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Book MEMS Pressure Sensors Fabrication and Process Optimization

Download or read book MEMS Pressure Sensors Fabrication and Process Optimization written by Parvej Ahmad Alvi and published by Lulu.com. This book was released on 2014-07-14 with total page 176 pages. Available in PDF, EPUB and Kindle. Book excerpt: MEMS Pressure Sensors: Fabrication and Process Optimization - describs the step by step fabrication process sequence along with flow chart for fabrication of micro pressure sensors taking into account various aspects of fabrication and designing of the pressure sensors as well as fabrication process optimization. A complete experimental detail before and after each step of fabrication of the sensor has also been discussed. This leads to the uniqueness of the book. MEMS Pressure Sensors: Fabrication and Process Optimization will greatly benefit undergraduate and postgraduate students of MEMS and NEMS courses. Process engineers and technologists in the microelectronics industry including MEMS-based sensors manufacturers.

Book Design and Fabrication of an Optical Pressure Micro Sensor for Skin Mechanics Studies

Download or read book Design and Fabrication of an Optical Pressure Micro Sensor for Skin Mechanics Studies written by Siddarth Kumar and published by . This book was released on 2006 with total page 178 pages. Available in PDF, EPUB and Kindle. Book excerpt: (Cont.) The entire device is fabricated bottom up on a silicon wafer using soft lithography techniques and the textured pattern is imprinted onto the PDMS using photolithography techniques. This flexible pressure sensor is designed to be used on the fingerpad skin to determine the pressure distribution due to incident loads. The sensor is placed between the OCT head and the finger pad to be imaged. The OCT head (along with the indenter) acts as the mechanical stimulus and is used to indent the finger pad. As a result of this stimulus, the human skin along with the pressure sensor gets deformed and both these deformations are picked up by the OCT image. The deflection between the two bands of patterns is used to estimate the stress at the pressure sensor and skin interface through the development of a continuum mechanics model which is also developed and introduced in this thesis. The manufactured device is tested and calibrated for use with the fingerpad.

Book Integrated Smart Sensors

Download or read book Integrated Smart Sensors written by Gert van der Horn and published by Springer. This book was released on 2012-11-28 with total page 202 pages. Available in PDF, EPUB and Kindle. Book excerpt: 1 1. 1 Introduction The (signal processing and storage) capacity ofthe human brain enables us to become powerful autonomous beings, but only if our brains operate in conjunction with (at least some of) our senses and muscles. Using these organs, we can interact with our environment, learn to adapt, and improve important aspects of our life. Similarly, the signal processing capabilities of modern electronics (computers) could be combined with electronic sensors and actuators to enable interaction with, and adaptation to, the (non-electrical) environment. This willlead to smarter and more powerful automated tools and machines. To facilitate and stimulate such a development, easy-to-use low-cost sensors are needed. The combination of electronic interface functions and a sensor in an integrated smart sensor, that provides a standard, digital, and bus-compatible output, would simplify the connection of sensors to standard electronic signal processors (microcontrollers, computers, etc. ). Currently, the calibration procedure, required for standardization of the sensor output signal level, contributes largely to the production costs of accurate sensors. To enable automation of the calibration procedure, and hence reduce the sensor fabrication costs, a digital calibrationjunction should be included in the smart sensor. INTEGRATED SMART SENSORS: Design and Calibration Introduction 1. 2 Sensors and actuators In industry many processes are electronically controlled. As depicted in Fig.

Book Master s Theses Directories

Download or read book Master s Theses Directories written by and published by . This book was released on 2007 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Education, arts and social sciences, natural and technical sciences in the United States and Canada".

Book Design and Fabrication of a MEMS Passive Pressure Sensor

Download or read book Design and Fabrication of a MEMS Passive Pressure Sensor written by Penglai Li and published by . This book was released on 2006 with total page 98 pages. Available in PDF, EPUB and Kindle. Book excerpt: Micro-ElectroMechanical Systems is an inter-disciplinary technology field that has seen considerable growth over the years. It utilizes conventional semiconductor fabrication process flow as well as novel micro-fabrication techniques to create highly integrated ElectroMechanical systems such as sensors, actuators, switches, pumps and other devices with a wide range of industrial applications. By providing the capability of creating System-On-A-Chip, MEMS technology offers the prospect of highly sophisticated and integrated systems that are very low cost. The purpose of this project is to design, fabricate, and test a MEMS based, passive pressure sensor as a proof of concept targeted at possible remote sensing applications. For the targeted applications, purely passive sensor is a better alternative to sensors involving active circuitry, since it removes much of the design complexities from the sensor, and no battery is needed. Information such as technology selection, analysis of the sensor's response to pressure, and detailed fabrication process flow will be presented. Results from laboratory testing will also be presented.

Book Hyper sensitive MEMS Pressure Sensor Array for Microscale Bubble Pressure Measurement

Download or read book Hyper sensitive MEMS Pressure Sensor Array for Microscale Bubble Pressure Measurement written by Yash Rajan Rasaikar and published by . This book was released on 2022 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: "As technology is advancing, more complex, efficient, and powerful devices are being made. These powerful devices generate a lot of heat which needs to be taken out to maximize their performance. Hence, efforts are being made to improve cooling techniques for these devices. Boiling is one such technique used in the cooling of devices. The heat transfer performance in the flow boiling systems is higher than that in pool boiling systems. With a simple add-on tapered manifold over a plain surface, we can convert pool boiling to flow boiling. This study will lead to improved performance and reliability of microelectronic devices, supercomputers, server chips, etc. The forces from bubbles growing can provide a pumpless, self-sustained unidirectional flow effectively transforming pool boiling into the extremely efficient flow boiling, resulting in energy savings. MEMS pressure sensor array will be mounted at the end of tapered manifold to map the pressure field around a nucleating bubble. The thesis describes the design, fabrication, packaging, and testing of a bulk micromachined sensor array that is capable of monitoring the pressure progression of a bubble. The sensor utilizes an extremely thin 225 nm square Si3N4 diaphragm which is produced by etching away the bulk silicon with XeF2 through holes present in the diaphragm. A unique process flow was developed to achieve the diaphragm thickness in nanometers. Four polysilicon piezoresistors, mounted on the surface of the diaphragm, where the stress is maximum, are used by the sensor. The thesis also discusses the results obtained from the response of the fabricated sensor. Various attempts were made to get a voltage output in response to applied pressure. These values were acquired over a number of experiments repeated at similar experimental conditions to demonstrate the repeatability of the calibration data. The value of sensitivity, derived from the slope of the linear calibration plot of Vout (V) vs. Pressure (Pa), is 5.26 [micro]V/Pa, which is very close to the required target hyper-sensitivity of 5 [micro]V/Pa."--Abstract.

Book Integrated Smart Sensors

Download or read book Integrated Smart Sensors written by Gert van der Horn and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 210 pages. Available in PDF, EPUB and Kindle. Book excerpt: 1 1. 1 Introduction The (signal processing and storage) capacity ofthe human brain enables us to become powerful autonomous beings, but only if our brains operate in conjunction with (at least some of) our senses and muscles. Using these organs, we can interact with our environment, learn to adapt, and improve important aspects of our life. Similarly, the signal processing capabilities of modern electronics (computers) could be combined with electronic sensors and actuators to enable interaction with, and adaptation to, the (non-electrical) environment. This willlead to smarter and more powerful automated tools and machines. To facilitate and stimulate such a development, easy-to-use low-cost sensors are needed. The combination of electronic interface functions and a sensor in an integrated smart sensor, that provides a standard, digital, and bus-compatible output, would simplify the connection of sensors to standard electronic signal processors (microcontrollers, computers, etc. ). Currently, the calibration procedure, required for standardization of the sensor output signal level, contributes largely to the production costs of accurate sensors. To enable automation of the calibration procedure, and hence reduce the sensor fabrication costs, a digital calibrationjunction should be included in the smart sensor. INTEGRATED SMART SENSORS: Design and Calibration Introduction 1. 2 Sensors and actuators In industry many processes are electronically controlled. As depicted in Fig.

Book Design Fabrication and Characterization of Bulk type MEMS High Pressure Sensor

Download or read book Design Fabrication and Characterization of Bulk type MEMS High Pressure Sensor written by Elena Yin Ling Chan and published by . This book was released on 2018 with total page 53 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Proceedings of the 2022 International Conference on Smart Manufacturing and Material Processing SMMP2022

Download or read book Proceedings of the 2022 International Conference on Smart Manufacturing and Material Processing SMMP2022 written by A. Nayyar and published by IOS Press. This book was released on 2022-11-29 with total page 278 pages. Available in PDF, EPUB and Kindle. Book excerpt: Smart manufacturing is a broad category of manufacturing that employs computer-integration, high levels of adaptability and rapid design changes, together with digital information technology and a technically-trained workforce. This book presents the proceedings of SMMP2022, the 2022 International Conference on Smart Manufacturing and Material Processing, held on 12 and 13 August 2022 as a virtual event due to continuing restrictions related to the COVID-19 pandemic, and hosted from Shanghai, China. The conference provides a platform for researchers and scientists from smart manufacturing and material sciences to come together with researchers from various other application areas to discuss problems and solutions, identify new issues, and shape future directions for research. The conference received 60 submissions. These were submitted to a rigorous peer review process by a committee of experts from various disciplines, after which, 23 were accepted for presentation at the conference and publication here. The topics covered include materials processing and product manufacture, sensors and smart material systems, functional materials, industrial automation and process control, and discussion of the state-of-the-art and future direction of smart manufacturing and material sciences. Providing an overview of current developments in smart manufacturing and material processing, the book will be of interest to all those working in the field.

Book Integration of Electronic and Optical Techniques in the Design and Fabrication of Pressure Sensors

Download or read book Integration of Electronic and Optical Techniques in the Design and Fabrication of Pressure Sensors written by Ivan Padron and published by . This book was released on 2010 with total page 140 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since the introduction of micro-electro-mechanical systems fabrication methods, piezoresistive pressure sensors have become the more popular pressure transducers. They dominate pressure sensor commercialization due to their high performance, stability and repeatability. However, increasing demand for harsh environment sensing devices has made sensors based on Fabry-Perot interferometry the more promising optical pressure sensors due to their high degree of sensitivity, small size, high temperature performance, versatility, and improved immunity to environmental noise and interference. The work presented in this dissertation comprises the design, fabrication, and testing of sensors that fuse these two pressure sensing technologies into one integrated unit. A key innovation is introduction of a silicon diaphragm with a center rigid body (or boss), denoted as an embossed diaphragm, that acts as the sensing element for both the electronic and optical parts of the sensor. Physical principles of piezoresistivity and Fabry-Perot interferometry were applied in designing an integrated sensor and in determining analytic models for the respective electronic and optical outputs. Several test pressure sensors were produced and their performance was evaluated by collecting response and noise data. Diaphragm deflection under applied pressure was detected electronically using the principle of piezoresistivity and optically using Fabry-Perot interferometry. The electronic part of the sensor contained four p-type silicon piezoresistors that were set into the diaphragm. They were connected in a Wheatstone bridge configuration for detecting strain-dependent changes in resistance induced by diaphragm deflection. In the optical part of the sensor, an optical cavity was formed between the embossed surface of the diaphragm and the end face of a single mode optical fiber. An infrared laser operating at 1.55 was used for optical excitation. Deflection of the diaphragm, which causes the length of the optical cavity to change, was detected by Fabry-Perot interference in the reflected light. Data collected on several sensors fabricated for this dissertation were shown to validate the theoretical models. In particular, the principle of operation of a Fabry-Perot interferometer as a mechanism for pressure sensing was demonstrated. The physical characteristics and behavior of the embossed diaphragm facilitated the integration of the electronic and optical approaches because the embossed diaphragm remained flat under diaphragm deflection. Consequently, it made the electronic sensor respond more linearly to applied pressure. Further, it eliminated a fundamental deficiency of previous applications of Fabry-Perot methods, which suffered from non-parallelism between the two cavity surfaces (diaphragm and fiber), owing to diaphragm curvature after pressure was applied. It also permitted the sensor to be less sensitive to lateral misalignment during the fabrication process and considerably reduced back pressure, which otherwise reduced the sensitivity of the sensor. As an integrated sensor, it offered two independent outputs in one sensor and therefore the capability for measurements of: (a) static and dynamic pressures simultaneously, and (b) two different physical quantities such as temperature and pressure.

Book Novel MEMS Pressure and Temperature Sensors Fabricated on Optical Fibers

Download or read book Novel MEMS Pressure and Temperature Sensors Fabricated on Optical Fibers written by and published by . This book was released on 2001 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: This thesis presents the design, fabrication, and testing of novel MEMS pressure and temperature sensors fabricated on optical fiber end faces. A simple micromachining process compatible with MEMS was developed in fabricating sensors directly on optical fibers. The pressure sensor configuration involves anodic bonding of a piece of an extremely thin silicon wafer onto the fiber end face over a cavity etched in the central portion of the fiber end face. Final device diameter is thus the same as that of the optical fiber. The temperature sensor is based on anodically bonding a thin piece of silicon onto the fiber end face. The pressure sensors were fabricated on 400 um diameter fibers while temperature sensors were fabricated on both 200 and 400 um diameter fibers. Pressure measurements were made over the 14 to 80 psi range while temperature measurements were made over the 23 to 300 Celcius range. Pressure sensor sensitivities of 0.1 mV/psi and 0.2 mV/psi were obtained. The pressure sensors were designed with cavity diameter d=150 um, and cavity depth h=0.640 um. Diaphragm thickness for the two sensors were t=7.1, and t=3.4 um. Higher sensitivity was achieved by design of a sensor with the thinner diaphragm. A sensor array fabrication effort demonstrated that our micromachining process could be extended to simultaneous processing of an array of fibers. The temperature sensor was fabricated by bonding 3.1 um thick silicon onto the fiber end face. An oxidant-resistant encapsulation scheme for the temperature sensor was proposed, namely aluminum coated silicon nitride (Al/Si3N4). The uncoated side of silicon was bonded to a fiber end face using the anodic bonding method. The measured values of kf=(lambda)-1x(dlambda/dT) for capped and uncapped sensors were kf=(7.5ł0.6)x10-5/Celcius, and kf=(7.2ł0.1)x10-5/Celcius respectively. The measured kf value for the uncapped sensor is equal to that which was determined using the published material properties for crystalline silicon (kf=7.9x10-5/Celcius) within measurement uncertainty. The micromachining process developed for micromachining fiber end faces along with the bonding of silicon to fiber end faces can be extended to fabrication of other MEMS based micro-optic devices where fiber optic interrogation is advantageous.