Download or read book Final Report on Manufacturing Methods for Metallized Teflon Capacitors subminiature 200C written by Douglas H. Smith and published by . This book was released on 1963 with total page 92 pages. Available in PDF, EPUB and Kindle. Book excerpt: Metal-encased, tubular, hermetically sealed, metallized teflon capacitors which reduce the volume per microfarad of capacitance up to one fourth that of conventional teflon dielectric foil capacitors can be fabricated on a production basis. These capacitors are designed to operate over a temperature range of -65 C to 200 C and are capable of withstanding the severe environmental conditions. Available winding machines were modified for the winding of thin teflon film because of the films tendency to distort in both width and thickness when not held under constant or controlled tension. These modifications were all directed toward the exertion of constant tension on the winding material thereby alleviating major winding problems. The composite-type construction employing one aluminum metallized teflon electrode and one standard aluminum foil electrode was used in the construction of the capacitors. Lead attachments were made by spraying the ends of the capacitor with a high temperature aluminum solder. The capacitors fabricated using multiple layers of material were satisfactory upon completion of load life testing for a period of 1000 hrs with a 140% of rated voltage at a temperature of 200 C. However, the capacitors fabricated with single layer material failed the 1000-hr load life test because numerous momentary breakdowns weakened or destroyed the connections between the sprayed and connections and electrodes.
Download or read book MANUFACTURING METHODS FOR METALLIZED TEFLON CAPACITORS SUBMINIATURE 200 C written by and published by . This book was released on 1963 with total page 98 pages. Available in PDF, EPUB and Kindle. Book excerpt: Metal-encased, tubular, hermetically sealed, metallized teflon capacitors which reduce the volume per microfarad of capacitance up to one fourth that of conventional teflon dielectric foil capacitors can be fabricated on a production basis. These capacitors are designed to operate over a temperature range of -65 C to 200 C and are capable of withstanding the severe environmental conditions. Available winding machines were modified for the winding of thin teflon film because of the films tendency to distort in both width and thickness when not held under constant or controlled tension. These modifications were all directed toward the exertion of constant tension on the winding material thereby alleviating major winding problems. The composite-type construction employing one aluminum metallized teflon electrode and one standard aluminum foil electrode was used in the construction of the capacitors. Lead attachments were made by spraying the ends of the capacitor with a high temperature aluminum solder. The capacitors fabricated using multiple layers of material were satisfactory upon completion of load life testing for a period of 1000 hrs with a 140% of rated voltage at a temperature of 200 C. However, the capacitors fabricated with single layer material failed the 1000-hr load life test because numerous momentary breakdowns weakened or destroyed the connections between the sprayed and connections and electrodes.
Download or read book U S Government Research Reports written by and published by . This book was released on 1963 with total page 630 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book U S Government Research Reports written by and published by . This book was released on 1963 with total page 1322 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Technical Abstract Bulletin written by Defense Documentation Center (U.S.) and published by . This book was released on 1964 with total page 1148 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Bibliography of Scientific and Industrial Reports written by and published by . This book was released on 1964-10 with total page 1336 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book OTS Selective Bibliography written by United States. Dept. of Commerce. Office of Technical Services and published by . This book was released on with total page 556 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Keywords Index to U S Government Technical Reports written by and published by . This book was released on 1963-04 with total page 72 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Finishing Abstracts written by and published by . This book was released on 1963 with total page 638 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Materials and Processes written by Barrie D. Dunn and published by Springer. This book was released on 2015-12-29 with total page 677 pages. Available in PDF, EPUB and Kindle. Book excerpt: The objective of this book is to assist scientists and engineers select the ideal material or manufacturing process for particular applications; these could cover a wide range of fields, from light-weight structures to electronic hardware. The book will help in problem solving as it also presents more than 100 case studies and failure investigations from the space sector that can, by analogy, be applied to other industries. Difficult-to-find material data is included for reference. The sciences of metallic (primarily) and organic materials presented throughout the book demonstrate how they can be applied as an integral part of spacecraft product assurance schemes, which involve quality, material and processes evaluations, and the selection of mechanical and component parts. In this successor edition, which has been revised and updated, engineering problems associated with critical spacecraft hardware and the space environment are highlighted by over 500 illustrations including micrographs and fractographs. Space hardware captured by astronauts and returned to Earth from long durations in space are examined. Information detailed in the Handbook is applicable to general terrestrial applications including consumer electronics as well as high reliability systems associated with aeronautics, medical equipment and ground transportation. This Handbook is also directed to those involved in maximizing the relia bility of new materials and processes for space technology and space engineering. It will be invaluable to engineers concerned with the construction of advanced structures or mechanical and electronic sub-systems.
Download or read book Electronic Design written by and published by . This book was released on 1957 with total page 868 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Automation written by and published by . This book was released on 1955 with total page 1324 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Materials written by Michael F. Ashby and published by Butterworth-Heinemann. This book was released on 2013-10-09 with total page 899 pages. Available in PDF, EPUB and Kindle. Book excerpt: Materials, Third Edition, is the essential materials engineering text and resource for students developing skills and understanding of materials properties and selection for engineering applications. This new edition retains its design-led focus and strong emphasis on visual communication while expanding its inclusion of the underlying science of materials to fully meet the needs of instructors teaching an introductory course in materials. A design-led approach motivates and engages students in the study of materials science and engineering through real-life case studies and illustrative applications. Highly visual full color graphics facilitate understanding of materials concepts and properties. For instructors, a solutions manual, lecture slides, online image bank, and materials selection charts for use in class handouts or lecture presentations are available at http://textbooks.elsevier.com. The number of worked examples has been increased by 50% while the number of standard end-of-chapter exercises in the text has been doubled. Coverage of materials and the environment has been updated with a new section on Sustainability and Sustainable Technology. The text meets the curriculum needs of a wide variety of courses in the materials and design field, including introduction to materials science and engineering, engineering materials, materials selection and processing, and materials in design. - Design-led approach motivates and engages students in the study of materials science and engineering through real-life case studies and illustrative applications - Highly visual full color graphics facilitate understanding of materials concepts and properties - Chapters on materials selection and design are integrated with chapters on materials fundamentals, enabling students to see how specific fundamentals can be important to the design process - For instructors, a solutions manual, lecture slides, online image bank and materials selection charts for use in class handouts or lecture presentations are available at http://textbooks.elsevier.com - Links with the Cambridge Engineering Selector (CES EduPack), the powerful materials selection software. See www.grantadesign.com for information NEW TO THIS EDITION: - Text and figures have been revised and updated throughout - The number of worked examples has been increased by 50% - The number of standard end-of-chapter exercises in the text has been doubled - Coverage of materials and the environment has been updated with a new section on Sustainability and Sustainable Technology
Download or read book Electrical Manufacturing written by and published by . This book was released on 1958 with total page 1838 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Product Engineering written by and published by . This book was released on 1961 with total page 1360 pages. Available in PDF, EPUB and Kindle. Book excerpt: Vol. for 1955 includes an issue with title Product design handbook issue; 1956, Product design digest issue; 1957, Design digest issue.
Download or read book Nonmetallic Materials and Composites at Low Temperature written by G. Hartwig and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt: This, the second special topical conference on the properties of Non-Metallic Materials at Low Temperatures, was sponsored by the International Cryogenic Materials Conference Board. The potential for plastics materials in the field of cryogenics is vast and as yet only partly explored. In addition, many other materials, which qualify for the title non-metallic but are not 'plastics', have numerous possible outlets in low temperature technology. This conference aimed at providing a forum, whereby specialists from Industry, the Universities and from Government sponsored Institutions could assemble to discuss the extent of our current knowledge. As it transpired, the meeting was also to high light the considerable gaps that still exist in our fundamental understanding of the low temperature behaviour of these materials. On this theme, during the course of the conference, a reference was made to an almost forgotten quotation by Lord Kelvin, who said: "When you cannot measure what you are speaking about, when you cannot express in numbers, your knowledge is of a meagre and unsatisfactory kind; it may be the beginning of knowledge, but you have scarcely in your thoughts advanced to the stage of a science, whatever the matter be." This simple statement sums up the aims, objectives and hopefully the achievements of this conference. To discuss and disseminate the current knowledge on non-metallic materials in order that realistic predictions of in-service performance may be made.
Download or read book Wafer Bonding written by Marin Alexe and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 510 pages. Available in PDF, EPUB and Kindle. Book excerpt: The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
