Download or read book Experimental and Computational Heat Transfer Analysis of Micro Channel Heat Sink with Different Manifold Arrangements written by Independently Published and published by . This book was released on 2018-09-14 with total page 69 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heat sink is an object, system or an environment that absorbs or dissipates heat from anotherusing direct or radiant thermal contact. Heat sink is object that enhances heat dissipation fromcomponent to a cooler ambient. The primary purpose of a heat sink is to maintain the temperatureof the device being cooled within acceptable limits as specified by the component manufacturer.Heat sinks are normally made up of copper or aluminum and is in directly contact with microchipson a circuit board.This advancement leads to the development of miniaturized systems, which further leads tovarious applications, as in the field of medical science, electronic and bioengineering. These typesof systems often contain small scale fluid channels embedded in the surrounding solids withheating sourcesStudy have been done on the different shapes of manifolds through the project. In this workdifferent watts (50, 75, 100 and 125 W) are used with Reynolds number ranging from 342 to857.Due to the instability of flow at the entrance and exit regions of the micro channels, it is thebasic needs to come up with an efficient design of inlet and outlet manifold shapes and with anefficient design of micro-channels.The overall performance of micro channel heat sink (MCHS) as a system is affected by the inletand outlet manifold arrangements in addition to array of micro channel. In the present study theexperimental analysis is performed w.r.t the heat transfer coefficient, pressure drop and Nusseltnumber for three different manifold arrangements. In the experiment deionized water is made toflow through the inlet manifolds to the array of micro channels and exit is through outletmanifolds. In the present work three different arrangements: Rectangular (R), Rectangle withsemi-circular (RSC) and Divergent Convergent (DC) of the inlet and outlet manifolds areselected. Within the Reynolds number range 342-857 DC type manifold has highest heat transfercoefficient of about 24%-32% in comparison to Rectangle (R) type manifold while Rectanglewith semi-circle (RSC) shows an enhancement of about 7% to 10% as compare to Rectangular(R).
Download or read book Fouling of Heat Exchangers written by T.R. Bott and published by Elsevier. This book was released on 1995-04-13 with total page 547 pages. Available in PDF, EPUB and Kindle. Book excerpt: This unique and comprehensive text considers all aspects of heat exchanger fouling from the basic science of how surfaces become fouled to very practical ways of mitigating the problem and from mathematical modelling of different fouling mechanisms to practical methods of heat exchanger cleaning. The problems that restrict the efficient operation of equipment are described and the costs, some of them hidden costs, that are associated with the fouling of heat exchangers are discussed. Some simple concepts and models of the fouling processes are presented as part of the introduction to the subject.Advice on the selection, design, installation and commissioning of heat exchangers to minimise fouling is given. A large part of the text is devoted to the use of chemical and other additives to reduce or eliminate the problem of fouling. Another large section is designed to give information on both on-line and off-line cleaning of heat exchangers. One of the difficulties faced by designers and operators of heat exchangers is anticipating the likely extent of fouling problems to be encountered with different flow streams. Another large section addresses the question and describes methods that have been used in attempting to define fouling potential. The book concludes with a chapter on how fouling information can be obtained using plant data, field tests and laboratory studies.
Download or read book Two phase Flow and Heat Transfer written by David Butterworth and published by . This book was released on 1979 with total page 514 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Heat Transfer and Fluid Flow in Minichannels and Microchannels written by Satish Kandlikar and published by Elsevier. This book was released on 2006 with total page 492 pages. Available in PDF, EPUB and Kindle. Book excerpt: &Quot;This book explores flow through passages with hydraulic diameters from about 1 [mu]m to 3 mm, covering the range of minichannels and microchannels. Design equations along with solved examples and practice problems are also included to serve the needs of practicing engineers and students in a graduate course."--BOOK JACKET.
- Author : Mohsen Sheikholeslami
- Publisher : Elsevier
- Release : 2018-09-14
- ISBN : 0128141530
- Pages : 782 pages
Application of Control Volume Based Finite Element Method CVFEM for Nanofluid Flow and Heat Transfer
Download or read book Application of Control Volume Based Finite Element Method CVFEM for Nanofluid Flow and Heat Transfer written by Mohsen Sheikholeslami and published by Elsevier. This book was released on 2018-09-14 with total page 782 pages. Available in PDF, EPUB and Kindle. Book excerpt: Application of Control Volume Based Finite Element Method (CVFEM) for Nanofluid Flow and Heat Transfer discusses this powerful numerical method that uses the advantages of both finite volume and finite element methods for the simulation of multi-physics problems in complex geometries, along with its applications in heat transfer and nanofluid flow. The book applies these methods to solve various applications of nanofluid in heat transfer enhancement. Topics covered include magnetohydrodynamic flow, electrohydrodynamic flow and heat transfer, melting heat transfer, and nanofluid flow in porous media, all of which are demonstrated with case studies. This is an important research reference that will help readers understand the principles and applications of this novel method for the analysis of nanofluid behavior in a range of external forces. - Explains governing equations for nanofluid as working fluid - Includes several CVFEM codes for use in nanofluid flow analysis - Shows how external forces such as electric fields and magnetic field effects nanofluid flow
Download or read book Next Generation Microchannel Heat Exchangers written by Michael Ohadi and published by Springer Science & Business Media. This book was released on 2012-10-16 with total page 124 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Next Generation Microchannel Heat Exchangers, the authors’ focus on the new generation highly efficient heat exchangers and presentation of novel data and technical expertise not available in the open literature. Next generation micro channels offer record high heat transfer coefficients with pressure drops much less than conventional micro channel heat exchangers. These inherent features promise fast penetration into many mew markets, including high heat flux cooling of electronics, waste heat recovery and energy efficiency enhancement applications, alternative energy systems, as well as applications in mass exchangers and chemical reactor systems. The combination of up to the minute research findings and technical know-how make this book very timely as the search for high performance heat and mass exchangers that can cut costs in materials consumption intensifies.
Download or read book Integrated Interconnect Technologies for 3D Nanoelectronic Systems written by Muhannad S. Bakir and published by Artech House. This book was released on 2008-11-30 with total page 551 pages. Available in PDF, EPUB and Kindle. Book excerpt: This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.
Download or read book Laminar Flow Forced Convection in Ducts written by R. K. Shah and published by Academic Press. This book was released on 2014-06-28 with total page 492 pages. Available in PDF, EPUB and Kindle. Book excerpt: Laminar Flow Forced Convection in Ducts is a sourcebook for compact heat exchanger analytical data. This book describes the analytical solutions for laminar fluid flow and forced convection heat transfer in circular and noncircular pipes, including applicable differential equations and boundary conditions involving velocity and temperature problems of fluid flow. The book also discusses fluid flow—how much power is required to pump fluids through the heat exchanger, as well as the heat transfer—the determination of q" distribution, and the temperature of fluid and walls. The text also analyzes the coolant or heat transfer fluid flows in a nuclear power reactor composed of a bundle of circular section fuel rods located inside a round tube. R.A. Axford addresses fluid flow and heat transfers results for the rod bundle geometry in "Heat Transfer in Rod Bundles." The book also provides an overview and guidelines that can be used for the designer and the applied mathematician. This book is suitable for engineers working in electronics, aerospace, instrumentation, and biomechanics that use cooling or heating exchanges or solar collection systems.
Download or read book Heat Transfer in Aerospace Applications written by Bengt Sundén and published by Academic Press. This book was released on 2016-10-19 with total page 274 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heat Transfer in Aerospace Applications is the first book to provide an overall description of various heat transfer issues of relevance for aerospace applications. The book contains chapters relating to convection cooling, heat pipes, ablation, heat transfer at high velocity, low pressure and microgravity, aircraft heat exchangers, fuel cells, and cryogenic cooling systems. Chapters specific to low density heat transfer (4) and microgravity heat transfer (9) are newer subjects which have not been previously covered. The book takes a basic engineering approach by including correlations and examples that an engineer needs during the initial phases of vehicle design or to quickly analyze and solve a specific problem. Designed for mechanical, chemical, and aerospace engineers in research institutes, companies, and consulting firms, this book is an invaluable resource for the latest on aerospace heat transfer engineering and research. - Provides an overall description of heat transfer issues of relevance for aerospace applications - Discusses why thermal problems arise and introduces the various heat transfer modes - Helps solve the problem of selecting and calculating the cooling system, the heat exchanger, and heat protection - Features a collection of problems in which the methods presented in the book can be used to solve these problems
Download or read book Advances in Applied Mechanical Engineering written by Hari Kumar Voruganti and published by Springer Nature. This book was released on 2020-02-01 with total page 1161 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents select peer reviewed proceedings of the International Conference on Applied Mechanical Engineering Research (ICAMER 2019). The books examines various areas of mechanical engineering namely design, thermal, materials, manufacturing and industrial engineering covering topics like FEA, optimization, vibrations, condition monitoring, tribology, CFD, IC engines, turbo-machines, automobiles, manufacturing processes, machining, CAM, additive manufacturing, modelling and simulation of manufacturing processing, optimization of manufacturing processing, supply chain management, and operations management. In addition, recent studies on composite materials, materials characterization, fracture and fatigue, advanced materials, energy storage, green building, phase change materials and structural change monitoring are also covered. Given the contents, this book will be useful for students, researchers and professionals working in mechanical engineering and allied fields.
Download or read book Oscillating Heat Pipes written by Hongbin Ma and published by Springer. This book was released on 2015-05-22 with total page 441 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the fundamental fluid flow and heat transfer principles occurring in oscillating heat pipes and also provides updated developments and recent innovations in research and applications of heat pipes. Starting with fundamental presentation of heat pipes, the focus is on oscillating motions and its heat transfer enhancement in a two-phase heat transfer system. The book covers thermodynamic analysis, interfacial phenomenon, thin film evaporation, theoretical models of oscillating motion and heat transfer of single phase and two-phase flows, primary factors affecting oscillating motions and heat transfer, neutron imaging study of oscillating motions in an oscillating heat pipes, and nanofluid’s effect on the heat transfer performance in oscillating heat pipes. The importance of thermally-excited oscillating motion combined with phase change heat transfer to a wide variety of applications is emphasized. This book is an essential resource and learning tool for senior undergraduate, graduate students, practicing engineers, researchers, and scientists working in the area of heat pipes. This book also · Includes detailed descriptions on how an oscillating heat pipe is fabricated, tested, and utilized · Covers fundamentals of oscillating flow and heat transfer in an oscillating heat pipe · Provides general presentation of conventional heat pipes
Download or read book Translational Research in Cardio Oncology An Issue of Heart Failure Clinics written by Ragavendra R. Baliga and published by Elsevier Health Sciences. This book was released on 2022-06-23 with total page 217 pages. Available in PDF, EPUB and Kindle. Book excerpt: In this issue of Heart Failure Clinics, guest editors Drs. Ragavendra R Baliga and George A. Mensah bring their considerable expertise to the topic of Translational Research in Cardio-Oncology. Top experts in the field cover key topics such as radiation-induced cardiac dysfunction; training and career development; cardiovascular imaging; CAR-T cell therapy and cardiovascular disease; and more. - Contains 12 relevant, practice-oriented topics including cardio-protection of high-risk individuals; myocardial metabolism; amyloidosis; arrhythmic complications associated with cancer therapies; and more. - Provides in-depth clinical reviews on translational research in cardio-oncology, offering actionable insights for clinical practice. - Presents the latest information on this timely, focused topic under the leadership of experienced editors in the field. Authors synthesize and distill the latest research and practice guidelines to create clinically significant, topic-based reviews.
Download or read book Liquid Cooling of Electronic Devices by Single Phase Convection written by Frank P. Incropera and published by Wiley-Interscience. This book was released on 1999-05-31 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Liquid Cooling of Electronic Devices by Single-Phase Convection offers the first comprehensive and in-depth coverage of liquid convection as it applies to state-of-the-art thermal management systems. In this book, Dr. Incropera culls ten years of research results, clarifies the physical mechanisms associated with single-phase convection in the context of electronic cooling, and provides working engineers with a solid foundation for the design and development of rational liquid cooling systems. For those involved in designing these products - mechanical and electrical engineers, electronic packaging engineers, technical staff, and others - this book provides an invaluable road map to meet the challenge.
Download or read book Entropy Generation Minimization written by Adrian Bejan and published by CRC Press. This book was released on 2013-10-29 with total page 389 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the diverse and rapidly expanding field of Entropy Generation Minimization (EGM), the method of thermodynamic optimization of real devices. The underlying principles of the EGM method - also referred to as "thermodynamic optimization," "thermodynamic design," and "finite time thermodynamics" - are thoroughly discussed, and the me
Download or read book Engineering Thermofluids written by Mahmoud Massoud and published by Springer Science & Business Media. This book was released on 2005-09-16 with total page 1132 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thermofluids, while a relatively modern term, is applied to the well-established field of thermal sciences, which is comprised of various intertwined disciplines. Thus mass, momentum, and heat transfer constitute the fundamentals of th- mofluids. This book discusses thermofluids in the context of thermodynamics, single- and two-phase flow, as well as heat transfer associated with single- and two-phase flows. Traditionally, the field of thermal sciences is taught in univer- ties by requiring students to study engineering thermodynamics, fluid mechanics, and heat transfer, in that order. In graduate school, these topics are discussed at more advanced levels. In recent years, however, there have been attempts to in- grate these topics through a unified approach. This approach makes sense as thermal design of widely varied systems ranging from hair dryers to semicond- tor chips to jet engines to nuclear power plants is based on the conservation eq- tions of mass, momentum, angular momentum, energy, and the second law of thermodynamics. While integrating these topics has recently gained popularity, it is hardly a new approach. For example, Bird, Stewart, and Lightfoot in Transport Phenomena, Rohsenow and Choi in Heat, Mass, and Momentum Transfer, El- Wakil, in Nuclear Heat Transport, and Todreas and Kazimi in Nuclear Systems have pursued a similar approach. These books, however, have been designed for advanced graduate level courses. More recently, undergraduate books using an - tegral approach are appearing.
Download or read book Handbook of Heat Transfer written by Warren M. Rohsenow and published by McGraw-Hill Companies. This book was released on 1973 with total page 1552 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Thermal Design of Electronic Equipment written by Ralph Remsburg and published by CRC Press. This book was released on 2017-12-19 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt: In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.