Download or read book Handbook of Semiconductor Interconnection Technology Second Edition written by Geraldine C. Schwartz and published by CRC Press. This book was released on 2006-02-22 with total page 536 pages. Available in PDF, EPUB and Kindle. Book excerpt: First introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated treatment of interconnect technologies and its forward-looking perspective. The field has grown tremendously in the interim and many of the "likely directions" outlined in the first edition are now standard in modern facilities. Reflecting those advances, this edition delves into the practical aspects of interconnections for manufacturing. It examines the interconnect and fabrication technologies now available, with an examination of future prospects for the field. What's in this Edition: Detailed discussion of electrochemical equipment for plating copper Information on tools used for evaporation, chemical vapor deposition, and plasma processes Emphasis on measurement of mechanical and thermal properties of insulators Methods for characterizing porous dielectric thin films Greater focus on integration issues and properties of titanium, cobalt, and nickel silicides Process schemes based on the increased need for borderless contact gates and source/drain Expanded discussion on choices for low-dielectric insulators Concentration on electroplated copper, especially morphology of plated films and their properties Developments in thin film liners and barriers Expanded material on copper reliability

Download or read book Handbook of Semiconductor Interconnection Technology written by Geraldine Cogin Shwartz and published by CRC Press. This book was released on 2006-02-22 with total page 533 pages. Available in PDF, EPUB and Kindle. Book excerpt: First introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated treatment of interconnect technologies and its forward-looking perspective. The field has grown tremendously in the interim and many of the "likely directions" outlined in the first ed

Download or read book Handbook of Semiconductor Manufacturing Technology written by Yoshio Nishi and published by CRC Press. This book was released on 2017-12-19 with total page 1720 pages. Available in PDF, EPUB and Kindle. Book excerpt: Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.

Download or read book Handbook of Semiconductor Interconnection Technology written by G. C. Schwartz and published by CRC Press. This book was released on 1997-11-24 with total page 577 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covering materials, processes, equipment, methodologies, characterization techniques, clean room practices, and ways to control contamination-related defects, this work offers up-to-date information on the application of interconnection technology to semiconductors. It offers an integration of technical, patent and industry literature.

Download or read book Handbook of Semiconductor Technology Volume 2 written by Kenneth A. Jackson and published by Wiley-VCH. This book was released on 2000-08-15 with total page 724 pages. Available in PDF, EPUB and Kindle. Book excerpt: Semiconductor technology is the basis of today's microelectronics industry with its many impacts on our modern life, i.e. computer and communication technology. This two-volume handbook covers the basics of semiconductor processing technology, which are as essential for the design of new microelectronic devices as the fundamental physics. Volume 1 'Electronic Structure and Properties' covers the structure and properties of semiconductors, with particular emphasis on concepts relevant to semiconductor technology. Volume 2 'Processing of Semiconductors' deals with the enabling materials technology for the electronics industry. World-renowned authors have contributed to this unique treatment of the processing of semiconductors and related technologies. Of interest to physicists and engineers in research and in the electronics industry, this is a valuable reference source and state-of-the-art review by the world's top authors.

Download or read book The Electrical Engineering Handbook Second Edition written by Richard C. Dorf and published by CRC Press. This book was released on 1997-09-26 with total page 2758 pages. Available in PDF, EPUB and Kindle. Book excerpt: In 1993, the first edition of The Electrical Engineering Handbook set a new standard for breadth and depth of coverage in an engineering reference work. Now, this classic has been substantially revised and updated to include the latest information on all the important topics in electrical engineering today. Every electrical engineer should have an opportunity to expand his expertise with this definitive guide. In a single volume, this handbook provides a complete reference to answer the questions encountered by practicing engineers in industry, government, or academia. This well-organized book is divided into 12 major sections that encompass the entire field of electrical engineering, including circuits, signal processing, electronics, electromagnetics, electrical effects and devices, and energy, and the emerging trends in the fields of communications, digital devices, computer engineering, systems, and biomedical engineering. A compendium of physical, chemical, material, and mathematical data completes this comprehensive resource. Every major topic is thoroughly covered and every important concept is defined, described, and illustrated. Conceptually challenging but carefully explained articles are equally valuable to the practicing engineer, researchers, and students. A distinguished advisory board and contributors including many of the leading authors, professors, and researchers in the field today assist noted author and professor Richard Dorf in offering complete coverage of this rapidly expanding field. No other single volume available today offers this combination of broad coverage and depth of exploration of the topics. The Electrical Engineering Handbook will be an invaluable resource for electrical engineers for years to come.

Download or read book Handbook of Optical Interconnects written by Shigeru Kawai and published by CRC Press. This book was released on 2018-10-03 with total page 480 pages. Available in PDF, EPUB and Kindle. Book excerpt: As we reach the data transmission limits of copper wire and communications experts seek to bring the speed of long-haul fiber optics networks closer to access points, optical interconnects promise to provide efficient, high-speed data transmission for the next generation of networks and systems. They offer higher bit-rates, virtually no crosstalk, lower demands on power requirements and thermal management, and the possibility of two-dimensional channel arrays for chip-to-chip communication. The Handbook of Optical Interconnects introduces the systems and devices that will bring the speed and quality of optical transmission closer to the circuit board. Contributed by active experts, most from leading technology companies in the US and Japan, this outstanding handbook details various low-cost and small-size configurations, illustrates the discussion with more than 300 figures, and offers a look at the applications and future of this exciting and rapidly growing field. The book includes a detailed introduction to vertical cavity surface-emitting lasers (VCSELs); the use of optical interconnects in metropolitan, local-area, and access networks through FTTP (FTTH); and Jisso technologies, which are critical for developing low-cost, small-size modules. Driving down the size and cost of optical interconnects is vital for integrating these technologies into the network and onto microprocessors, and the Handbook of Optical Interconnects provides the knowledge and tools necessary to accomplish these goals.

Download or read book Microelectronics Packaging Handbook written by R.R. Tummala and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 1060 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Download or read book Semiconductor Manufacturing Handbook Second Edition written by Hwaiyu Geng and published by McGraw Hill Professional. This book was released on 2017-10-06 with total page 704 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thoroughly Revised, State-of-the-Art Semiconductor Design, Manufacturing, and Operations Information Written by 70 international experts and reviewed by a seasoned technical advisory board, this fully updated resource clearly explains the cutting-edge processes used in the design and fabrication of IC chips, MEMS, sensors, and other electronic devices. Semiconductor Manufacturing Handbook, Second Edition, covers the emerging technologies that enable the Internet of Things, the Industrial Internet of Things, data analytics, artificial intelligence, augmented reality, and and smart manufacturing. You will get complete details on semiconductor fundamentals, front- and back-end processes, nanotechnology, photovoltaics, gases and chemicals, fab yield, and operations and facilities. •Nanotechnology and microsystems manufacturing •FinFET and nanoscale silicide formation •Physical design for high-performance, low-power 3D circuits •Epitaxi, anneals, RTP, and oxidation •Microlithography, etching, and ion implantations •Physical, chemical, electrochemical, and atomic layer vapor deposition •Chemical mechanical planarization •Atomic force metrology •Packaging, bonding, and interconnects •Flexible hybrid electronics •Flat-panel,flexible display electronics, and photovoltaics •Gas distribution systems •Ultrapure water and filtration •Process chemicals handling and abatement •Chemical and slurry handling systems •Yield management, CIM, and factory automation •Manufacturing execution systems •Advanced process control •Airborne molecular contamination •ESD controls in clean-room environments •Vacuum systems and RF plasma systems •IC manufacturing parts cleaning technology •Vibration and noise design •And much more

Download or read book Microelectronics Packaging Handbook written by Rao Tummala and published by Springer Science & Business Media. This book was released on 1997-01-31 with total page 662 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.

Download or read book Ceramic Interconnect Technology Handbook written by Fred D. Barlow, III and published by CRC Press. This book was released on 2018-10-03 with total page 373 pages. Available in PDF, EPUB and Kindle. Book excerpt: Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.

Download or read book Handbook of Silicon Semiconductor Metrology written by Alain C. Diebold and published by CRC Press. This book was released on 2001-06-29 with total page 703 pages. Available in PDF, EPUB and Kindle. Book excerpt: Containing more than 300 equations and nearly 500 drawings, photographs, and micrographs, this reference surveys key areas such as optical measurements and in-line calibration methods. It describes cleanroom-based measurement technology used during the manufacture of silicon integrated circuits and covers model-based, critical dimension, overlay

Download or read book The International Handbook on Innovation written by Larisa V Shavinina and published by Elsevier. This book was released on 2003-10-16 with total page 1202 pages. Available in PDF, EPUB and Kindle. Book excerpt: The breadth of this work will allow the reader to acquire a comprehensive and panoramic picture of the nature of innovation within a single handbook.

Download or read book Electronic Packaging and Interconnection Handbook written by Charles A. Harper and published by McGraw-Hill Companies. This book was released on 1997 with total page 1020 pages. Available in PDF, EPUB and Kindle. Book excerpt: Charles A. Harper's 2nd edition on designing and manufacturing all the major types of electronic systems is now double the size of the 1st edition. It draws upon the expertise of a dozen experts to make sense of this highly interdisciplinary field

Download or read book Processing Materials of 3D Interconnects Damascene and Electronics Packaging 6 written by K. Kondo and published by The Electrochemical Society. This book was released on 2015-04-30 with total page 140 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Semiconductor Manufacturing Handbook written by Hwaiyu Geng and published by McGraw Hill Professional. This book was released on 2005-05-18 with total page 915 pages. Available in PDF, EPUB and Kindle. Book excerpt: WORLD-CLASS SEMICONDUCTOR MANUFACTURING EXPERTISE AT YOUR FINGERTIPS This is a comprehensive reference to the semiconductor manufacturing process and ancillary facilities -- from raw material preparation to packaging and testing, applying basics to emerging technologies. Readers charged with optimizing the design and performance of manufacturing processes will find all the information necessary to produce the highest quality chips at the lowest price in the shortest time possible. The Semiconductor Manufacturing Handbook provides leading-edge information on semiconductor wafer processes, MEMS, nanotechnology, and FPD, plus the latest manufacturing and automation technologies, including: Yield Management Automated Material Handling System Fab and Cleanroom Design and Operation Gas Abatement and Waste Treatment Management And much more Written by 60 international experts, and peer reviewed by a seasoned advisory board, this handbook covers the fundamentals of relevant technology and its real-life application and operational considerations for planning, implementing, and controlling manufacturing processes. It includes hundreds of detailed illustrations and a list of relevant books, technical papers, and websites for further research. This inclusive, wide-ranging coverage makes the Semiconductor Manufacturing Handbook the most comprehensive single-volume reference ever published in the field. STATE-OF-THE-ART SEMICONDUCTOR TECHNOLOGIES AND MANUFACTURING PROCESSES: SEMICONDUCTOR FUNDAMENTALS How Chips Are Designed and Made * Substrates * Copper and Low-k Dielectrics * Silicide Formation * Plasma * Vacuum * Photomask WAFER PROCESSING TECHNOLOGIES Microlithography * Ion Implantation * Etch * PVD/ALD * CVD * ECD * Epitaxy * CMP * Wet Cleaning FINAL MANUFACTURING Packaging * Grinding, Stress Relief, Dicing * Inspection, Measurement, and Testing NANOTECHNOLOGY, MEMS, AND FPD GAS AND CHEMICALS Specialty Gas System and DCA * Gas Abatement Systems * Chemical and Slurries Delivery System * Ultra Pure Water FAB YIELD, OPERATIONS, AND FACILITIES Yield Management * Automated Materials Handling System * Metrology * Six Sigma * Advanced Process Control * EHS * Fab Design and Construction * Cleanroom * Vibration and Acoustic Control * ESD * Airborne Molecular Control * Particle Monitoring * Wastewater Neutralization Systems

Download or read book Semiconductor Manufacturing Handbook Second Edition written by Hwaiyu Geng and published by McGraw-Hill Education. This book was released on 2017-09-20 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. Thoroughly Revised, State-of-the-Art Semiconductor Design, Manufacturing, and Operations Information Written by 70 international experts and reviewed by a seasoned technical advisory board, this fully updated resource clearly explains the cutting-edge processes used in the design and fabrication of IC chips, MEMS, sensors, and other electronic devices. Semiconductor Manufacturing Handbook, Second Edition, covers the emerging technologies that enable the Internet of Things, the Industrial Internet of Things, data analytics, artificial intelligence, augmented reality, and and smart manufacturing. You will get complete details on semiconductor fundamentals, front- and back-end processes, nanotechnology, photovoltaics, gases and chemicals, fab yield, and operations and facilities. •Nanotechnology and microsystems manufacturing •FinFET and nanoscale silicide formation •Physical design for high-performance, low-power 3D circuits •Epitaxi, anneals, RTP, and oxidation •Microlithography, etching, and ion implantations •Physical, chemical, electrochemical, and atomic layer vapor deposition •Chemical mechanical planarization •Atomic force metrology •Packaging, bonding, and interconnects •Flexible hybrid electronics •Flat-panel,flexible display electronics, and photovoltaics •Gas distribution systems •Ultrapure water and filtration •Process chemicals handling and abatement •Chemical and slurry handling systems •Yield management, CIM, and factory automation •Manufacturing execution systems •Advanced process control •Airborne molecular contamination •ESD controls in clean-room environments •Vacuum systems and RF plasma systems •IC manufacturing parts cleaning technology •Vibration and noise design •And much more