Download or read book Flip Chip Technologies and Global Markets written by BCC Research and published by . This book was released on 2013-12 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Flip Chip Technologies written by John H. Lau and published by McGraw-Hill Professional Publishing. This book was released on 1996 with total page 600 pages. Available in PDF, EPUB and Kindle. Book excerpt: A guide to flip chip technologies, for professionals in flip chip and MCM research and development, and for engineers and technical managers choosing design and manufacturing processes for electronic packaging and interconnect systems. Discusses economic, design, material, quality, and reliability issues of flip chip technologies, and details aspects of classical solder-bumped flip chip interconnect technologies; the next generations of flip chip technologies; and known-good-die testing for multiple module applications. Annotation copyright by Book News, Inc., Portland, OR

Download or read book FCIP and Expanding Markets for Flip Chip written by Thomas W. Goodman and published by . This book was released on 1997 with total page 231 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Low Cost Flip Chip Technologies written by John H. Lau and published by McGraw-Hill Professional Publishing. This book was released on 2000 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: Of the Standard NuBGA Packages -- Thinner Substrate and Nonuniform Heat Spreader NuBGA -- Thermal Performance of the New NuBGA Package -- Temperature Distribution -- Thermal Resistance -- Cooling Power -- Wind Tunnel Experimental Analysis -- Solder Joint Reliability of the New NuBGA Package -- Electrical Performance of the New NuBGA Package -- Capacitance -- Inductance -- Summary of the New NuBGA Package -- Solder-Bumped Flip Chip in PBGA Packages -- Intel's OLGA Package Technology -- OLGA Package Design -- OLGA Wafer Bumping -- OLGA Substrate Technology -- OLGA Package Assembly -- OLGA Package Reliability -- Mitsubishi's FC-BGA Package -- Wafer Bumping -- Mitsubishi's SBU Substrate -- PC-BGA Assembly Process -- Thermal Management -- Electrical Performance -- Qualification Tests and Results -- IBM's FC-PBGA Package -- CFD Analysis for Thermal Boundary Conditions -- Nonlinear Finite Element Stress Analysis -- Simulation Results -- Solder Joint Thermal Fatigue Life Prediction -- Motorola's FC-PBGA Packages -- Thermal Management of FC-PBGA Assemblies with E3 Bumps -- Solder Joint Reliability of FC-PBGA Assemblies with C4 Bumps -- Failure Analysis of Flip Chip on Low-Cost Substrates -- Failure Analysis of FCOB with Imperfect Underfills -- Test Chip -- Test Board -- Flip Chip Assembly -- Preconditions, Reflows, and Qualification Tests -- Failure Modes and Discussions -- Die Cracking -- Interfacial Shear Strength -- Interfacial Shear Strength Between Solder Mask and Underfill.

Download or read book Global Perspectives on Technology Transfer and Commercialization written by John Sibley Butler and published by Edward Elgar Publishing. This book was released on 2011-01-01 with total page 433 pages. Available in PDF, EPUB and Kindle. Book excerpt: As we move further into the 21st century, increasing emphasis is being placed on the importance of technology transfer. Through new research and practices, scholars, practitioners and policymakers have made great strides in broadening our understanding and ability to implement technology transfer and commercialization processes. The fruit of that research is collected in this timely volume. Technology transfer is a dynamic area of study that examines traditional topics such as intellectual property management, the management of risk, market identification, the role of public and private labs, and the role of universities. This volume reflects on how government, business and academia influence technology transfer in different countries and how the infrastructure of a country enhances technology and contributes to each country s overall economy. Interpreting and adopting the processes of technology transfer and commercialization or, building innovative ecosystems is critical to seeing success in this digital age. Those leading the surge toward building innovative ecosystems for technology transfer are the fellows of the Institute for Innovation Creativity and Capital (IC2 Institute) at The University of Texas at Austin. Global in its scope of solving market economy problems, for this volume the Institute has focused its lens on accelerated knowledge-based development. Here, scholars from 13 countries come together to critique technology transfer from each of their respective nations. The results of their contributions lend innovative insight to exactly how different nations are working to maximize technology transfer and commercialization in uncertain times. Those with an interest in commercialization and technology transfer, from students to scholars, practitioners to policymakers, will find this important collection of great value.

Download or read book Flip Chip and WLP written by and published by . This book was released on 2006 with total page 199 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Advanced Flip Chip Packaging written by Ho-Ming Tong and published by Springer Science & Business Media. This book was released on 2013-03-20 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

Download or read book Parts Selection and Management written by Michael Pecht and published by John Wiley & Sons. This book was released on 2005-03-11 with total page 351 pages. Available in PDF, EPUB and Kindle. Book excerpt: Increase profitability and reduce risk through effective parts selection and management Corporations recognize that technology can be the key to fueling product design and development. But just as crucial-if not more-to a company's success are the decisions about when, what, and how a technology will be used. Few companies have failed because the right technology was not available; many have failed when a technology was not effectively selected and managed. Parts Selection and Management is a guide to increasing company profitability and reducing the time-to-profit through the efficient management of the process of parts selection and management. Taking an "eyes-on, hands-off" approach to parts selection, this guidebook addresses risk-assessment, decision-making steps, and subsequent management activities. The book covers everything from methodologies for parts selection and management, product requirements and specifications, and manufacturer assessment procedures to ways to track part changes through the supply chain, reliability assessment, and environmental, legislative, and legal issues. Written by a seasoned professional, teacher, and author in the field, the book enables companies to: * Employ effective risk assessment and mitigation techniques * Make an informed company-wide decision about parts selection and management * Choose parts to fit the functionality of the product and other constraints * Maximize system supportability by preparing for parts obsolescence * Improve supply-chain interactions and communications with customers and regulatory agencies to minimize time-to-profit Shedding light on a neglected but essential aspect of product development, Parts Selection and Management will give your organization the tools you need to avoid the risks associated with product use while promoting flexibility, innovation, and creativity in your product development.

Download or read book Made by Taiwan written by Po-Lung Yu and published by World Scientific. This book was released on 2001 with total page 406 pages. Available in PDF, EPUB and Kindle. Book excerpt: Many nations and states have tried to build successful technological industries, but failed. Taiwan is an exception. Indeed, it is the third-largest production center for integrated circuits and personal computers. How has Taiwan made it, and how to do business successfully with Taiwan? This book aims to provide answers to those questions and to share the successful experience of Taiwan with others. If Taiwan could make it, then other nations, by learning from its experiences and patterns of development, can also make it, or even excel Taiwan. The book presents historical and analytical views covering most aspects of Taiwan''s development patterns, including innovations of management and technology, production and business infrastructures, capital and human resources, education and government policies, and competitive characteristics of people and cultures. Contents: Overview: The Development of Taiwan''s IC Industry: An Overview (C-Y Chang & P-L Yu); Management Innovation: The Three Vs of Global Competitiveness (H-L Li & J-J Shuai); Employee Profit Sharing and Stock Ownership Attracts World-Class Employees (A-P Chen & S-W Wang); IC/PC Industries: The Integrated Circuit Industry: A Technological Powerhouse (C V Trappey & H Chen); IC Foundries: A Booming Industry (M-C Wu); Taiwan''s IC Packaging Industry: A Local Success Story Goes International (P-L Chang & C-T Tsai); The Notebook Niche (J-H Huang); Desktop PCs: A Project Management Revolution (C Yang); Technical and Capital Innovation: Competing in the Knowledge Game: Intellectual Property Rights (S-J Liu); Investment: The Life Blood of Growth (C-Y Hung); Education and Government Policy: The Industrial Park: Government''s Gift to Industrial Development (P-L Chang & C-W Hsu); Intellectual Capital in the Information Industry (G-H Tzeng & M-Y Lee); Culture and People: Five Life Experiences That Shape Taiwan''s Character (P-L Yu & C-Y ChiangLin). Readership: Students and researchers in economics and business management, as well as business leaders and economic planners.

Download or read book Area Array Interconnection Handbook written by Karl J. Puttlitz and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 1250 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.

Download or read book Catching Up and Leapfrogging written by Xiao-Shan Yap and published by Taylor & Francis. This book was released on 2016-12-01 with total page 171 pages. Available in PDF, EPUB and Kindle. Book excerpt: Ever since Schumpeter’s groundbreaking work there has been a plethora of new research seeking to extend the direction and dynamics of innovation. Using a rich account of detailed interviews, this book offers new evidence on how latecomers have successfully caught up and leapfrogged incumbent firms. Catching Up and Leapfrogging: the new latecomers in the integrated circuits industry explores how technological transitions affect latecomer catch-up strategies, and vice versa, in a high technology industry. It looks to the East Asian latecomers who, towards the end of the twentieth century, pioneered a new pathway through organizational change by specializing in the key production stages of integrated circuits and pushing technologies further. This volume assesses how latecomer resource acquisition strategies have varied alongside structural industry changes and evaluates the mechanisms through which firms started life as technology followers and rose to become technology leaders. Xiao-Shan Yap and Rajah Rasiah present a unique story about how firm strategies evolve from the catching up phase to the leapfrogging phase, captured from the accounts of managers on the ground. It is the first time firm-level strategies have been systematically analysed to describe twenty-first century strategic management in the integrated circuits industry in particular, and the high tech industry in general. The evidence and analysis in this book offers insights for chief executive officers, policy-makers and researchers to revisit existing approaches to the theory of catching up and leapfrogging.

Download or read book Silicon Germanium Materials and Devices A Market and Technology Overview to 2006 written by R. Szweda and published by Elsevier. This book was released on 2002-11-26 with total page 419 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first edition of Silicon Germanium Materials & Devices - A Market & Technology Overview to 2006 examines the development of the silicon germanium business over a six-year period 2001 to 2006. It analyses the trends in markets, technologies and industry structure and profiles all the major players. It is specifically aimed at users and manufacturers of substrates, epiwafers, equipment and devices. The analysis includes a competitive assessment of the market of silicon germanium vs. gallium arsenide, indium phosphide vs. other forms of silicon. Silicon Germanium Materials & Devices - A Market & Technology Overview to 2006 is designed to assist with business plans, R&D and manufacturing strategies. It will be an indispensable aid for managers responsible for business development, technology assessment and market research. The report examines the rapid development of silicon germanium from an R&D curiosity to production status. An extensive treatment from materials through processes to devices and applications it encapsulates the entire silicon germanium business of today and assesses future directions. For a PDF version of the report please call Tina Enright on +44 (0) 1865 843008 for price details.

Download or read book Technology Development and Marketing written by Junmo Kim and published by AuthorHouse. This book was released on 2018-06-07 with total page 86 pages. Available in PDF, EPUB and Kindle. Book excerpt: Technology development needs a market. Since technology development is from supply side, it is always crucial to pay attention to the demand side of technology. Taking this notion as an underlying assumption, this book discusses a technology development case in the realm of microelectronic packaging technology based on a real case study of a three-year consecutive research and development program conducted in Korea with expandable implications for other contexts.

Download or read book Embedded and Fan Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces written by Beth Keser and published by John Wiley & Sons. This book was released on 2021-12-06 with total page 324 pages. Available in PDF, EPUB and Kindle. Book excerpt: Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research.

Download or read book Adhesives and Sealants written by David J. Dunn and published by iSmithers Rapra Publishing. This book was released on 2003 with total page 176 pages. Available in PDF, EPUB and Kindle. Book excerpt: This unique report covers both technical and market information on adhesives and sealants in one volume. It provides an excellent analysis of the state-of-the-art in the adhesives and sealants industry. The report covers global market data and focuses on Western Europe and North America, with additional information about the emerging markets in the Far East and Latin America.

Download or read book Proceedings of the Third International Symposium on Microstructures and Microfabricated Systems written by Peter J. Hesketh and published by The Electrochemical Society. This book was released on 1997 with total page 234 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book BoogarLists Directory of Electronics Technologies written by and published by BoogarLists. This book was released on with total page 107 pages. Available in PDF, EPUB and Kindle. Book excerpt: