterization Techniques written by Mike Resso and published by Intl. Engineering Consortiu. This book was released on 2009 with total page 812 pages. Available in PDF, EPUB and Kindle. Book excerpt: Cogently addressing the future of signal integrity and the effect it will have on the data transmission industry as a whole, this all-inclusive guide addresses a wide array of technologies, from traditional digital data transmission to microwave measurements, and accessibly examines the gap between the two. Focusing on real world applications and providing a wide array of case studies that show how each technology can be used—from backplane design challenges to advanced error correction techniques—this guide addresses many of today’s high-speed technologies while also providing excellent insight into their future direction. With numerous valuable lessons pertaining to the signal integrity industry, this resource is the ultimate must-read guide for any specialist in the design engineering field.

Download or read book Digital Communications Test and Measurement written by Dennis Derickson and published by Pearson Education. This book was released on 2007-12-10 with total page 1240 pages. Available in PDF, EPUB and Kindle. Book excerpt: A Comprehensive Guide to Physical Layer Test and Measurement of Digital Communication Links Today's new data communication and computer interconnection systems run at unprecedented speeds, presenting new challenges not only in the design, but also in troubleshooting, test, and measurement. This book assembles contributions from practitioners at top test and measurement companies, component manufacturers,and universities. It brings together information that has never been broadly accessible before—information that was previously buried in application notes, seminar and conference presentations, short courses, and unpublished works. Readers will gain a thorough understanding of the inner workings of digital high-speed systems, and learn how the different aspects of such systems can be tested. The editors and contributors cover key areas in test and measurement of transmitters (digital waveform and jitter analysis and bit error ratio), receivers (sensitivity, jitter tolerance, and PLL/CDR characterization), and high-speed channel characterization (in time and frequency domain). Extensive illustrations are provided throughout. Coverage includes Signal integrity from a measurement point of view Digital waveform analysis using high bandwidth real-time and sampling (equivalent time) oscilloscopes Bit error ratio measurements for both electrical and optical links Extensive coverage on the topic of jitter in high-speed networks State-of-the-art optical sampling techniques for analysis of 100 Gbit/s + signals Receiver characterization: clock recovery, phase locked loops, jitter tolerance and transfer functions, sensitivity testing, and stressed-waveform receiver testing Channel and system characterization: TDR/T and frequency domain-based alternatives Testing and measuring PC architecture communication links: PCIexpress, SATA, and FB DIMM

Download or read book Bogatin s Practical Guide to Transmission Line Design and Characterization for Signal Integrity Applications written by Eric Bogatin and published by Artech House. This book was released on 2020-05-31 with total page 603 pages. Available in PDF, EPUB and Kindle. Book excerpt: This multimedia eBook establishes a solid foundation in the essential principles of how signals interact with transmission lines, how the physical design of interconnects affects transmission line properties, and how to interpret single-ended and differential time domain reflection (TDR) measurements to extract important figures of merits and avoid common mistakes. This book presents an intuitive understanding of transmission lines. Instructional videos are provided in every chapter that cover important aspects of the interconnect design and characterization process. This video eBook helps establish foundations for designing and characterizing the electrical properties of interconnects to explain in a simplified way how signals propagate and interact with interconnects and how the physical design of transmission structures will impact performance. Never be intimidated by impedance or differential pairs again.

Download or read book Icccd 2000 written by and published by Allied Publishers. This book was released on 2000 with total page 444 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Material Characterization and Application of a Carbon loaded Liquid Crystal Polymer for Interconnect Design written by Bruce Champion and published by . This book was released on 2016 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: There is a need for the use of electromagnetic absorbing materials within interconnect designs to eliminate resonances in the throughput and noise parameters, however, a learning curve exists for using these materials in close proximity to high-speed differential pairs commonly used in interconnect applications. This study successfully reduces the Integrated Crosstalk Noise (ICN) of an interconnect by 42% and Insertion Loss Deviation (ILD) by 44% by utilizing a carbon-loaded LCP acting as a dielectric absorber within the interconnect. Current literature characterizes carbon nanotube and carbon black composites acting as dielectric absorbers, however, these studies focus mainly on shielding applications far away from high-speed differential signaling. These studies also did not offer a desirable electrical model conducive for 3D Finite Element Method (FEM) modeling. Conversely, literature which does develop a proper electrical model which can be used in 3D FEM software often develops models for printed circuit board (PCB) materials or other materials with drastically different material characteristics as compared to a dielectric absorber. To date, there has been no study conducted on characterizing a dielectric absorber for use in interconnect applications. To overcome this learning curve this study sets forth a way of understanding the inherent material properties of a Carbon-loaded Liquid Crystal Polymer (LCP) functioning as a dielectric absorber within an interconnect. This study will show why a dielectric absorber is the best choice for interconnect applications. The type of dielectric absorber used in this study is an LCP loaded with 26% volume carbon black powder. In addition, the proper loading of the material above the percolation threshold will be discussed, a Line-Line material characterization test method is presented and validated, a Genetic Algorithm is used to match the material properties to a Multipole Debye Dielectric model, and finally an end application using a dielectric absorber is shown. Using the type of dielectric absorber developed in this study one can significantly reduce the cost and complexity of interconnect designs while increasing performance.

Download or read book High Speed Digital System Design written by Stephen H. Hall and published by Wiley-IEEE Press. This book was released on 2000-09-08 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt: A cutting-edge guide to the theory and practice of high-speed digital system design An understanding of high-speed interconnect phenomena is essential for digital designers who must deal with the challenges posed by the ever-increasing operating speeds of today's microprocessors. This book provides a much-needed, practical guide to the state of the art of modern digital system design, combining easily accessible explanations with immensely useful problem-solving strategies. Written by three leading Intel engineers, High-Speed Digital System Design clarifies difficult and often neglected topics involving the effects of high frequencies on digital buses and presents a variety of proven techniques and application examples. Extensive appendices, formulas, modeling techniques as well as hundreds of figures are also provided. Coverage includes: * A thorough introduction to the digital aspects of basic transmission line theory * Crosstalk and nonideal transmission line effects on signal quality and timings * The impact of packages, vias, and connectors on signal integrity * The effects of nonideal return current paths, high frequency power delivery, and simultaneous switching noise * Explanations of how driving circuit characteristics affect the quality of the digital signal * Digital timing analysis at the system level that incorporates high-speed signaling effects into timing budgets * Methodologies for designing high-speed buses and handling the very large number of variables that affect interconnect performance * Radiated emission problems and how to minimize system noise * The practical aspects of making measurements in high-speed digital systems

Download or read book Signal Integrity Effects in Custom IC and ASIC Designs written by Raminderpal Singh and published by John Wiley & Sons. This book was released on 2001-12-12 with total page 484 pages. Available in PDF, EPUB and Kindle. Book excerpt: "...offers a tutorial guide to IC designers who want to move to the next level of chip design by unlocking the secrets of signal integrity." —Jake Buurma, Senior Vice President, Worldwide Research & Development, Cadence Design Systems, Inc. Covers signal integrity effects in high performance Radio Frequency (RF) IC Brings together research papers from the past few years that address the broad range of issues faced by IC designers and CAD managers now and in the future A Wiley-IEEE Press publication

Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1995 with total page 548 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Contemporary Trends in Semiconductor Devices written by Rupam Goswami and published by Springer Nature. This book was released on 2022-02-16 with total page 313 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers evolution, concept and applications of modern semiconductor devices such as tunnel field effect transistors (TFETs), vertical super-thin body MOSFETs, ion sensing FETs (ISFETs), non-conventional solar cells, opto-electro mechanical devices and thin film transistors (TFTs). Comprising of theory, experimentation and applications of devices, the chapters describe state-of-art methods and techniques which shall be highly assistive in having an overall perspective on emerging technologies and working on a research area. The book is aimed at the scholars, enthusiasts and researchers who are currently working on devices in the contemporary era of semiconductor devices. Additionally, the chapters are lucid and descriptive and carry the potential of serving as a reference book for scholars in their undergraduate studies, who are looking ahead for a prospective career in semiconductor devices.

Download or read book Foundations for Microstrip Circuit Design written by Terry C. Edwards and published by John Wiley & Sons. This book was released on 2016-02-01 with total page 688 pages. Available in PDF, EPUB and Kindle. Book excerpt: Building on the success of the previous three editions, Foundations for Microstrip Circuit Design offers extensive new, updated and revised material based upon the latest research. Strongly design-oriented, this fourth edition provides the reader with a fundamental understanding of this fast expanding field making it a definitive source for professional engineers and researchers and an indispensable reference for senior students in electronic engineering. Topics new to this edition: microwave substrates, multilayer transmission line structures, modern EM tools and techniques, microstrip and planar transmision line design, transmission line theory, substrates for planar transmission lines, Vias, wirebonds, 3D integrated interposer structures, computer-aided design, microstrip and power-dependent effects, circuit models, microwave network analysis, microstrip passive elements, and slotline design fundamentals.

Download or read book Three Dimensional Integrated Circuit Design written by Vasilis F. Pavlidis and published by Newnes. This book was released on 2017-07-04 with total page 770 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization

Download or read book Electrical Characterization and Circuit Modeling of Interconnections and Packages for High Speed Circuits by Time Domain Measurements written by Jyh-ming Jong and published by . This book was released on 1995 with total page 254 pages. Available in PDF, EPUB and Kindle. Book excerpt: With edge rates of high speed digital devices pushing into the sub-nano second range, interconnections with the associated packages play a major role in determining the speed, size and performance of digital circuits and systems. The purpose of this study is to develop experimental techniques based on time domain peeling algorithms (dynamic deconvolution) for accurate electrical characterization and circuit modeling of general interconnection structures. This thesis describes the basic principles and computational procedure of these time domain peeling algorithms, accompanied by many illustrations and examples of practical interconnection structures in high speed electronic packages. These include general single (isolated) interconnections with nonuniform cross section, general uniformly/ nonuniformly coupled interconnection structures with discontinuities, power/ ground systems with the associated parallel plane structures, resistive lossy interconnections in thin film single and multi-chip modules, and multilayer high-pin-count packages. It is shown that the distributed circuit models consisting of cascaded transmission line sections lead to an accurate evaluation of the time domain response of high speed interconnection structures. These distributed models are synthesized from the time domain reflection and transmission (TDRIT) measurements, and the impedance profiles of the distributed model are extracted by using scattering matrix-based peeling algorithms By direct time domain integration or frequency domain optimization, the distributed circuit model can also be used to construct the lumped element circuit model as well as the proposed hybrid element model consisting of transmission lines and lumped elements. The hybrid model is intended to combine the efficiency of the lumped element model with the accuracy of the distributed circuit model leading to efficient accurate simulation of circuits in general CAD tools. The accuracy of these circuit models is also confirmed by comparing the simulated data with the measured data for the test fixtures on printed circuit boards (PCBs) and chip-to-chip level interconnections. The techniques developed in this thesis can help to assure the signal fidelity of high speed circuits in the early design stage by incorporating interconnect models into integrated circuit design and simulation.

Download or read book Transactions on High Performance Embedded Architectures and Compilers IV written by Per Stenström and published by Springer Science & Business Media. This book was released on 2011-11-22 with total page 446 pages. Available in PDF, EPUB and Kindle. Book excerpt: Transactions on HiPEAC aims at the timely dissemination of research contributions in computer architecture and compilation methods for high-performance embedded computer systems. Recognizing the convergence of embedded and general-purpose computer systems, this journal publishes original research on systems targeted at specific computing tasks as well as systems with broad application bases. The scope of the journal therefore covers all aspects of computer architecture, code generation and compiler optimization methods of interest to researchers and practitioners designing future embedded systems. This 4th issue contains 21 papers carefully reviewed and selected out of numerous submissions and is divided in four sections. The first section contains five regular papers. The second section consists of the top four papers from the 4th International Conference on High-Performance Embedded Architectures and Compilers, HiPEAC 2009, held in Paphos, Cyprus, in January 2009. The third section contains a set of six papers providing a snap-shot from the Workshop on Software and Hardware Challenges of Manycore Platforms, SHCMP 2008 held in Beijing, China, in June 2008. The fourth section consists of six papers from the 8th IEEE International Symposium on Systems, Architectures, Modeling and Simulation, SAMOS VIII (2008) held in Samos, Greece, in July 2008.

Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1982 with total page 1284 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Physics of Semiconductor Devices written by K. N. Bhat and published by Alpha Science Int'l Ltd.. This book was released on 2004 with total page 1310 pages. Available in PDF, EPUB and Kindle. Book excerpt: Contributed papers of the workshop held at IIT, Madras, in 2003.