Download or read book Chemical Mechanical Planarization IV written by R. L. Opila and published by The Electrochemical Society. This book was released on 2001 with total page 350 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Advances in Chemical Mechanical Planarization CMP written by Babu Suryadevara and published by Woodhead Publishing. This book was released on 2021-09-10 with total page 650 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. - Reviews the most relevant techniques and processes for CMP of dielectric and metal films - Includes chapters devoted to CMP for current and emerging materials - Addresses consumables and process control for improved CMP, including post-CMP

Download or read book Particulate Systems in Nano and Biotechnologies written by Wolfgang Sigmund and published by CRC Press. This book was released on 2008-12-22 with total page 334 pages. Available in PDF, EPUB and Kindle. Book excerpt: Despite the widespread growth and acceptance of particulate technology, challenges in the design, operation, and manufacturing of these systems still exists. These critical issues must be resolved so that particle technology may continue to serve as a foundation for new nano and biotechnologies. Particulate Systems in Nano- and Biotechnologies pres

Download or read book Chemical Mechanical Planarization Volume 867 written by A. Kumar and published by . This book was released on 2005-07-19 with total page 330 pages. Available in PDF, EPUB and Kindle. Book excerpt: Technology requirements associated with the progressive scaling of devices for future technology nodes, coupled with the aggressive introduction of new materials, places tremendous demands on chemical-mechanical polishing. The goal of this 2005 book, which is part of a popular series from MRS, is to bring together experts from a broad spectrum of research and technology groups currently working on CMP, to review advances made, and to offer a comprehensive discussion of future challenges that must be overcome. The book shows trends in the development of consumables, process modules, tool designs, process integration, modeling, defect characterization, and metrology. Topics include: planarization processes and applications; consumables -CMP pads and slurries; CMP equipment and metrology; and CMP modeling and simulation.

Download or read book Dynamics of Charged Particulate Systems written by Tarek I. Zohdi and published by Springer Science & Business Media. This book was released on 2012-04-05 with total page 124 pages. Available in PDF, EPUB and Kindle. Book excerpt: The objective of this monograph is to provide a concise introduction to the dynamics of systems comprised of charged small-scale particles. Flowing, small-scale, particles ("particulates'') are ubiquitous in industrial processes and in the natural sciences. Applications include electrostatic copiers, inkjet printers, powder coating machines, etc., and a variety of manufacturing processes. Due to their small-scale size, external electromagnetic fields can be utilized to manipulate and control charged particulates in industrial processes in order to achieve results that are not possible by purely mechanical means alone. A unique feature of small-scale particulate flows is that they exhibit a strong sensitivity to interparticle near-field forces, leading to nonstandard particulate dynamics, agglomeration and cluster formation, which can strongly affect manufactured product quality. This monograph also provides an introduction to the mathematically-related topic of the dynamics of swarms of interacting objects, which has gained the attention of a number of scientific communities. In summary, the following topics are discussed in detail: (1) Dynamics of an individual charged particle, (2) Dynamics of rigid clusters of charged particles, (3) Dynamics of flowing charged particles, (4) Dynamics of charged particle impact with electrified surfaces and (5) An introduction to the mechanistic modeling of swarms. The text can be viewed as a research monograph suitable for use in an upper division undergraduate or first year graduate course geared towards students in the applied sciences, mechanics and mathematics that have an interest in the analysis of particulate materials.

Download or read book Advances in CMP Polishing Technologies written by Toshiro Doi and published by William Andrew. This book was released on 2011-12-06 with total page 330 pages. Available in PDF, EPUB and Kindle. Book excerpt: CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan

Download or read book Nanoparticle Engineering for Chemical Mechanical Planarization written by Ungyu Paik and published by CRC Press. This book was released on 2019-04-15 with total page 211 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the development of next-generation nanoscale devices, higher speed and lower power operation is the name of the game. Increasing reliance on mobile computers, mobile phone, and other electronic devices demands a greater degree of speed and power. As chemical mechanical planarization (CMP) progressively becomes perceived less as black art and more as a cutting-edge technology, it is emerging as the technology for achieving higher performance devices. Nanoparticle Engineering for Chemical-Mechanical Planarization explains the physicochemical properties of nanoparticles according to each step in the CMP process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP, and noble metal CMP. The authors provide a detailed guide to nanoparticle engineering of novel CMP slurry for next-generation nanoscale devices below the 60nm design rule. They present design techniques using polymeric additives to improve CMP performance. The final chapter focuses on novel CMP slurry for the application to memory devices beyond 50nm technology. Most books published on CMP focus on the polishing process, equipment, and cleaning. Even though some of these books may touch on CMP slurries, the methods they cover are confined to conventional slurries and none cover them with the detail required for the development of next-generation devices. With its coverage of fundamental concepts and novel technologies, this book delivers expert insight into CMP for all current and next-generation systems.

Download or read book Meeting Abstracts written by Electrochemical Society. Meeting and published by . This book was released on 1999 with total page 1220 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Chemical Mechanical Planarization VI written by Sudipta Seal and published by The Electrochemical Society. This book was released on 2003 with total page 370 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Kona written by and published by . This book was released on 2008 with total page 296 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Chemical Mechanical Planarization of Microelectronic Materials written by Joseph M. Steigerwald and published by John Wiley & Sons. This book was released on 2008-09-26 with total page 337 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann-all leading CMP pioneers-provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers. The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry. An indispensable resource for scientists and engineers working in the microelectronics industry Chemical Mechanical Planarization of Microelectronic Materials is the only comprehensive single-source reference to one of the fastest growing integrated circuit manufacturing technologies. It provides engineers and scientists who work in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP, including: * The history of CMP * Chemical and mechanical underpinnings of CMP * CMP materials and processes * Applications of CMP in the microelectronics industry * The CMP of tungsten, aluminum, copper, polysilicon, and various dielectrics, including polymers used in integrated circuit fabrication * Post-CMP cleaning techniques * Chapter-end problem sets are also included to assist readers in developing a practical understanding of CMP.

Download or read book Coulson and Richardson s Chemical Engineering written by R. P. Chhabra and published by Butterworth-Heinemann. This book was released on 2019-04-12 with total page 872 pages. Available in PDF, EPUB and Kindle. Book excerpt: Coulson and Richardson's Chemical Engineering: Volume 2A: Particulate Systems and Particle Technology, Sixth Edition, has been fully revised and updated to provide practitioners with an overview of chemical engineering, including clear explanations of theory and thorough coverage of practical applications, all supported by case studies. A worldwide team of contributors has pooled their experience to revise old content and add new content. The content has been updated to be more useful to practicing engineers. This complete reference to chemical engineering will support you throughout your career, as it covers every key chemical engineering topic. Fluid Flow, Heat Transfer and Mass Transfer has been developed from the series' volume 1, 6th edition. This volume covers the three main transport process of interest to chemical engineers: momentum transfer (fluid flow), heat transfer and mass transfer and the relationships between them. Particulate Systems and Particle Technology has been developed from the series' volume 2, 5th edition. This volume covers the properties of particulate systems, including the character of individual particles and their behavior in fluids. Sedimentation of particles, both singly and at high concentrations, flow in packed and fluidized beads and filtration are then examined. Separation Processes has been developed from the series' volume 2, 5th edition. This volume covers distillation and gas absorption, which illustrate applications of the fundamental principles of mass transfer. Several techniques-adsorption, ion exchange, chromatographic and membrane separations, and process intensification-are described. Chemical and Biochemical Reactors and Reaction Engineering has been developed from the series' volume 3, 3rd edition.

Download or read book Issues in Specialized Chemical and Chemistry Topics 2011 Edition written by and published by ScholarlyEditions. This book was released on 2012-01-09 with total page 1316 pages. Available in PDF, EPUB and Kindle. Book excerpt: Issues in Specialized Chemical and Chemistry Topics: 2011 Edition is a ScholarlyEditions™ eBook that delivers timely, authoritative, and comprehensive information about Specialized Chemical and Chemistry Topics. The editors have built Issues in Specialized Chemical and Chemistry Topics: 2011 Edition on the vast information databases of ScholarlyNews.™ You can expect the information about Specialized Chemical and Chemistry Topics in this eBook to be deeper than what you can access anywhere else, as well as consistently reliable, authoritative, informed, and relevant. The content of Issues in Specialized Chemical and Chemistry Topics: 2011 Edition has been produced by the world’s leading scientists, engineers, analysts, research institutions, and companies. All of the content is from peer-reviewed sources, and all of it is written, assembled, and edited by the editors at ScholarlyEditions™ and available exclusively from us. You now have a source you can cite with authority, confidence, and credibility. More information is available at http://www.ScholarlyEditions.com/.

Download or read book Chemical Mechanical Polishing 10 written by G. Banerjee and published by The Electrochemical Society. This book was released on 2009-05 with total page 145 pages. Available in PDF, EPUB and Kindle. Book excerpt: The papers included in this issue of ECS Transactions were originally presented in the symposium ¿Chemical Mechanical Polishing 10¿, held during the 215th meeting of The Electrochemical Society, in San Francisco, California from May 24 to 29, 2009.

Download or read book Environmental Engineering Dictionary and Directory written by Thomas M. Pankratz and published by CRC Press. This book was released on 2000-09-22 with total page 340 pages. Available in PDF, EPUB and Kindle. Book excerpt: Like most technical disciplines, environmental science and engineering is becoming increasingly specialized. As industry professionals focus on specific environmental subjects they become less familiar with environmental problems and solutions outside their area of expertise. This situation is compounded by the fact that many environmental science

Download or read book Special Edition Environmental Engineering Dictionary and Directory written by Thomas M. Pankratz and published by CRC Press. This book was released on 2000-09-22 with total page 339 pages. Available in PDF, EPUB and Kindle. Book excerpt: Like most technical disciplines, environmental science and engineering is becoming increasingly specialized. As industry professionals focus on specific environmental subjects they become less familiar with environmental problems and solutions outside their area of expertise. This situation is compounded by the fact that many environmental science

Download or read book Characterization of Nanomaterials in Complex Environmental and Biological Media written by and published by Elsevier. This book was released on 2015-06-01 with total page 321 pages. Available in PDF, EPUB and Kindle. Book excerpt: Characterization of Nanomaterials in Complex Environmental and Biological Media covers the novel properties of nanomaterials and their applications to consumer products and industrial processes. The book fills the growing gap in this challenging area, bringing together disparate strands in chemistry, physics, biology, and other relevant disciplines. It provides an overview on nanotechnology, nanomaterials, nano(eco)toxicology, and nanomaterial characterization, focusing on the characterization of a range of nanomaterial physicochemical properties of relevance to environmental and toxicological studies and their available analytical techniques. Readers will find a multidisciplinary approach that provides highly skilled scientists, engineers, and technicians with the tools they need to understand and interpret complicated sets of data obtained through sophisticated analytical techniques. - Addresses the requirements, challenges, and solutions for nanomaterial characterization in environmentally complex media - Focuses on technique limitations, appropriate data collection, data interpretation, and analysis - Aids in understanding and comparing nanomaterial characterization data reported in the literature using different analytical tools - Includes case studies of characterization relevant complex media to enhance understanding