Download or read book Electronics Manufacturing Processes written by Thomas L. Landers and published by Pearson Education. This book was released on 1994 with total page 584 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume provides a comprehensive introduction to electronic technology, products, and manufacturing processes.Reviews principles of production and electronics fundamentals (electronic components, interconnections, printed wiring boards, soldering and solderability); explains automatic assembly (automation, leaded component insertion, and surface-mount device placement); discusses life-cycle engineering (design for assembly, quality and reliability, testability, and environmental stress screening); and explores manufacturing systems (facilities and materials handling, production and inventory control, production economics).For electrical or industrial engineers interested in electronics manufacturing.

Download or read book Electronics Process Technology written by Wilfried Sauer and published by Springer Science & Business Media. This book was released on 2007-04-21 with total page 493 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a systemized presentation of new techniques and methods in electronics manufacture. It helps the reader reduce the cost and increase the reliability of electronic products by employing up-to-date technology. It also details the latest ideas for reducing the scale of electronic components and products to the nano-scale by organizing all the elements of the complicated modern electronics manufacturing process showing how they affect each other.

Download or read book Handbook of Electronics Manufacturing Engineering written by Bernie Matisoff and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 691 pages. Available in PDF, EPUB and Kindle. Book excerpt: This single source reference offers a pragmatic and accessible approach to the basic methods and procedures used in the manufacturing and design of modern electronic products. Providing a stategic yet simplified layout, this handbook is set up with an eye toward maximizing productivity in each phase of the eletronics manufacturing process. Not only does this handbook inform the reader on vital issues concerning electronics manufacturing and design, it also provides practical insight and will be of essential use to manufacturing and process engineers in electronics and aerospace manufacturing. In addition, electronics packaging engineers and electronics manufacturing managers and supervisors will gain a wealth of knowledge.

Download or read book Design for Excellence in Electronics Manufacturing written by Cheryl Tulkoff and published by John Wiley & Sons. This book was released on 2021-03-22 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: An authoritative guide to optimizing design for manufacturability and reliability from a team of experts Design for Excellence in Electronics Manufacturing is a comprehensive, state-of-the-art book that covers design and reliability of electronics. The authors—noted experts on the topic—explain how using the DfX concepts of design for reliability, design for manufacturability, design for environment, design for testability, and more, reduce research and development costs and decrease time to market and allow companies to confidently issue warranty coverage. By employing the concepts outlined in Design for Excellence in Electronics Manufacturing, engineers and managers can increase customer satisfaction, market share, and long-term profits. In addition, the authors describe the best practices regarding product design and show how the practices can be adapted for different manufacturing processes, suppliers, use environments, and reliability expectations. This important book: Contains a comprehensive review of the design and reliability of electronics Covers a range of topics: establishing a reliability program, design for the use environment, design for manufacturability, and more Includes technical information on electronic packaging, discrete components, and assembly processes Shows how aspects of electronics can fail under different environmental stresses Written for reliability engineers, electronics engineers, design engineers, component engineers, and others, Design for Excellence in Electronics Manufacturing is a comprehensive book that reveals how to get product design right the first time.

Download or read book Modern Solder Technology for Competitive Electronics Manufacturing written by Jennie S. Hwang and published by McGraw Hill Professional. This book was released on 1996 with total page 678 pages. Available in PDF, EPUB and Kindle. Book excerpt: Introduction Advanced Surface Mount Technology and Die Attach Techniques Solder Material Soldering Chemistry Solderability Microstructure of Solders Aqueous-Cleaning Manufacture No-Clean Manufacture Protective and Reactive Atmosphere Soldering Surface Mount Fine Pitch Technology Surface Mount-BGA/PAC Technology Soldering Methodology and Equipment Soldering and Soldering Related Issues Strengthened Solders Lead-Free Solders Solder Joint Failure Mode Solder Joint Failure Assessment-Case Studies Solder Joint Quality and Reliability New and Emerging Specifications and Standards Future Trends.

Download or read book Handbook Of Electronics Packaging Design and Engineering written by Bernard S. Matisoff and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 582 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Handbook of Electronics Packaging Design and Engineering has been writ ten as a reference source for use in the packaging design of electronics equip ment. It is designed to provide a single convenient source for the solution of re curring design problems. The primary consideration of any design is that the end product meet or exceed the applicable product specifications. The judicious use of uniform design practices will realize the following economies and equipment improvements: • Economics of design. Uniform design practices will result in less engineering and design times and lower costs. They will also reduce the number of changes that may be required due to poor reliability, maintainability, or producibility. • Improved design. Better designs with increased reliability, maintainability, and producibility will result from the use of uniform design practices. • Production economies. Uniform designs employing standard available tools, materials, and parts will result in the cost control of manufacturing. The Handbook is intended primarily for the serious student of electronics packaging and for those engineers and designers actively engaged in this vital and interesting profession. It attempts to present electronics packaging as it is today. It can be used as a training text for instructional purposes and as a reference source for the practicing designer and engineer.

Download or read book Manufacturing Technology in the Electronics Industry written by P. Edwards and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 296 pages. Available in PDF, EPUB and Kindle. Book excerpt: The sequence of events which led to the writing of this book started at a seminar on Manufacturing Technology in the Electronics Industry given by the Institution of Production Engineers in 1987. The seminar identified that the field of manufacturing engineering for the electronics industry was effectively missing from the vast majority of production engineering degree courses. The reason for this was that production engineering departments typically spring from mechanical engineering departments. This leads to a mechanical bias in the practical aspects of such courses. The consequence of this was that electronics companies could not recruit graduates with both relevant production engineering and electronic engineering backgrounds. This necessitated either recruiting production engineering graduates and giving them the necessary electronic engineering training, or giving production engineering training to electronic engineering graduates. A consequence of the lack of courses in a subject is that there is also a lack of relevant textbooks in the area, as most textbooks are intended to tie into courses. In the field of manufacturing technology for the electronics industry, existing textbooks tend to be highly specialized and mainly concerned with the fabrication of semiconductor devices.

Download or read book Electronics Process Technology written by Wilfried Sauer and published by Springer. This book was released on 2009-10-12 with total page 482 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a systemized presentation of new techniques and methods in electronics manufacture. It helps the reader reduce the cost and increase the reliability of electronic products by employing up-to-date technology. It also details the latest ideas for reducing the scale of electronic components and products to the nano-scale by organizing all the elements of the complicated modern electronics manufacturing process showing how they affect each other.

Download or read book Manufacturing Challenges in Electronic Packaging written by Y.C. Lee and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 270 pages. Available in PDF, EPUB and Kindle. Book excerpt: About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging.

Download or read book Computer Integrated Electronics Manufacturing and Testing written by Arabian and published by CRC Press. This book was released on 1989-09-01 with total page 620 pages. Available in PDF, EPUB and Kindle. Book excerpt: Describes this process at it relates to the electronics industry, focusing on such areas as printed wiring boards, networking, automatic assembly, surface mount technology, tape automated bonding, bar coding, and electro-static discharge. Also studies the effects of group work ethics as a factor in

Download or read book Six Sigma for Electronics Design and Manufacturing written by Sammy G. Shina and published by McGraw Hill Professional. This book was released on 2002-04-22 with total page 394 pages. Available in PDF, EPUB and Kindle. Book excerpt: * Covers the nuts, bolts, and statistics of implementing Six Sigma in electronics manufacturing--includes case studies and detailed calculations

Download or read book Hybrid Nanomaterials written by Rafael Vargas-Bernal and published by BoD – Books on Demand. This book was released on 2020-06-10 with total page 150 pages. Available in PDF, EPUB and Kindle. Book excerpt: Two of the hottest research topics today are hybrid nanomaterials and flexible electronics. As such, this book covers both topics with chapters written by experts from across the globe. Chapters address hybrid nanomaterials, electronic transport in black phosphorus, three-dimensional nanocarbon hybrids, hybrid ion exchangers, pressure-sensitive adhesives for flexible electronics, simulation and modeling of transistors, smart manufacturing technologies, and inorganic semiconductors.

Download or read book Advanced Manufacturing process lead free interconnect materials and reliability modeling for electronics packaging written by and published by Emerald Group Publishing. This book was released on 2006 with total page 72 pages. Available in PDF, EPUB and Kindle. Book excerpt: This issue of Soldering & Surface Mount Technology (SSMT) presents a number of papers from the 7th High Density Microsystems Design, Packaging and Failure Analysis (HDP'05) conference held in 2005 in the dynamic city of Shanghai, China. With over 100 high quality technical papers and presentation this annual conference brings together scholars and industrialists from Asia, Europe and the Americas to discuss the challenges and latest advances in high density packaging. This e-book contains six papers from the HDP conference, plus one additional contribution, which discuss the behaviour of key i.

Download or read book Computer Vision for Electronics Manufacturing written by L.F Pau and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 324 pages. Available in PDF, EPUB and Kindle. Book excerpt: DEFECT PROPORTION OF DETECTION INITIAL RATE DETECTION RATE INSPECTOR 3 COMPLEXITY OF TIMES PAN OF PERFORMING o~ ________________________ o~ ______________________ __ -;. INSPECTION TASK -;. VISUAL INSPECTION Fagure 1. Trends in relations between the complexity of inspection tasks, defect detection rates (absolute and relative), and inspection time. Irrespective of the necessities described above, and with the excep tion of specific generic application systems (e.g., bare-board PCB inspection, wafer inspection, solder joint inspection, linewidth measure ment), vision systems are still not found frequently in today's electronics factories. Besides cost, some major reasons for this absence are: 1. The detection robustness or accuracy is still insufficient. 2. The total inspection time is often too high, although this can frequently be attributed to mechanical handling or sensing. 3. There are persistent gaps among process engineers, CAD en gineers, manufacturing engineers, test specialists, and computer vision specialists, as problems dominate the day-to-day interac tions and prevent the establishment of trust. 4. Computer vision specialists sometimes still believe that their contributions are universal, so that adaptation to each real problem becomes tedious, or stumbles over the insufficient availabIlity of multidisciplinary expertise. Whether we like it or not, we must still use appropriate sensors, lighting, and combina tions of algorithms for each class of applications; likewise, we cannot design mechanical handling, illumination, and sensing in isolation from each other.

Download or read book Industrial Environmental Performance Metrics written by National Academy of Engineering and National Research Council and published by National Academies Press. This book was released on 1999-08-24 with total page 264 pages. Available in PDF, EPUB and Kindle. Book excerpt: Industrial Environmental Performance Metrics is a corporate-focused analysis that brings clarity and practicality to the complex issues of environmental metrics in industry. The book examines the metrics implications to businesses as their responsibilities expand beyond the factory gateâ€"upstream to suppliers and downstream to products and services. It examines implications that arise from greater demand for comparability of metrics among businesses by the investment community and environmental interest groups. The controversy over what sustainable development means for businesses is also addressed. Industrial Environmental Performance Metrics identifies the most useful metrics based on case studies from four industriesâ€"automotive, chemical, electronics, and pulp and paperâ€"and includes specific corporate examples. It contains goals and recommendations for public and private sector players interested in encouraging the broader use of metrics to improve industrial environmental performance and those interested in addressing the tough issues of prioritization, weighting of metrics for meaningful comparability, and the longer term metrics needs presented by sustainable development.

Download or read book Fundamentals of Semiconductor Manufacturing and Process Control written by Gary S. May and published by John Wiley & Sons. This book was released on 2006-05-26 with total page 428 pages. Available in PDF, EPUB and Kindle. Book excerpt: A practical guide to semiconductor manufacturing from processcontrol to yield modeling and experimental design Fundamentals of Semiconductor Manufacturing and Process Controlcovers all issues involved in manufacturing microelectronic devicesand circuits, including fabrication sequences, process control,experimental design, process modeling, yield modeling, and CIM/CAMsystems. Readers are introduced to both the theory and practice ofall basic manufacturing concepts. Following an overview of manufacturing and technology, the textexplores process monitoring methods, including those that focus onproduct wafers and those that focus on the equipment used toproduce wafers. Next, the text sets forth some fundamentals ofstatistics and yield modeling, which set the foundation for adetailed discussion of how statistical process control is used toanalyze quality and improve yields. The discussion of statistical experimental design offers readers apowerful approach for systematically varying controllable processconditions and determining their impact on output parameters thatmeasure quality. The authors introduce process modeling concepts,including several advanced process control topics such asrun-by-run, supervisory control, and process and equipmentdiagnosis. Critical coverage includes the following: * Combines process control and semiconductor manufacturing * Unique treatment of system and software technology and managementof overall manufacturing systems * Chapters include case studies, sample problems, and suggestedexercises * Instructor support includes electronic copies of the figures andan instructor's manual Graduate-level students and industrial practitioners will benefitfrom the detailed exami?nation of how electronic materials andsupplies are converted into finished integrated circuits andelectronic products in a high-volume manufacturingenvironment. An Instructor's Manual presenting detailed solutions to all theproblems in the book is available from the Wiley editorialdepartment. An Instructor Support FTP site is also available.

Download or read book Unit Manufacturing Processes written by National Research Council and published by National Academies Press. This book was released on 1995-01-03 with total page 228 pages. Available in PDF, EPUB and Kindle. Book excerpt: Manufacturing, reduced to its simplest form, involves the sequencing of product forms through a number of different processes. Each individual step, known as an unit manufacturing process, can be viewed as the fundamental building block of a nation's manufacturing capability. A committee of the National Research Council has prepared a report to help define national priorities for research in unit processes. It contains an organizing framework for unit process families, criteria for determining the criticality of a process or manufacturing technology, examples of research opportunities, and a prioritized list of enabling technologies that can lead to the manufacture of products of superior quality at competitive costs. The study was performed under the sponsorship of the National Science Foundation and the Defense Department's Manufacturing Technology Program.