Download or read book Extended Abstracts of the Conference on Solid State Devices and Materials written by and published by . This book was released on 1984 with total page 748 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings of the Tenth International Conference on Chemical Vapor Deposition 1987 written by Electrochemical Society. High Temperature Materials Division and published by . This book was released on 1987 with total page 1296 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Brainware written by Tsutomu Miki and published by World Scientific. This book was released on 2001 with total page 245 pages. Available in PDF, EPUB and Kindle. Book excerpt: The human brain, the ultimate intelligent processor, can handle ambiguous and uncertain information adequately. The implementation of such a human-brain architecture and function is called OC brainwareOCO. Brainware is a candidate for the new tool that will realize a human-friendly computer society. As one of the LSI implementations of brainware, a OC bio-inspiredOCO hardware system is discussed in this book. Consisting of eight enriched versions of papers selected from IIZUKA ''98, this volume provides wide coverage, from neuronal function devices to vision systems, chaotic systems, and also an effective design methodology of hierarchical large-scale neural systems inspired by neuroscience. It can serve as a reference for graduate students and researchers working in the field of brainware. It is also a source of inspiration for research towards the realization of a silicon brain. Contents: Neuron MOS Transistor: The Concept and Its Application (T Shibata); Adaptive Learning Neuron Integrated Circuits Using Ferroelectric-Gate FETs (S-M Yoon et al.); An AnalogOCoDigital Merged Circuit Architecture Using PWM Techniques for Bio-Inspired Nonlinear Dynamical Systems (T Morie et al.); Application-Driven Design of Bio-Inspired Low-Power Vision Circuits and Systems (A KAnig et al.); Motion Detection with Bio-Inspired Analog MOS Circuits (H Yonezu et al.); cents MOS Cellular-Automaton Circuit for Picture Processing (M Ikebe & Y Amemiya); Semiconductor Chaos-Generating Elements of Simple Structure and Their Integration (K Hoh et al.); Computation in Single Neuron with Dendritic Trees (N Katayama et al.). Readership: Graduate students, researchers and industrialists in artificial intelligence, neural networks, machine perception, computer vision, pattern/handwriting recognition, image analysis and biocomputing."
Download or read book Scientific Bulletin written by and published by . This book was released on 1987 with total page 528 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book ONR Far East Scientific Bulletin written by and published by . This book was released on 1987 with total page 536 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Nanostructures and Quantum Effects written by H. Sakaki and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nanostructures and Quantum Effects documents the most recent developments in the field of quantum effects in semiconductor nanostructures such as quantum wires and boxes. Interrelated topics such as quantum interference, low-dimensional electron transport, single-electron and microcavity effects, electron holography, and quantum measurements together with the most recent progress in epitaxial growth of nanostructures and the manipulation of atoms using STM-related approaches are covered.
Download or read book Semiconductor Devices and Technologies for Future Ultra Low Power Electronics written by D. Nirmal and published by CRC Press. This book was released on 2021-12-10 with total page 303 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers the fundamentals and significance of 2-D materials and related semiconductor transistor technologies for the next-generation ultra low power applications. It provides comprehensive coverage on advanced low power transistors such as NCFETs, FinFETs, TFETs, and flexible transistors for future ultra low power applications owing to their better subthreshold swing and scalability. In addition, the text examines the use of field-effect transistors for biosensing applications and covers design considerations and compact modeling of advanced low power transistors such as NCFETs, FinFETs, and TFETs. TCAD simulation examples are also provided. FEATURES Discusses the latest updates in the field of ultra low power semiconductor transistors Provides both experimental and analytical solutions for TFETs and NCFETs Presents synthesis and fabrication processes for FinFETs Reviews details on 2-D materials and 2-D transistors Explores the application of FETs for biosensing in the healthcare field This book is aimed at researchers, professionals, and graduate students in electrical engineering, electronics and communication engineering, electron devices, nanoelectronics and nanotechnology, microelectronics, and solid-state circuits.
Download or read book Handbook of Semiconductor Manufacturing Technology written by Yoshio Nishi and published by CRC Press. This book was released on 2017-12-19 with total page 3276 pages. Available in PDF, EPUB and Kindle. Book excerpt: Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Download or read book Nanoscale Silicon Devices written by Shunri Oda and published by CRC Press. This book was released on 2018-09-03 with total page 288 pages. Available in PDF, EPUB and Kindle. Book excerpt: Is Bigger Always Better? Explore the Behavior of Very Small Devices as Described by Quantum Mechanics Smaller is better when it comes to the semiconductor transistor. Nanoscale Silicon Devices examines the growth of semiconductor device miniaturization and related advances in material, device, circuit, and system design, and highlights the use of device scaling within the semiconductor industry. Device scaling, the practice of continuously scaling down the size of metal-oxide-semiconductor field-effect transistors (MOSFETs), has significantly improved the performance of small computers, mobile phones, and similar devices. The practice has resulted in smaller delay time and higher device density in a chip without an increase in power consumption. This book covers recent advancements and considers the future prospects of nanoscale silicon (Si) devices. It provides an introduction to new concepts (including variability in scaled MOSFETs, thermal effects, spintronics-based nonvolatile computing systems, spin-based qubits, magnetoelectric devices, NEMS devices, tunnel FETs, dopant engineering, and single-electron transfer), new materials (such as high-k dielectrics and germanium), and new device structures in three dimensions. It covers the fundamentals of such devices, describes the physics and modeling of these devices, and advocates further device scaling and minimization of energy consumption in future large-scale integrated circuits (VLSI). Additional coverage includes: Physics of nm scaled devices in terms of quantum mechanics Advanced 3D transistors: tri-gate structure and thermal effects Variability in scaled MOSFET Spintronics on Si platform NEMS devices for switching, memory, and sensor applications The concept of ballistic transport The present status of the transistor variability and more An indispensable resource, Nanoscale Silicon Devices serves device engineers and academic researchers (including graduate students) in the fields of electron devices, solid-state physics, and nanotechnology.
Download or read book Proceedings of the Fifth International Symposium on Cleaning Technology in Semiconductor Device Manufacturing written by Jerzy Rużyłło and published by The Electrochemical Society. This book was released on 1998 with total page 668 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Handbook of Nanophysics written by Klaus D. Sattler and published by CRC Press. This book was released on 2010-09-17 with total page 782 pages. Available in PDF, EPUB and Kindle. Book excerpt: Many bottom-up and top-down techniques for nanomaterial and nanostructure generation have enabled the development of applications in nanoelectronics and nanophotonics. Handbook of Nanophysics: Nanoelectronics and Nanophotonics explores important recent applications of nanophysics in the areas of electronics and photonics. Each peer-reviewed c
Download or read book High speed Optical Transceivers Integrated Circuits Designs And Optical Devices Techniques written by Yuyu Liu and published by World Scientific. This book was released on 2006-03-09 with total page 242 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explores the unique advantages and large inherent transmission capacity of optical fiber communication systems. The long-term and high-risk research challenges of optical transceivers are analyzed with a view to sustaining the seemingly insatiable demand for bandwidth. A broad coverage of topics relating to the design of high-speed optical devices and integrated circuits, oriented to low power, low cost, and small area, is discussed.Written by specialists with many years of research and engineering experience in the field of optical fiber communication, this book is essential for an audience dedicated to the development of integrated electronic systems for optical communication applications. It can also be used as a supplementary text for graduate courses on optical transceiver IC design.
Download or read book Reduced Thermal Processing for ULSI written by R.A. Levy and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 444 pages. Available in PDF, EPUB and Kindle. Book excerpt: As feature dimensions of integrated circuits shrink, the associated geometrical constraints on junction depth impose severe restrictions on the thermal budget for processing such devices. Furthermore, due to the relatively low melting point of the first aluminum metallization level, such restrictions extend to the fabrication of multilevel structures that are now essential in increasing packing density of interconnect lines. The fabrication of ultra large scale integrated (ULSI) devices under thermal budget restrictions requires the reassessment of existing and the development of new microelectronic materials and processes. This book addresses three broad but interrelated areas. The first area focuses on the subject of rapid thermal processing (RTP), a technology that allows minimization of processing time while relaxing the constraints on high temperature. Initially developed to limit dopant redistribution, current applications of RTP are shown here to encompass annealing, oxidation, nitridation, silicidation, glass reflow, and contact sintering. In a second but complementary area, advances in equipment design and performance of rapid thermal processing equipment are presented in conjunction with associated issues of temperature measurement and control. Defect mechanisms are assessed together with the resulting properties of rapidly deposited and processed films. The concept of RTP integration for a full CMOS device process is also examined together with its impact on device characteristics.
Download or read book Scientific Wet Process Technology for Innovative LSI FPD Manufacturing written by Tadahiro Ohmi and published by CRC Press. This book was released on 2018-10-03 with total page 402 pages. Available in PDF, EPUB and Kindle. Book excerpt: As science pushes closer toward the atomic size scale, new challenges arise to slow the pace of the miniaturization that has transformed our society and fueled the information age. New technologies are necessary to surpass these obstacles and realize the tremendous growth predicted by Moore's law. Assembled from the works of pioneering researchers, Scientific Wet Process Technology for Innovative LSI/FPD Manufacturing presents new developments and technologies for producing the next generation of electronic circuits and displays. This book introduces radical-reaction-based semiconductor manufacturing technologies that overcome the limitations of the existing molecule-reaction-based technologies. It systematically details the procedures and underlying concepts involved in wet process technologies and applications. Following an introduction to semiconductor surface chemical electronics, expert contributors discuss the principles and technology of high-performance wet cleaning; etching technologies and processes; antistatic technology; wet vapor resist stripping technology; and process and safety technologies including waste reclamation, chemical composition control, and ultrapure water and liquid chemical supply systems and materials for fluctuation-free facilities. Currently, large production runs are needed to balance the costs of acquiring and tuning equipment for specialized operating conditions. Scientific Wet Process Technology for Innovative LSI/FPD Manufacturing explains the technologies and processes used to meet the demand for variety and low volumes that exists in today's digital electronics marketplace.
Download or read book Handbook of 3D Integration Volume 1 written by Philip Garrou and published by John Wiley & Sons. This book was released on 2011-09-22 with total page 798 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
Download or read book Silicon Germanium and Their Alloys written by Gudrun Kissinger and published by CRC Press. This book was released on 2014-12-09 with total page 436 pages. Available in PDF, EPUB and Kindle. Book excerpt: Despite the vast knowledge accumulated on silicon, germanium, and their alloys, these materials still demand research, eminently in view of the improvement of knowledge on silicon–germanium alloys and the potentialities of silicon as a substrate for high-efficiency solar cells and for compound semiconductors and the ongoing development of nanodevices based on nanowires and nanodots. Silicon, Germanium, and Their Alloys: Growth, Defects, Impurities, and Nanocrystals covers the entire spectrum of R&D activities in silicon, germanium, and their alloys, presenting the latest achievements in the field of crystal growth, point defects, extended defects, and impurities of silicon and germanium nanocrystals. World-recognized experts are the authors of the book’s chapters, which span bulk, thin film, and nanostructured materials growth and characterization problems, theoretical modeling, crystal defects, diffusion, and issues of key applicative value, including chemical etching as a defect delineation technique, the spectroscopic analysis of impurities, and the use of devices as tools for the measurement of materials quality.
Download or read book Handbook for Cleaning for Semiconductor Manufacturing written by Karen A. Reinhardt and published by John Wiley & Sons. This book was released on 2011-04-12 with total page 596 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides an In-depth discussion of surface conditioning for semiconductor applications The Handbook of Cleaning for Semiconductor Manufacturing: Fundamentals and Applications provides an in-depth discussion of surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet processing is reviewed as well as surface and colloidal aspects of cleaning and etching. Topics covered in this new reference include: Front end line (FEOL) and back end of line (BEOL) cleaning applications such as high-k/metal gate post-etch cleaning and pore sealing, high-dose implant stripping and cleaning, and germanium, and silicon passivation Formulation development practices, methodology and a new directions are presented including chemicals used for preventing corrosion of copper lines, cleaning aluminium lines, reclaiming wafers, and water bonding, as well as the filtering and recirculating of chemicals including reuse and recycling Wetting, cleaning, and drying of features, such as high aspect ratio features and hydrophilic surface states, especially how to dry without watermarks, the abilities to wet hydrophobic surfaces and to remove liquid from deep features The chemical reactions and mechanisms of silicon dioxide etching with hydrofluoric acid, particle removal with ammonium hydroxide/hydrogen peroxide mixture, and metal removal with hydrochloric acid The Handbook of Cleaning for Semiconductor Manufacturing: Fundamentals and Applications is a valuable resource for any engineer or manager associated with using or supplying cleaning and contamination free technologies for semiconductor manufacturing. Engineers working for semiconductor manufacturing, capital equipment, chemicals, or other industries that assures cleanliness of chemicals, material, and equipment in the manufacturing area will also find this handbook an indispensible reference.
