Download or read book Electronic Failure Analysis Handbook written by Perry L. Martin and published by McGraw-Hill Professional Publishing. This book was released on 1999 with total page 776 pages. Available in PDF, EPUB and Kindle. Book excerpt: Annotation "In the Electronic Failure Analysis Handbook, you'll find top-to-bottom coverage of this rapidly developing field, encompassing breakthrough techniques and technologies for both components and systems reliability testing, performance evaluation, and liability avoidance."--BOOK JACKET. Title Summary field provided by Blackwell North America, Inc. All Rights Reserved.
Download or read book Electronic Failure Analysis Handbook written by Perry Martin and published by . This book was released on 1999 with total page 766 pages. Available in PDF, EPUB and Kindle. Book excerpt: The definitive, all-in-one, cost-saving guide to electronic failure analysis--from the field's top experts Still digging for the latest developments and techniques in electronic failure analysis? The leading-edge methods for slashing product failure rates are all right here in this complete, comprehensive source. You'll find top-to-bottom coverage of this rapidly developing field, encompassing breakthrough techniques and technologies for both components and systems reliability testing, performance evaluation, and liability avoidance. Absolutely essential to anyone concerned with electronic product development and testing, the Handbook gives you ready-to-use, insider information on state-of-the-art EFA techniques; the how's and why's of electronic failures; failure prediction; warranty cost control; liability-costs and other issues.
Download or read book Electronic Failure Analysis Handbook written by and published by . This book was released on with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Handbook of Materials Failure Analysis written by Abdel Salam Hamdy Makhlouf and published by Butterworth-Heinemann. This book was released on 2019-10-22 with total page 388 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Materials Failure Analysis: With Case Studies from the Electronics Industries examines the reasons materials fail in certain situations, including material defects and mechanical failure as a result of various causes. The book begins with a general overview of materials failure analysis and its importance. It then proceeds to discussions on the types of failure analysis, specific tools and techniques, and an analysis of materials failure from various causes. As failure can occur for several reasons, including materials defects-related failure, materials design-related failure, or corrosion-related failures, the topics covered in this comprehensive source are an important tool for practitioners. - Provides the most up-to-date and balanced coverage of failure analysis, combining foundational knowledge and current research on the latest developments and innovations in the field - Offers an ideal accompaniment for those interested in materials forensic investigation, failure of materials, static failure analysis, dynamic failure analysis, and fatigue life prediction - Presents compelling new case studies from key industries to demonstrate concepts
Download or read book Handbook of Case Histories in Failure Analysis Volume 2 written by Khlefa Alarbe Esaklul and published by ASM International. This book was released on 1992-01-01 with total page 608 pages. Available in PDF, EPUB and Kindle. Book excerpt: Presents more than 120 expert failure analysis case histories from industries including automotive, aerospace, utilities, oil and gas, petrochemical, biomedical, ground transportation, off-highway vehicles, and more. Volume 2 builds on the tremendous acceptance of Volume 1 by the failure analysis community. The two volumes can also be purchased as a set for a special discounted price. Learn how others have investigated and solved failures in various industries involving a wide range of failure modes, materials, and analysis techniques.
Download or read book Failure Analysis written by Marius Bazu and published by John Wiley & Sons. This book was released on 2011-03-08 with total page 372 pages. Available in PDF, EPUB and Kindle. Book excerpt: Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.
Download or read book Reliability and Failure of Electronic Materials and Devices written by Milton Ohring and published by Academic Press. This book was released on 2014-10-14 with total page 759 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
Download or read book Failure Analysis of Integrated Circuits written by Lawrence C. Wagner and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 256 pages. Available in PDF, EPUB and Kindle. Book excerpt: This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.
Download or read book How to Organize and Run a Failure Investigation written by Daniel P. Dennies and published by ASM International. This book was released on 2005 with total page 228 pages. Available in PDF, EPUB and Kindle. Book excerpt: Learning the proper steps for organizing a failure investigation ensures success. Failure investigations cross company functional boundaries and are an integral component of any design or manufacturing business operation. Well-organized and professionally conducted investigations are essential for solving manufacturing problems and assisting in redesigns. This book outlines a proven systematic approach to failure investigation. It explains the relationship between various failure sources (corrosion, for example) and the organization and conduct of the investigation. It provides a learning platform for engineers from all disciplines: materials, design, manufacturing, quality, and management. The examples in this book focus on the definition of and requirements for a professionally performed failure analysis of a physical object or structure. However, many of the concepts have much greater utility than for investigating the failure of physical objects. For example, the book provides guidance in areas such as learning how to define objectives, negotiating the scope of investigation, examining the physical evidence, and applying general problem-solving techniques.
Download or read book Systems Failure Analysis written by Joseph Berk and published by ASM International. This book was released on 2009-01-01 with total page 209 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Failure Analysis of Engineering Structures written by V. Ramachandran and published by ASM International. This book was released on 2005 with total page 207 pages. Available in PDF, EPUB and Kindle. Book excerpt: Printbegrænsninger: Der kan printes 10 sider ad gangen og max. 40 sider pr. session
Download or read book Physics of Failure Based Handbook of Microelectronic Systems written by Shahrzad Salemi and published by RIAC. This book was released on 2008 with total page 271 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electronic Failure Analysis Handbook written by Perry L. Martin and published by McGraw Hill Professional. This book was released on 1999 with total page 770 pages. Available in PDF, EPUB and Kindle. Book excerpt: Annotation "In the Electronic Failure Analysis Handbook, you'll find top-to-bottom coverage of this rapidly developing field, encompassing breakthrough techniques and technologies for both components and systems reliability testing, performance evaluation, and liability avoidance."--BOOK JACKET. Title Summary field provided by Blackwell North America, Inc. All Rights Reserved.
Download or read book Failure Modes and Mechanisms in Electronic Packages written by P. Singh and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 391 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.
Download or read book Materials and Reliability Handbook for Semiconductor Optical and Electron Devices written by Osamu Ueda and published by Springer Science & Business Media. This book was released on 2012-09-24 with total page 618 pages. Available in PDF, EPUB and Kindle. Book excerpt: Materials and Reliability Handbook for Semiconductor Optical and Electron Devices provides comprehensive coverage of reliability procedures and approaches for electron and photonic devices. These include lasers and high speed electronics used in cell phones, satellites, data transmission systems and displays. Lifetime predictions for compound semiconductor devices are notoriously inaccurate due to the absence of standard protocols. Manufacturers have relied on extrapolation back to room temperature of accelerated testing at elevated temperature. This technique fails for scaled, high current density devices. Device failure is driven by electric field or current mechanisms or low activation energy processes that are masked by other mechanisms at high temperature. The Handbook addresses reliability engineering for III-V devices, including materials and electrical characterization, reliability testing, and electronic characterization. These are used to develop new simulation technologies for device operation and reliability, which allow accurate prediction of reliability as well as the design specifically for improved reliability. The Handbook emphasizes physical mechanisms rather than an electrical definition of reliability. Accelerated aging is useful only if the failure mechanism is known. The Handbook also focuses on voltage and current acceleration stress mechanisms.
Download or read book Failure Analysis of Heat Treated Steel Components written by Lauralice de Campos Franceschini Canale and published by ASM International. This book was released on 2008 with total page 651 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Characterization and Failure Analysis of Plastics written by ASM International and published by ASM International. This book was released on 2003-01-01 with total page 486 pages. Available in PDF, EPUB and Kindle. Book excerpt: The selection and application of engineered materials is an integrated process that requires an understanding of the interaction between materials properties, manufacturing characteristics, design considerations, and the total life cycle of the product. This reference book on engineering plastics provides practical and comprehensive coverage on how the performance of plastics is characterized during design, property testing, and failure analysis. The fundamental structure and properties of plastics are reviewed for general reference, and detailed articles describe the important design factors, properties, and failure mechanisms of plastics. The effects of composition, processing, and structure are detailed in articles on the physical, chemical, thermal, and mechanical properties. Other articles cover failure mechanisms such as: crazing and fracture; impact loading; fatigue failure; wear failures, moisture related failure; organic chemical related failure; photolytic degradation; and microbial degradation. Characterization of plastics in failure analysis is described with additional articles on analysis of structure, surface analysis, and fractography.
