Download or read book Finite Element Method in Oxidation Process Simulation written by Pantas Sutardja and published by . This book was released on 198? with total page 70 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Finite element Methods for Process Simulation Application to Silicon Oxidation written by Pantas Sutardja and published by . This book was released on 1988 with total page 378 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Modeling of Thermal Oxidation and Stress Effects written by Christian Hollauer and published by Sudwestdeutscher Verlag Fur Hochschulschriften AG. This book was released on 2009 with total page 176 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thermal Oxidation is one of the most important process steps in semiconductor fabrication to produce high quality isolation layers. A chemical reaction converts silicon into silicon dioxide which has more than twice of the original volume. This is the main source for stress and displacements in the oxidized structure. Stress in copper interconnects can be essential for the life time of an integrated circuit, because it can support material transport and lead to void formation. During the fabrication of sensors, where thin film deposition is often used, an intrinsic stress is generated in the layers which can cause unwanted deformation in free standing structures. After an introduction the author describes the advanced oxidation model and shows by means of pictures the verified simulation results. A highlight of this book is the chapter about the Finite Element Method (FEM) which is used to solve the mathematical formulation numerically. In a comprehensible way the author describes how to apply FEM in practice, so that the reader of this book should be able to discretize many other kinds of differential equations and solve them with a computer, which is basic for simulation.
Download or read book Moving Finite Element Method written by Maria do Carmo Coimbra and published by CRC Press. This book was released on 2016-11-30 with total page 195 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on process simulation in chemical engineering with a numerical algorithm based on the moving finite element method (MFEM). It offers new tools and approaches for modeling and simulating time-dependent problems with moving fronts and with moving boundaries described by time-dependent convection-reaction-diffusion partial differential equations in one or two-dimensional space domains. It provides a comprehensive account of the development of the moving finite element method, describing and analyzing the theoretical and practical aspects of the MFEM for models in 1D, 1D+1d, and 2D space domains. Mathematical models are universal, and the book reviews successful applications of MFEM to solve engineering problems. It covers a broad range of application algorithm to engineering problems, namely on separation and reaction processes presenting and discussing relevant numerical applications of the moving finite element method derived from real-world process simulations.
Download or read book Finite Element Analysis of the Start up Dynamics of a Deep well Oxidation Process written by Emmanuel Gelus and published by . This book was released on 1988 with total page 132 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Numerical Simulation of Fixed Bed O xylene Oxidation Using the P Version Least Squares Finite Element Method written by Krishnakumar Vijayaraghavan and published by . This book was released on 1994 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 3 Dimensional Process Simulation written by J. Lorenz and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 207 pages. Available in PDF, EPUB and Kindle. Book excerpt: Whereas two-dimensional semiconductor process simulation has achieved a certain degree of maturity, three-dimensional process simulation is a newly emerging field in which most efforts are dedicated to necessary basic developments. Research in this area is promoted by the growing demand to obtain reliable information on device geometries and dopant distributions needed for three-dimensional device simulation, and challenged by the great algorithmic problems caused by moving interfaces and by the requirement to limit computation times and memory requirements. A workshop (Erlangen, September 5, 1995) provided a forum to discuss the industrial needs, technical problems, and solutions being developed in the field of three-dimensional semiconductor process simulation. Invited presentations from leading semiconductor companies and research Centers of Excellence from Japan, the USA, and Europe outlined novel numerical algorithms, physical models, and applications in this rapidly emerging field.
Download or read book Metal Forming and the Finite element Method written by Shiro Kobayashi and published by Oxford University Press, USA. This book was released on 1989 with total page 398 pages. Available in PDF, EPUB and Kindle. Book excerpt: 1. Introduction. 2. Metal Forming Process. 3. Analysis and Technology in Metal Forming. 4. Plasticity and Viscoplasticity. 5. Methods of Analysis. 6. The Finite Element Method--Part I. 7. The Finite Element Method--Part II. 8. Plane-Strain Problems. 9. Axisymmetric Isothermal Forging. 10. Steady State Processes of Extrusion and Drawing. 11. Sheet Metal Forming. 12. Thermo-Viscoplastic Analysis. 13. Compaction and Forging of Porous Metals. 14. Three Dimensional Problems. 15. Preform Design in Metal Forming. 16. Solid Formulation, Comparison of Two Formulations, and Concluding Remarks.
Download or read book Mixed Finite Element Technologies written by Peter Wriggers and published by Springer Science & Business Media. This book was released on 2009-06-16 with total page 211 pages. Available in PDF, EPUB and Kindle. Book excerpt: Mixed finite element methods are a tool to solve complex engineering problems of different nature. This subject is treated in the volume from the engineering and the mathematical point. Different applications are considered which depict the value of mixed formulations in engineering on one side. On the other side the mathematical background is provided including proofs of convergence and stability of these methods and adequate solvers for mixed problems are discussed. This broad spectrum yields an indepth treatment of mixed methods from different perspectives.
Download or read book Finite Element Method with Applications in Engineering written by Y. M. Desai and published by Pearson Education India. This book was released on 2011 with total page 489 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book explains the finite element method with various engineering applications to help students, teachers, engineers and researchers. It explains mathematical modeling of engineering problems and approximate methods of analysis and different approaches
Download or read book The Finite Element Method written by G.R. Liu and published by Butterworth-Heinemann. This book was released on 2013-08-07 with total page 457 pages. Available in PDF, EPUB and Kindle. Book excerpt: Written for practicing engineers and students alike, this book emphasizes the role of finite element modeling and simulation in the engineering design process. It provides the necessary theories and techniques of the FEM in a concise and easy-to-understand format and applies the techniques to civil, mechanical, and aerospace problems. Updated throughout for current developments in FEM and FEM software, the book also includes case studies, diagrams, illustrations, and tables to help demonstrate the material. Plentiful diagrams, illustrations and tables demonstrate the material Covers modeling techniques that predict how components will operate and tolerate loads, stresses and strains in reality Full set of PowerPoint presentation slides that illustrate and support the book, available on a companion website
Download or read book Handbook of Semiconductor Manufacturing Technology written by Yoshio Nishi and published by CRC Press. This book was released on 2017-12-19 with total page 1720 pages. Available in PDF, EPUB and Kindle. Book excerpt: Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Download or read book ULSI Process Integration written by Cor L. Claeys and published by The Electrochemical Society. This book was released on 1999 with total page 408 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Silicon Oxidation Simulation written by Gabriel Matthew Cuka and published by . This book was released on 1990 with total page 186 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Process and Device Simulation for MOS VLSI Circuits written by P. Antognetti and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 632 pages. Available in PDF, EPUB and Kindle. Book excerpt: P. Antognetti University of Genova, Italy Director of the NATO ASI The key importance of VLSI circuits is shown by the national efforts in this field taking place in several countries at differ ent levels (government agencies, private industries, defense de partments). As a result of the evolution of IC technology over the past two decades, component complexi ty has increased from one single to over 400,000 transistor functions per chip. Low cost of such single chip systems is only possible by reducing design cost per function and avoiding cost penalties for design errors. Therefore, computer simulation tools, at all levels of the design process, have become an absolute necessity and a cornerstone in the VLSI era, particularly as experimental investigations are very time-consuming, often too expensive and sometimes not at all feasible. As minimum device dimensions shrink, the need to understand the fabrication process in a quanti tati ve way becomes critical. Fine patterns, thin oxide layers, polycristalline silicon interco~ nections, shallow junctions and threshold implants, each become more sensitive to process variations. Each of these technologies changes toward finer structures requires increased understanding of the process physics. In addition, the tighter requirements for process control make it imperative that sensitivities be unde~ stood and that optimation be used to minimize the effect of sta tistical fluctuations.
Download or read book Design and Development of Metal Forming Processes and Products Aided by Finite Element Simulation written by Ming Wang Fu and published by Springer. This book was released on 2016-10-22 with total page 258 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents state-of-the-art research on forming processes and formed metal product development aided by the Finite Element Method (FEM). Using extensive and informative illustrations, tables and photographs, it systematically presents real-life case studies and established findings regarding various forming processes and methods aided by FEM simulation, and addresses various issues related to metal formed part design, process determination, die design and die service life analysis and prolongation, as well as product quality assurance and improvement. Metal forming has been widely used in many industries. This traditional manufacturing process, however, has long been linked to many years of apprenticeship and skilled craftsmanship, and its conventional design and development paradigm appeared to involve more know-how and trial-and-error than in-depth scientific calculation, analysis and simulation. The design paradigm for forming processes and metal formed product development thus cannot meet the current demands for short development lead-times, low production costs and high product quality. With the advent of numerical simulation technologies, the design and development of forming processes and metal formed products are carried out with the aid of FEM simulation, allowing all the potential design spaces to be identified and evaluated, and the best design to ultimately be determined and implemented. Such a design and development paradigm aims at ensuring “designing right the first time” and reducing the need for trial-and-error in the workshop. This book provides postgraduates, manufacturing engineers and professionals in this field with an in-depth understanding of the design process and sufficient knowledge to support metal formed part design, forming process determination, tooling design, and product quality assurance and control via FEM simulation. “/p>
Download or read book Technology CAD Systems written by Franz Fasching and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 313 pages. Available in PDF, EPUB and Kindle. Book excerpt: As the cost of developing new semiconductor technology at ever higher bit/gate densities continues to grow, the value of using accurate TCAD simu lation tools for design and development becomes more and more of a necessity to compete in today's business. The ability to tradeoff wafer starts in an advanced piloting facility for simulation analysis and optimization utilizing a "virtual fab" S/W tool set is a clear economical asset for any semiconductor development company. Consequently, development of more sophisticated, accurate, physics-based, and easy-to-use device and process modeling tools will receive continuing attention over the coming years. The cost of maintaining and paying for one's own internal modeling tool development effort, however, has caused many semiconductor development companies to consider replacing some or all of their internal tool development effort with the purchase of vendor modeling tools. While some (noteably larger) companies have insisted on maintaining their own internal modeling tool development organization, others have elected to depend totally on the tools offered by the TCAD vendors and have consequently reduced their mod eling staffs to a bare minimal support function. Others are seeking to combine the best of their internally developed tool suite with "robust", "proven" tools provided by the vendors, hoping to achieve a certain synergy as well as savings through this approach. In the following sections we describe IBM's internally developed suite of TCAD modeling tools and show several applications of the use of these tools.
